CONNECT WITH US
NEWS TAGGED HPC
Monday 7 June 2021
Taiwan backend houses caught in cluster COVID infections
Taiwan's major dedicated IC testing house King Yuan Electronics (KYEC) has been ordered by the Central Epidemic Command Center (CECC) to have all its migrant workers undergo a 14-day...
Monday 7 June 2021
Samsung to see non-memory chip sales boom in 2021
Samsung Electronics is expected to see sales of its non-memory business particularly the system LSI segment boom this year, buoyed by strong demand for handset application processors,...
Thursday 3 June 2021
AT&S to set up ABF substrate production base in Southeast Asia
AT&S has disclosed plans to invest EUR1.7 billion (US$2.07 billion) to set up a new production base for ABF substrates in Southeast Asia to satisfy the needs of its major HPC...
Thursday 3 June 2021
TSMC stepping up advanced process capacity expansion
TSMC will be stepping up its advanced process capacity expansion through 2023, according to company CEO CC Wei.
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Friday 28 May 2021
ABF substrate suppliers see clear order visibility through 2023
Taiwan ABF substrate makers have been running their production lines at full capacity, with new orders unlikely to be fulfilled until 2023, according to industry sources.
Thursday 27 May 2021
IC test interface vendors keenly developing high-specs solutions for EV chips
IC test interfaces that can withstand high current of up to 1,000 A and high voltage of 1,200V will see a significant surge in demand for processing high-current driver ICs and other...
Wednesday 26 May 2021
Leveraging the latest AMD Milan CPU, AEWIN has built a high-performance edge computing platform
In the era of smart devices, the capabilities of traditional networking equipment are no longer sufficient as more diverse IT system functions become available. Therefore, virtualization...
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Tuesday 18 May 2021
Taiwan backend houses see brisk order visibility
Taiwan's backend houses have seen their order visibility stay brisk despite concerns over a rapid surge in domestic Covid-19 infections, but long-term impacts of the pandemic remain...
Wednesday 12 May 2021
Nan Ya to invest NT$8 billion to expand ABF substrate capacity
Nan Ya Printed Circuit Board has disclosed plans to invest a total of NT$8 billion (US$286.4 million) to expand production capacity for ABF substrates at its factory site in Shulin,...
Tuesday 11 May 2021
Taiwan IC substrate suppliers to embrace strong 2Q21
Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have all posted both sequential and on-year increases for their April revenues, and are poised to embrace brisk...
Monday 3 May 2021
Booming sales of AMD HPC chips to benefit IC distributors, testing firms
Some Taiwan-based IC distributors and testing service vendors in AMD's supply chain are benefiting significantly from robust sales of the US firm's HPC (high-performance computing)...
Wednesday 21 April 2021
Phison, Silicon Motion place NAND controller foundry orders for 2022
NAND flash controller specialists Phison Electronics and Silicon Motion Technology have placed orders for 2022 with their foundry partners, but are still aware tight mature process...
Friday 16 April 2021
FC packaging demand for HPC chips rising
Demand for flip-chip (FC) packaging particularly FC-BGA will be rising significantly driven by the HPC device market boom this year, and backend houses in Taiwan and China have seen...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research