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Wednesday 1 July 2026
AI fuels OSAT pricing power as chip packaging orders fill through 2027
Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since...
Wednesday 1 July 2026
AI chip complexity stretches electronic materials order windows to six months, DuPont spinoff warns

As the AI wave drives rapid growth across the global semiconductor industry, the upstream electronic materials supply chain has become...

Wednesday 1 July 2026
Naphtha supply risk adds pressure to semiconductor materials
A crude oil shortage tied to the US-Iran war is raising concern about naphtha, a refinery byproduct used deep in industrial supply chains. While a direct semiconductor shortage is...
Wednesday 1 July 2026
South Korea's southwest chip hub grows from memory fabs into full semiconductor and AI ecosystem
South Korea's government laid out a detailed plan on June 30 for building its southwest region into a major new semiconductor production base, with SK, Samsung Electronics and Amkor...
Wednesday 1 July 2026
SK Hynix talent hunt targets HBM's next frontiers while drawing Samsung employees' attention

SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than...

Wednesday 1 July 2026
Why South Korea may struggle to replicate Taiwan's semiconductor success

South Korea is moving to build a complete semiconductor supply chain modeled on Taiwan's technology corridor, but Gudeng chairman Bill...

Tuesday 30 June 2026
Asia Neo Tech and Brooks sign 15-year FOUP deal

Asia Neo Tech has announced a 15-year technology licensing agreement with US-based Brooks Automation to cooperate on FOUP (front-opening...

Tuesday 30 June 2026
Ability Opto-Electronics targets CPO growth with V-groove and MT lines

Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged...

Tuesday 30 June 2026
TSMC fast-tracks CoPoS—whole supply chain under gag order

TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to...

Tuesday 30 June 2026
TSMC 2nm, CoWoS, and CoPoS broadly lift Taiwan's equipment, materials, and packaging suppliers

As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating...

Tuesday 30 June 2026
Interview: Why DuPont spinoff Qnity is betting its Taiwan growth on packaging, not process nodes

As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals...

Tuesday 30 June 2026
Corning's East Coast edge: IP, manufacturing depth, and AI-era return of optical fiber
Protecting patents around the world is a core value for any R&D-driven company. It is also a commitment to partnering with customers. In 2025, glass giant Corning filed nearly...
Tuesday 30 June 2026
Samsung commits KRW2,655 trillion to future industries, anchoring new Gwangju fab
Samsung said on June 29 it will invest a combined KRW2,655 trillion (approx. US$1.72 trillion as of June 30, 2026) across its domestic operations, splitting the figure between continued...
Tuesday 30 June 2026
AI hands foundries pricing power: TSMC leads, but the boom spreads industry-wide

AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs,...

Tuesday 30 June 2026
Samsung revives 1.4nm foundry push as 2029 timeline takes shape

Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The...