Samsung Electronics Chairman Lee Jae-yong was recently joined by senior executives from the company's semiconductor and display departments on a rare visit to China. Industry analysts...
Rapidus, a Japanese company focused on semiconductor innovation, officially opened its first facility, IIM-1, in Chitose City, Hokkaido, on April 1, 2025. Aiming to advance in the...
Amid growing concerns over semiconductor supply chain resilience and geopolitical tensions, industry speculation has emerged about potential consolidation in the global foundry sector...
Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting...
China's electronic product trade-in initiative is driving stronger electronics sales in the first half of 2025, with the smartphone sector showing particular strength. Industry sources...
Commerce Secretary Howard Lutnick has signaled he could withhold promised Chips Act grants as he pushes companies in line for federal semiconductor subsidies to substantially expand...
Taiwan's semiconductor manufacturers continue to confront challenging market conditions for mature process technologies, with reports that TSMC may slow expansion plans at its Kumamoto...
On April 1, UMC announced the opening ceremony for its expanded facility in Singapore. The first phase of this new plant is scheduled to commence production in 2026, which is expected...
On April 1, Rapidus inaugurated its first semiconductor fabrication facility, IIM-1, in Chitose City, Hokkaido, marking a pivotal step in Japan's leap from 40nm technology to the...
Hiroshi Kawamoto, Division Officer, Finance Division of Tokyo Electron Limited (TEL), one of Japan's leading semiconductor equipment manufacturers, projects that demand for high-bandwidth...
SEMICON China 2025 opened at the Shanghai New International Expo Centre to large crowds and packed booths, a full display of China's forward momentum for its semiconductor industry...
Taiwan Semiconductor Manufacturing Company (TSMC) is poised to commence mass production of its 2-nanometer (nm) chips in the second half of 2025 as scheduled, with customer demand...
A senior executive from Kaynes Semicon revealed plans for the company to become the first in India to package chips by July, noting the delay in Micron's ATMP project.
Between the 1960s and 1980s, the semiconductor industry primarily used a vertically integrated model covering all aspects, from equipment to materials. This approach disadvantaged...
