At the 2025 ZGC Forum, Chinese chipmaker Loongson introduced the 3C6000/D—its first dual-socket 2U server fully designed and manufactured in-house. The launch highlights China's...
Taiwan's Ministry of Economic Affairs (MOEA) Department of Statistics reported on March 21 that February export orders hit US$49.45 billion, rising 5.3% from January and surging 31.1%...
MiTAC Holdings Corporation (MHC)'s subsidiary MiTAC Computing Technology introduced its latest AI infrastructure solutions at Nvidia GTC 2025, debuting the MiTAC G4527G6 AI server...
Neousys Technology Inc., a leading industrial PC (IPC) manufacturer, is unveiling its next-generation rugged edge AI computing platform at GTC 2025 to drive real-world AI adoption...
Compal Electronics has announced its participation in Nvidia GTC 2025 (March 17 - March 20), where it will showcase the latest technological breakthroughs in the AI-HPC GPU server...
The late 2024 surge in enthusiasm for artificial intelligence (AI) and high-performance computing (HPC) continues strong, driven by global cloud providers developing their own chips...
Samsung Electronics is ramping up its advanced foundry push, targeting mass production of its fourth-generation 4nm process (SF4X) by late 2024. Designed specifically for high-performance...
King Yuan Electronics (KYEC) remains upbeat about advanced testing demand for AI and HPC chips and has not ruled out the possibility of establishing a factory in the US.
On March 5, Giga Computing, a subsidiary of Gigabyte, announced it had signed a memorandum of understanding (MOU) with South Korea's SK Telecom and SK Enmove. The three parties will...
Alibaba's DAMO Academy has introduced its first server-grade RISC-V processor, the C930, designed for high-performance computing (HPC) applications. Announced at the XuanTie RISC-V...
IC testing firm Ardentec anticipates sequential revenue growth through the fourth quarter of 2025, driven by a consistent rise in demand for AI and HPC device applications. The company...
STMicroelectronics (STM) is partnering with Amazon Web Services (AWS) to develop a data center photonic chip that delivers 800Gbps and 1.6Tbps optical interconnect speeds for AI and...
As AI applications advance, the demand for high-performance and energy-efficient memory is growing across on-device AI, high-performance computing (HPC), and data centers. In response,...
Cable and connector maker BizLink expects steady demand for high-performance computing (HPC) and semiconductor production equipment (SPE) to drive growth in 2025, with chairman Roger...
ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
