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Wednesday 2 September 2026
SEMICON Taiwan 2026 signals a broader race for AI-era semiconductor leadership
SEMICON Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...
Wednesday 2 September 2026
UMC targets 12-inch TFLN to break 400G SiPh bottleneck
As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest...
Wednesday 2 September 2026
Apple's M6 and M5 Ultra break rule tying process to chip strength
Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...
Wednesday 2 September 2026
How Taiwan is closing its semiconductor materials gap — three shifts to watch
Industry players say Taiwan's push to localize semiconductor materials did not begin in 2026. The real turning point came in 2019, when the Japan-South Korea semiconductor trade dispute...
Wednesday 2 September 2026
Innolux targets advanced packaging with debut of Chip Last tech
Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...
Wednesday 2 September 2026
AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks
On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on...
Wednesday 2 September 2026
Global quantum industry accelerates as Taiwan eyes Asia hub
As quantum commercialization gathers pace worldwide, Taiwan is linking up with multiple countries to push for an Asia hub for quantum technology, industrial applications, international...
Wednesday 2 September 2026
Gudeng pursues 'Taiwan Plus One' overseas strategy, says cost is not sole consideration
Gudeng Precision Industrial chairman Bill Chiu said on August 31 that the company has begun building out its global manufacturing footprint. Its Japan plant is expected to complete...
Wednesday 2 September 2026
Plug and Play plans US$100 million Taiwan fund, hopes one of its next five unicorns is Taiwanese
Saeed Amidi has been in Taiwan for about 20 hours, and he has been asking everyone the same question.
Tuesday 1 September 2026
Taiwan chip equipment maker Skytech opens advanced process lab with TSMC backing
Skytech and TSMC have opened an Advanced Process Laboratory focused on next-generation semiconductor manufacturing, highlighting TSMC's continued efforts to support Taiwan's domestic...
Tuesday 1 September 2026
Japan's chip materials makers reportedly deepen Taiwan ties as AI reshapes supply chains
Japanese semiconductor materials suppliers Ajinomoto and Daikin Industries are expanding their presence in Taiwan as the AI boom fuels demand for advanced chip materials and encourages...
Tuesday 1 September 2026
Imec CEO: AI era pushes broader ties between chip, model and CSP players
Imec CEO Patrick Vandenameele said during a media briefing at SEMICON Taiwan 2026 that the Belgian research center is broadening its collaboration base in the AI era, extending beyond...
Tuesday 1 September 2026
ASE CEO describes AI resource squeeze as a short-term problem
AI's early-stage growth is creating a short-term squeeze on land, talent, capital, and power in Taiwan, but there is no such thing as a world that cannot do without Taiwan, ASE Technology...
Tuesday 1 September 2026
Marvell CTO: power and density bottlenecks are driving CPO adoption in AI data centers
Speaking at the Silicon Photonics Global Summit ahead of Semicon Taiwan 2026, Marvell Technology CTO Radha Nagarajan highlighted that the core focus for upgrading connectivity in the...
Tuesday 1 September 2026
Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan
As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first...