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Friday 17 July 2026
China, Netherlands urge Nexperia talks as Wingtech warns of 1H loss

China and the Netherlands agreed that their governments should create a favorable environment for companies to resolve the Nexperia...

Friday 17 July 2026
TSMC limits mature-node expansion and eases pressure on PMIC suppliers
TSMC chairman C.C. Wei said at the company's July 16 earnings call that mature-node expansion will be limited, with future capacity additions focused mainly on overseas fabs in Japan...
Friday 17 July 2026
Montage Technology forecasts stronger first-half profit as AI demand lifts chip sales and discloses Korean prosecutors' search
China-based Montage Technology said its first-half results are expected to rise sharply, underscoring continued demand for AI-linked memory and interconnect chips that matter to data...
Friday 17 July 2026
TSMC says A14 process on track for 2028 volume production
TSMC said at its earnings call on July 16 that its A14 process technology is developing as planned, with risk production set for 2027 and volume production slated to begin in 2028.
Friday 17 July 2026
Interview: QuantumDiamond's EU-backed quantum leap in chip inspection lands in Taiwan

The global tech landscape is currently dominated by two massive tides: the race for semiconductor supremacy and the long-promised dawn...

Friday 17 July 2026
Power component prices keep rising as supply tightens

Power semiconductor makers say prices are still being adjusted as upstream raw material costs rise and AI-driven high-margin products...

Friday 17 July 2026
Tata's India chip debut reportedly to lean on 90nm, a humbler start than its 28nm pledge
India's first large-scale wafer fab will begin production on decades-old 90nm technology rather than the 28nm node the Tata group publicly touted, a step that underscores how far the...
Friday 17 July 2026
Hygon forecasts higher first-half 2026 revenue and profit
Hygon Information Technology said its first-half 2026 results are expected to rise sharply, signaling continued demand for domestic high-end chips as AI, cloud computing, and localization...
Friday 17 July 2026
TSMC welcomes EMIB relief as MediaTek pressure eases

TSMC Chairman C.C. Wei said on July 16 that if more competitors can offer advanced packaging solutions that meet customer needs, the...

Friday 17 July 2026
TSMC boosts US manufacturing as Taiwan chip designers wait on moving production

TSMC Chairman C.C. Wei formally announced on July 16 that the company will invest an additional US$100 billion in the US, funding several...

Friday 17 July 2026
TSMC's US$100 billion bet: AI growth, US pressure and the cost of staying ahead
Taiwan Semiconductor Manufacturing Company (TSMC) posted record second-quarter earnings for 2026, issued third-quarter revenue guidance above market expectations, and raised its full-year...
Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
Friday 17 July 2026
Taiwan backs TSMC's US expansion while reaffirming advanced chip leadership at home
TSMC said on July 16 that it will add US$100 billion to its US investment, bringing the total to US$265 billion. Taiwan's Executive Yuan said it respects companies expanding in the...
Friday 17 July 2026
AI-driven chip price increases put automakers on alert as shortages stay limited
Semiconductor suppliers have begun rolling out one to two rounds of price increases and tighter allocations in the first half of 2026 as demand from GenAI, geopolitical tensions and...
Friday 17 July 2026
South Korean bill could let SK Hynix bring in outside investors for new fabs

A South Korean lawmaker has introduced a bill that would allow a second-tier subsidiary of a general holding company to retain a stake...