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Thursday 15 October 2026
ASML hints at new 'T'-titled customer for 2029-2030 as Musk's Terafab lines up EUV tools
ASML has signaled that a new customer whose name may begin with "T" is among the chipmakers seeking lithography tools for 2029 and 2030.
Thursday 15 October 2026
Semiconductors to consume 30% of Taiwan's power by 2035
Rising demand for semiconductor wafer fabrication, memory, advanced packaging and high-end servers is driving a sharp increase in Taiwan's power consumption. Taipower estimates that...
Thursday 15 October 2026
Yuan Jen targets semiconductor shift with focus on packaging, specialty wire materials
Chemical and solvent distributor Yuan Jen Enterprises is actively expanding its electronic materials business. Company chairman Yuan-Jen Hsu stated that Yuan Jen established a dedicated...
Thursday 15 October 2026
Each 1% tariff hike could add US$3.5B to US fab costs, SIA warns
The Semiconductor Industry Association (SIA) urged the Trump administration to reduce tariffs on imported semiconductor materials and equipment, warning that higher costs could undermine...
Thursday 15 October 2026
Korean memory makers accept ASML parts price hike, leaving TSMC as the open question
Memory chipmakers have become the fastest-growing source of demand for ASML, and the two largest of them have reportedly accepted higher replacement-part prices from the Dutch company...
Thursday 15 October 2026
GlobalFoundries wins US$21 billion US-Japan deal to build, operate two New York fabs
GlobalFoundries' selection to run two Japan-funded chip plants in New York tests a new way of paying for American fabs: governments own the factory and its tools, and the chipmaker...
Thursday 15 October 2026
Applied Materials tracks 100-plus fabs as cleanroom capacity limits equipment growth
Applied Materials tracked more than 100 wafer fabrication projects worldwide over the past two quarters as strong artificial intelligence demand continued to meet constraints in cleanroom...
Thursday 15 October 2026
Applied Materials targets AI-driven semiconductor equipment growth through 2030
Applied Materials is increasing investments in research and development, manufacturing and its global supply chain as it targets greater market share and profitability through 2030...
Thursday 15 October 2026
Fujifilm to expand Arizona semiconductor materials output
Fujifilm is expanding semiconductor materials production in Arizona as global chip demand rises, especially for artificial intelligence, advanced logic, and memory. The move aims to...
Thursday 15 October 2026
UMC declines expedited Samsung order for Galaxy Z Fold8; GF eyed as backup DDI foundry
Following stronger-than-expected demand for its Galaxy Z Fold8, Samsung Electronics submitted an expedited wafer production request to United Microelectronics Corporation (UMC) that...
Thursday 15 October 2026
SEMI sees glass substrates entering market by 2028
The rapid expansion of AI and data center chip package sizes is accelerating the adoption of glass substrates, with SEMI's Beth Keser now forecasting market entry around 2028, two...
Thursday 15 October 2026
Topco eyes Idaho base as North American chip expansion accelerates
Topco Scientific (TSC) is evaluating a new base in Boise, Idaho, as the US enters a fresh wave of chip manufacturing expansion and Micron ramps up advanced memory investment. The company...
Wednesday 14 October 2026
300mm fab equipment spending to hit US$227 billion by 2029, SEMI says
Global spending on 300mm front-end fab equipment is projected to reach US$149 billion in 2026, up 31% from a year earlier. Spending is expected to keep growing at double-digit rates...
Wednesday 14 October 2026
Tata's flagship chip fab faces pressure from its own shareholders
Tata Group's semiconductor fab in Gujarat, held up as the foundation of India's chipmaking ambitions, now faces scrutiny from within, as the group's controlling shareholder presses...
Wednesday 14 October 2026
ASE expands PowerSiP platform to improve AI data center power efficiency
ASE has expanded its PowerSiP platform with a 3D system-in-package solution aimed at vertical voltage regulator modules (VRMs) for AI data centers and high-performance computing systems...