Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP...
On the afternoon of July 14, 2025, China's State Administration for Market Regulation announced its conditional approval of US-based Synopsys' acquisition of Ansys shares. This deal...
Materials supplier Niching is aiming to hit record-high revenue this year after strong performance in the first half of 2025, boosted by continued growing demand in the AI, high performance...
As the global semiconductor competition intensifies, Silicon Valley chip guru and Tenstorrent CEO Jim Keller has shared exclusive insights on China's chip market, export restrictions,...
Strong demand for high performance computing (HPC) and generative AI (GenAI) has helped drive a 75% year-over-year revenue increase in the IC sector across Taiwan's science parks...
WinWay Technology, a Taiwan-based provider of semiconductor test interface solutions, has emerged as the world's largest supplier of test sockets, riding the wave of accelerating...
Global interconnect solutions provider BizLink Group opened a new facility in Tainan on June 26, underscoring its focus on localized R&D and production. Chairman Roger Liang said...
Taiwan is accelerating its shift from a manufacturing base to a tech innovation hub, driven by advances in high-performance computing (HPC) and artificial intelligence (AI). On June...
Aurona Industries, a PCB substrate manufacturer, reported a 1.2% revenue growth in May, driven by higher orders from the electronics industry following a temporary US tariff grace...
Taiwan's export orders for January-May 2024 rose 15% year on year to reach US$263.8 billion, with electronics products recording an over 25% annual growth to break the US$100 billion...
Semiconductor inspection leader MAtek reported consolidated revenue of NT$429 million (US$14.3 million) in May 2025, marking a 1.89% increase from the previous year despite a 2.75%...
As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical...
ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial...
Despite fresh uncertainty under Trump's second term, Taiwan's technology and trade sectors are showing surprising resilience and even growth. While his unpredictable tariff policies...
