Samsung Electro-Mechanics has again delayed its semiconductor glass substrate commercialization schedule after a prototype reportedly failed a customer's reliability review. The setback...
Taiwan is seeking to sign an agreement with the US to avoid double taxation, seen as the last major hurdle to unlocking Taiwanese investment in the US. Taiwan's technology dividend...
Semiconductor Manufacturing International Corporation (SMIC) is considering disclosing revenue from artificial intelligence (AI)-related "peripheral chips" as a standalone line item,...
Applied Materials used its fiscal third-quarter earnings call to lay out a multi-year capacity build rather than just a strong quarter. Alongside record results, the company said it...
Hua Hong Grace Semiconductor has been running its fabs flat out for more than a year without earning an operating profit on the work. The June quarter ended that. Revenue reached a...
Applied Materials just posted its 13th consecutive quarter of year-on-year gross margin expansion, and it did so while its largest single country market shrank. Fiscal third-quarter...
China's largest contract chipmaker has spent most of the past two years increasing volume without much to show for it in terms of margins. The June quarter broke that pattern. Semiconductor...
After EVs, rockets, and humanoid robots, Elon Musk appears to be turning his attention to optimizing the chip manufacturing process. When he unveiled a US$16.8 billion initial investment...
The AI wave is sweeping through the chip industry, but hallucinations, loss of control, and cybersecurity risks remain unresolved even as efficiency leaps. Youngsik Kim, head of the...
AI chip startup Cerebras Systems raised its full-year 2026 core revenue and gross margin outlook after reporting second-quarter results, but the company also disclosed declining hardware...
SK hynix has pushed construction of its semiconductor campus in Yongin, Gyeonggi Province, South Korea, to 87% completion as it targets February 2027 for the start of operations at...
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
As the world enters an AI-powered era where the persistent need for more complex architectures is driven by rising demands for higher computing performance, one bottleneck confronting...
