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Wednesday 12 August 2026
Tsang Yow's semiconductor parts business drives profit growth in 2Q

Tsang Yow said its semiconductor equipment components business had become a major growth driver in July, as the Taiwan transmission-system...

Wednesday 12 August 2026
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Wednesday 12 August 2026
Panel makers turn to AI packaging as old fabs gain value
Taiwanese panel makers broadly reported weaker July revenue as some customers pulled in shipments in advance in the first half of the year and memory price increases weighed on consumer...
Wednesday 12 August 2026
Topco and Wah Lee post record July sales on semiconductor materials demand

Topco Scientific Co. and Wah Lee Industrial Corp. both reported record July revenue as chipmakers ran at full utilization and customers...

Wednesday 12 August 2026
Samsung weighs power subsidiary to secure semiconductor electricity by 2027
Samsung Group was reported to be considering a dedicated in-house power-procurement subsidiary to secure electricity directly for its semiconductor production facilities, with operations...
Wednesday 12 August 2026
Everlight starts Thailand plant to boost AI server and auto supply chains
Everlight Electronics has broken ground on a new manufacturing base in Chachoengsao, Thailand, with construction starting in August and mass production planned for the second half...
Tuesday 11 August 2026
TSMC commits JPY282 billion to Sony sensor JV as AI demand outruns Sony's 40nm process

TSMC and Sony Semiconductor Solutions have signed a legally binding definitive agreement to establish Advanced Vision Semiconductor...

Tuesday 11 August 2026
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Tuesday 11 August 2026
Taiwan's AI server supply chain posts record July as growth spreads down the component tier

The latest indication of global demand for AI hardware comes not from a hyperscaler capex presentation, but from unaudited monthly...

Tuesday 11 August 2026
Amkor reportedly weighs China stake sale as multinationals reassess footprint
Amkor Technology is exploring options, including the sale of a stake in its China business, according to people familiar with the matter, adding the US chip packaging and testing giant...
Tuesday 11 August 2026
Samsung races to qualify Taylor fab as 2nm demand turns US capacity into a strategic asset

Following growing momentum behind large-scale infrastructure buildouts in South Korea, the industry is witnessing an aggressive wave...

Tuesday 11 August 2026
Gudeng posts record seven-month revenue on EUV Pod orders and global demand
Gudeng Precision Industrial reported record revenue for the first seven months of 2026, supported by stronger EUV pod orders and rising purchases from overseas customers for advanced...
Tuesday 11 August 2026
Taiwan and China see more students choose STEM as tech demand rises
For students and employers worldwide, the shift toward science and engineering degrees in Taiwan and China underscores how artificial intelligence, advanced manufacturing, and semiconductor...
Tuesday 11 August 2026
Intel plans US$15B stock offering to fund AI-driven growth
Intel on August 10, 2026, announced plans to raise US$15 billion through an underwritten public offering of common stock, as the chipmaker seeks to strengthen its balance sheet and...
Tuesday 11 August 2026
Liying posts record July revenue as AI chip recycling demand rises

Liying Environmental Protection Technology reported record July 2026 revenue as demand tied to AI semiconductor production continued...