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NEWS TAGGED HPC
Tuesday 26 November 2024
HPE unveils groundbreaking supercomputing lineup with fanless liquid cooling
Hewlett Packard Enterprise (HPE) has rolled out a new portfolio anchored by the HPE Cray Supercomputing EX system, debuting the industry's first fully fanless direct liquid cooling...
Wednesday 13 November 2024
WinWay's profits soar in 1-3Q24 driven by AI demand surge
Semiconductor testing interface leader WinWay has achieved record-breaking performance, driven by robust demand for AI, HPC applications, and AI smartphones. The company's AI and...
Thursday 7 November 2024
EgisTec partners with Asicland to jointly target South Korea's HPC market
Egis Technology (EgisTec), recently transformed into the ASIC business, has signed a strategic cooperation agreement with South Korean chip design company Asicland. The two companies...
Wednesday 6 November 2024
AP Memory seeks to capitalize on robust HPC and AI chip demand
Memory intellectual property (IP) firm AP Memory Technology has seen AI drive an uptick in sales, even as its IoT business has yet to rebound. With quarterly gross margin back on...
Monday 4 November 2024
CHPT anticipates full-year quarterly growth, secures new US HPC orders for 4Q24
Chunghwa Precision Test Tech. (CHPT) expects consistent quarterly growth, with fourth-quarter revenue set to benefit from new high-performance computing (HPC) test board orders and...
Wednesday 30 October 2024
Hon Precision secures orders from top US CSPs, riding the CoWoS growth wave
Hon Precision, Inc. (HPI), based in Taiwan, will be listed on the Emerging Stock Board (ESB) on October 31. The company, which specializes in backend semiconductor test handlers and...
Monday 21 October 2024
Southern Taiwan Science Park to see output value hit another record high in 2024
The government-operated Southern Taiwan Science Park (STSP) has capitalized on the global AI surge and the thriving semiconductor sector, generating a record revenue of NT$1.31 trillion...
Friday 18 October 2024
High-spec power supplies for AI computing to drive growth for Liteon
As power management and heat dissipation become increasingly important with the high-performance computing required for generative AI, a trend is emerging in the field of power supplies:...
Thursday 17 October 2024
TSMC expects 13% revenue growth in 4Q24
TSMC has disclosed that its third-quarter revenue and margins surpassed the guidance it provided three months ago. The pure-play foundry anticipates a 13% sequential increase in revenue...
Thursday 17 October 2024
Testing interface sector thrives as AI boom and mobile market fuel demand
The ongoing surge in generative AI is propelling demand for advanced testing technologies, with leading testing interface providers Winway and MPI reporting impressive financial results...
Wednesday 16 October 2024
TCB packaging crucial in AI and HPC applications, says ASMPT
Semiconductor and electronics manufacturing equipment supplier ASMPT sees sustained strong demand for thermocompression bonding (TCB) machines used in advanced packaging, as the trend...
Tuesday 15 October 2024
TSMC outlook and key client orders to garner focus at upcoming investor meeting
TSMC will hold an investor meeting on October 17 to review the company's business and market projections, as well as updates on its capital expenditure strategy for the current yea...
Thursday 3 October 2024
Taiwan wafer foundry industry expected to go up 18% sequentially in 2H24, says DIGITIMES Research
Boosted by short-term orders in the electronics supply chain and shipments of AI and high-performance computing (HPC) chips, Taiwan's wafer foundry industry posted better-than-expected...
Thursday 3 October 2024
Chinese HPC processors struggle to compete as Nvidia maintains edge in local AI market
China's domestically produced HPC processors have advanced; yet, they still struggle to be the preferred option for local cloud and AI companies, according to industry sources.
Tuesday 24 September 2024
TSMC SoIC fab capacity to reportedly boost through to 2026
The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research