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Tuesday 21 July 2026
AI reshapes semiconductor growth curve; Zeiss eyes US$2.5 trillion market
Generative AI, high-performance computing (HPC), and large AI models are rapidly reshaping the global semiconductor industry's growth curve. Thomas Stammler, chief technology officer...
Tuesday 21 July 2026
BOE expands into glass-core packaging, solar cells and optical interconnects
BOE Technology Group said on July 20 that it is pushing beyond display panels into glass-core substrate packaging, perovskite solar cells and Micro LED optical interconnects. The Chinese...
Tuesday 21 July 2026
Pat Gelsinger: Intel missed GPU boom, warns Taiwan energy risk

Former Intel CEO Pat Gelsinger has criticized Intel's past strategy in a recent interview, revisiting the company's history with Nvidia...

Tuesday 21 July 2026
Samsung keeps High-NA EUV rollout cautious as foundry profitability remains the focus

Samsung Electronics is taking a slower approach than Intel to High-NA extreme ultraviolet (EUV) lithography for advanced chip production,...

Tuesday 21 July 2026
TSMC sees structural AI growth, expands Arizona capex

TSMC Chief Financial Officer Wendell Huang said the company expects AI chip demand to remain strong for years, prompting it to keep...

Tuesday 21 July 2026
Elite Material, TUC race ahead in AI CCL push

As AI server products accelerate their generational shift and demand higher-frequency, higher-speed transmission, the upgrade cycle...

Tuesday 21 July 2026
Befar begins production of 6N hydrogen fluoride gas for chipmaking

Befar Group has begun producing semiconductor-grade hydrogen fluoride gas with a claimed purity of 6N, or 99.9999%, expanding the Chinese...

Tuesday 21 July 2026
Advanced Echem Materials to invest NT$4.52 billion in Longtan plant
Advanced Echem Materials (AEMC), a semiconductor specialty chemicals materials maker, plans to invest roughly NT$4.52 billion (approx. US$139.66 million) in Taiwan's Longtan Science...
Tuesday 21 July 2026
Glass substrates poised to be chip packaging's next battleground: Trumpf

AI and high-performance computing are pushing chip packages beyond the limits of conventional materials, and German laser equipment...

Tuesday 21 July 2026
AI boom may reshape SK Siltron sale as chairman reportedly rethinks
SK Group chairman Chey Tae-Won is reportedly making a final decision on the sale of semiconductor silicon wafer subsidiary SK Siltron, as surging AI chip demand raises doubts about...
Tuesday 21 July 2026
VSMC warns AI-ready MES is becoming essential for wafer fabs, with China accelerating adoption

TSMC's sustained capital spending highlights the two foundations of its competitive strength: technology leadership and manufacturing excellence...

Monday 20 July 2026
Samsung to cut over 800 US jobs amid market headwinds

Samsung Electronics is cutting over 800 jobs in the US from its smartphone, display, and consumer electronics business units. The division,...

Monday 20 July 2026
Rapidus taps Cadence AI agents to speed 2nm chip design
Japanese foundry Rapidus is integrating Cadence's AI-agent technology into its chip design platform as it seeks to shorten development cycles and attract customers for its planned...
Monday 20 July 2026
Samsung preps multi-billion-dollar P5 orders as AI boom speeds up memory demand

Samsung Electronics' latest multi-billion-dollar equipment procurement reflects the company's accelerating investment in AI memory...

Monday 20 July 2026
Intel reassigns global fabs, eyes early 14A and EMIB-T AI wins

Intel has accelerated its global footprint reset for 2026 after receiving investments from the US government, SoftBank, and Nvidia...