News tagged IC manufacturing at DIGITIMES

NEWS TAGGED IC MANUFACTURING

Friday 13 March 2026

Exclusive: Inside GlobalFoundries CEO's stealth Taiwan blitz: wafer deals, not a UMC takeover

Tim Breen, who became GlobalFoundries' CEO in 2025, reportedly led a senior delegation to Taiwan this week for a five-day visit. The group held intensive meetings with supply chain...

Friday 13 March 2026

KYEC reports strong February revenue of NT$3.22 billion

King Yuan Electronics Co. (KYEC), a global leader in semiconductor testing, announced a robust financial performance for February 2026. The company...

Friday 13 March 2026

GlobalWafers sees 1Q26 silicon wafer prices bottoming as global capacity boosts revenue

GlobalWafers chairman Doris Hsu said rising adoption of artificial intelligence (AI) and high-performance computing (HPC) is sustaining long-term demand for advanced 12-inch silicon...

Friday 13 March 2026

FOCI targets CPO with automated lines, eyes revenue surge in 3 years

Fiber Optic Communications Inc. (FOCI) is deploying high-precision automated production lines for fiber array units to accelerate the production of co-packaged optics products and...

Friday 13 March 2026

Samsung targets 2nm process for HBM4E base die to boost AI chip edge

Samsung Electronics is reportedly planning to adopt a 2-nanometer (nm) process for the base die of its next-generation high-bandwidth memory (HBM), HBM4E, aiming to enhance its technological...

Friday 13 March 2026

Monthly Chart: memory surge vs logic slump creates polarized February in Taiwan

The Taiwanese semiconductor sector reported a starkly bifurcated performance for February 2026, as a massive cyclical rebound in the memory market...

Friday 13 March 2026

Apple's Mac Neo gambit: when volume alone can't hold the TSMC crown

The semiconductor landscape is undergoing a fundamental shift, moving from a mobile-first volume game to an AI-driven value competition.

Thursday 12 March 2026

UMC, HyperLight to mass-produce TFLN photonics chiplets for AI data centers

United Microelectronics Corporation (UMC) has partnered with startup HyperLight to mass-produce thin-film lithium niobate (TFLN) chiplets, aiming to improve data transmission speeds...

Thursday 12 March 2026

Ardentec launches ASIC wafer test collaboration; new Longtan capacity to be ready by 2H26

Semiconductor testing firm Ardentec is optimistic about its future operations, driven by sustained strong orders in communication applications. The company expects a resilient first...

Thursday 12 March 2026

Middle East conflict rattles energy markets, squeezes IC distributors

The ongoing Middle East conflict is disrupting global oil and natural gas supplies and triggering an energy crisis that has pushed up international crude prices. Market expectations...

Thursday 12 March 2026

Middle East conflict raises helium supply risks for South Korean chipmakers

Samsung Electronics and SK Hynix are reviewing their helium supply strategies as tensions in the Middle East disrupt key logistics routes, raising concerns over the availability of...

Thursday 12 March 2026

Asia Optical posts strong 2025 profit growth led by tech upgrades

Asia Optical reported robust growth in 2025, with net revenue reaching NT$26.446 billion (US$831.1 million), up 15% year-over-year, and operating profit increasing 28%. Despite a fourth-quarter...

Thursday 12 March 2026

IBM, Lam Research join forces on sub-1nm logic and High-NA EUV development

IBM and Lam Research have announced a five-year collaboration to develop materials, manufacturing processes, and High-NA EUV lithography...

Thursday 12 March 2026

India's 2026 semiconductor ramp unlikely to move global wafer supply needle, analysts say

India's plan to bring four semiconductor facilities into commercial production in 2026 marks an important milestone for the country's semiconductor ambitions, but analysts say the...

Thursday 12 March 2026

ASE's Tien Wu: Taiwan leverages hardware strength as US chip rivalry intensifies

Given the global chip war and US-China rivalry, ASE Technology Holding COO Tien Wu says that in an era where AI is driving transformation in the technology industry, the new bottleneck...

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook