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Friday 10 April 2026
Exclusive: SpaceX delays FOPLP, PCB yield as execs plan April Taiwan visit
Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale...
Friday 10 April 2026
Column: Corintis uses algorithms to target chip hotspots for precise cooling
As HPC and AI processors push computing performance to unprecedented levels, transistor density has reached a point where thermal behavior is no longer uniform. Instead of gradual,...
Friday 10 April 2026
Intel–Google alliance reframes AI infrastructure around CPUs
A newly expanded collaboration between Intel and Google signals a key shift in AI infrastructure: CPUs are back at the center of the conversation. Both companies emphasized that the...
Friday 10 April 2026
MediaTek builds an end-to-end challenge to Qualcomm and Broadcom
In recent years, MediaTek has steadily increased its influence in the global Wi-Fi chip market. Its market share gains have been driven not only by continued growth on the consumer...
Friday 10 April 2026
CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR
Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According...
Friday 10 April 2026
Exclusive: Samsung weighs Vietnam semiconductor testing facility

According to sources familiar with the matter, Samsung is in discussions with the Vietnamese government...

Friday 10 April 2026
Samsung and SK Hynix reportedly secure long-term helium contracts with US firms

Industry sources report that the recent supply concerns over semiconductor-grade helium triggered by the US-Iran conflict have eased,...

Friday 10 April 2026
Praise Victor Industrial aims to break Fujibo's soft pad dominance with 2Q26 sample certification
As AI and high-performance computing (HPC) demand surges and the semiconductor supply chain undergoes accelerating restructuring, structural changes are emerging in the critical materials...
Thursday 9 April 2026
When will CPO actually see mass production?
The market continues to closely watch the deployment of co-packaged optics (CPO) technology in cloud AI, driven by the desire of the silicon photonics (SiPh) ecosystem to see a tangible...
Thursday 9 April 2026
Hon Precision sees surging demand for AI infrastructure components
Hon Precision's strong March and first quarter 2026 results signal accelerating global demand for AI infrastructure components, with potential ripple effects on data center procurement...
Thursday 9 April 2026
Why global chipmakers want to join TSMC's certified supply chain
TSMC's long-established supplier verification and management system is gradually becoming an industry standard, attracting major players worldwide. Samsung Electronics, Intel, Japan's...
Thursday 9 April 2026
GITEX AI Asia opens in Singapore as focus shifts to infrastructure, deployment

Artificial intelligence is entering a more infrastructure-driven phase, as companies at GITEX Asia 2026 highlighted growing constraints...

Thursday 9 April 2026
Samsung Foundry launches new 2nm temperature sensor IP to improve chip thermal and area efficiency
Samsung Electronics' foundry division has introduced a new temperature sensor intellectual property (IP) designed to address heat dissipation and area efficiency challenges in advanced...
Thursday 9 April 2026
Cyient Semiconductors closes US$85M majority stake in Kinetic Technologies, accelerating India-led power IC scale
India-based Cyient Semiconductors' US$85 million majority investment in Kinetic Technologies could expand end-to-end power semiconductor design and production capabilities from India,...
Thursday 9 April 2026
China faces 300,000 semiconductor talent gap, warns SMIC founder

China's semiconductor industry faces a widening talent gap even as global competition intensifies, exposing a structural constraint despite...