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    NEWS TAGGED IC MANUFACTURING
    Friday 10 April 2026
    MetaOptics bets on Taiwan to scale metalens for AI, next-gen optics
    MetaOptics, a Singapore-based metalens developer, is partnering with Taiwan's Pin-Jye Nano Technologies to scale production of next-generation optical components as the technology...
    Friday 10 April 2026
    Spingence and Advantech accelerate AI edge deployment plans in South Korea manufacturing
    In response to strong demand for data security and on-premises AI deployment within South Korea's manufacturing and semiconductor sectors, Taiwanese AI company Spingence Technology...
    Friday 10 April 2026
    Exclusive: SpaceX delays FOPLP, PCB yield as execs plan April Taiwan visit
    Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale...
    Friday 10 April 2026
    Column: Corintis uses algorithms to target chip hotspots for precise cooling
    As HPC and AI processors push computing performance to unprecedented levels, transistor density has reached a point where thermal behavior is no longer uniform. Instead of gradual,...
    Friday 10 April 2026
    Intel–Google alliance reframes AI infrastructure around CPUs
    A newly expanded collaboration between Intel and Google signals a key shift in AI infrastructure: CPUs are back at the center of the conversation. Both companies emphasized that the...
    Friday 10 April 2026
    MediaTek builds an end-to-end challenge to Qualcomm and Broadcom
    In recent years, MediaTek has steadily increased its influence in the global Wi-Fi chip market. Its market share gains have been driven not only by continued growth on the consumer...
    Friday 10 April 2026
    CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR
    Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According...
    Friday 10 April 2026
    Exclusive: Samsung weighs Vietnam semiconductor testing facility

    According to sources familiar with the matter, Samsung is in discussions with the Vietnamese government...

    Friday 10 April 2026
    Samsung and SK Hynix reportedly secure long-term helium contracts with US firms

    Industry sources report that the recent supply concerns over semiconductor-grade helium triggered by the US-Iran conflict have eased,...

    Friday 10 April 2026
    Praise Victor Industrial aims to break Fujibo's soft pad dominance with 2Q26 sample certification
    As AI and high-performance computing (HPC) demand surges and the semiconductor supply chain undergoes accelerating restructuring, structural changes are emerging in the critical materials...
    Thursday 9 April 2026
    When will CPO actually see mass production?
    The market continues to closely watch the deployment of co-packaged optics (CPO) technology in cloud AI, driven by the desire of the silicon photonics (SiPh) ecosystem to see a tangible...
    Thursday 9 April 2026
    Hon Precision sees surging demand for AI infrastructure components
    Hon Precision's strong March and first quarter 2026 results signal accelerating global demand for AI infrastructure components, with potential ripple effects on data center procurement...
    Thursday 9 April 2026
    Why global chipmakers want to join TSMC's certified supply chain
    TSMC's long-established supplier verification and management system is gradually becoming an industry standard, attracting major players worldwide. Samsung Electronics, Intel, Japan's...
    Thursday 9 April 2026
    GITEX AI Asia opens in Singapore as focus shifts to infrastructure, deployment

    Artificial intelligence is entering a more infrastructure-driven phase, as companies at GITEX Asia 2026 highlighted growing constraints...

    Thursday 9 April 2026
    Samsung Foundry launches new 2nm temperature sensor IP to improve chip thermal and area efficiency
    Samsung Electronics' foundry division has introduced a new temperature sensor intellectual property (IP) designed to address heat dissipation and area efficiency challenges in advanced...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook