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Wednesday 14 October 2026
KYEC signs advanced payment deal with Nvidia for US testing expansion
Taiwanese semiconductor testing services provider King Yuan Electronics (KYEC) is expanding its US footprint, with its board approving an advance payment agreement with Nvidia. Under...
Wednesday 14 October 2026
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
Senior executives from TSMC, Intel, and Samsung Electronics outlined the growing challenges of AI chip development, spanning advanced semiconductor processes, 3D integration, and research...
Wednesday 14 October 2026
SEMICON West makes three-year commitment to Phoenix, home to over US$200B in chip investment
SEMI announced at a media event during SEMICON West 2026 that the exhibition will move to Phoenix, Arizona, in 2027 and shift to a spring schedule. SEMI Americas President Joe Stockunas...
Wednesday 14 October 2026
GlobalFoundries revives 7nm-class ambitions with an EUV-free FD-SOI bet on physical AI
GlobalFoundries' plan to build a 7nm-class chip process in Dresden without extreme ultraviolet (EUV) lithography tests how a second-tier foundry can stay relevant while TSMC holds...
Wednesday 14 October 2026
Applied Materials lifts 2030 margin goals, but a missing industry forecast sends a disappointing signal
Applied Materials used its investor day to argue that AI will let it outgrow the chip equipment market through 2030. Investors, however, focused on what the company left out: a forecast...
Wednesday 14 October 2026
TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM
GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
Wednesday 14 October 2026
Former Intel CEO Pat Gelsinger sees hardware renaissance in memory, optical interconnects
As AI reshapes the global computing landscape, former Intel CEO Pat Gelsinger said AI is making chip design easier, while physical bottlenecks in manufacturing, memory, and energy...
Wednesday 14 October 2026
Linde LienHwa links HaaS ecosystem to drive industrial decarbonization
Industrial gas supplier Linde LienHwa is expanding its industrial decarbonization applications, with oxygen-enriched combustion technology adopted by Taiwan Cement, Walsin Lihwa, Jin...
Wednesday 14 October 2026
China's wafer-scale graphene breakthrough brings quantum rectifiers closer to semiconductor integration
Chinese researchers have demonstrated wafer-scale graphene quantum rectifiers that convert weak radio-frequency signals into DC electricity at room temperature without an external...
Tuesday 13 October 2026
Engineering salaries deepen Taiwan's doctoral talent shortage
Taiwan's semiconductor and information and communications technology industries are drawing engineering graduates into high-paying jobs, intensifying a shortage of doctoral students...
Tuesday 13 October 2026
Charts: ASE tops NT$200B revenue in 3Q26 on AI OSAT demand
ASE reported September revenue of NT$88.13 billion (US$2.7 billion), up 7.15% month-over-month and 45.52% year-over-year, marking a record high for the third consecutive month. Third-quarter...
Tuesday 13 October 2026
Taiwan panel makers enter semiconductor fight as structural challenges persist
Entering the fourth quarter of 2026, panel makers face pressure from rising component costs and weakening demand. However, price hikes and production cuts led by Chinese panel manufacturers...
Tuesday 13 October 2026
Taisic Materials expands SiC capacity for AI data centers, 8-inch markets
Taisic Materials, a Foxconn-backed company under Kenmec Group, operates 65 crystal-growth furnaces as it expands silicon carbide (SiC) ingot and substrate production for AI data centers,...
Tuesday 13 October 2026
Samsung sends yield engineers to Texas ahead of 2nm production ramp
Samsung Electronics has begun dispatching advanced-process yield engineers from South Korea to its Taylor, Texas, foundry ahead of planned 2nm chip volume production in 2027, South...
Tuesday 13 October 2026
ASML unveils Hyper NA EUV successor targeting 5nm single exposure
Engineers from ASML and its optical partner Zeiss have jointly published a research paper in the October issue of the academic journal Journal of Micro/Nanopatterning, Materials...