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Tuesday 10 November 2026
Exclusive: Quantum Motion makes 10,000-fold leap in chip integration, but qubit control remains the real test
The race to build powerful quantum computers has long revolved around an unfamiliar set of engineering challenges: maintaining delicate quantum states, operating complex cooling systems,...
Tuesday 10 November 2026
Hanwha Semitech taps new CEO as chip equipment sales more than double in 3Q26
Hanwha Semitech has named chief business officer Kim Jin-woo as its incoming CEO after semiconductor equipment revenue more than doubled in the third quarter of 2026. The South Korean...
Tuesday 10 November 2026
Tong Hsing buys Global Testing to become integrated OSAT provider
Tong Hsing Electronic Industries (THEIL), a semiconductor packaging company under the YAGEO Group, said its board has approved the acquisition of a 100% stake in Singapore-listed Global...
Monday 9 November 2026
Taiwan President taps chip strengths for self-reliant space push
Taiwan will continuously elevate its self-reliant space technology capabilities while leveraging its long-standing strengths in semiconductors, electronics, telecommunications, and...
Monday 9 November 2026
KYEC warns AI demand is amplifying semiconductor supply-chain risks
King Yuan Electronics (KYEC) president Gauss Chang said the AI era is creating new challenges for capacity expansion, as rapidly rising chip prices and shorter product cycles are reshaping...
Monday 9 November 2026
AI chip testing demands lift Taiwan's wafer testing specialist HTSI as October revenue surges 62%
Taiwanese semiconductor wafer testing solutions provider Hermes Testing Solution Inc. (HTSI) reported sustained revenue growth in October, supported by steady demand for high-power...
Monday 9 November 2026
Megaspeed chip smuggling probe puts Nvidia NCP certification under scrutiny
Nvidia CEO Jensen Huang appears to have become a target of Chinese intelligence activity, while his admission of an extramarital affair has drawn attention to his relationship with...
Monday 9 November 2026
Samsung, SK Hynix race to secure EUV tools as ASML warns of shortages
Samsung Electronics and SK Hynix are competing to secure extreme ultraviolet (EUV) lithography equipment from ASML as the Dutch supplier warns that its planned capacity will fall short...
Monday 9 November 2026
Exclusive: Gallium oxide prepares to tackle power semiconductor market with 6-inch mass production and 8-inch breakthroughs
Gallium oxide (Ga2O3) is approaching a pivotal industrial inflection point. On one hand, wafer sizes are scaling up to seamlessly integrate with existing semiconductor...
Monday 9 November 2026
Paras Semiconductors teams with US-based BroadPak on advanced packaging plant in India
Paras Semiconductors, a subsidiary of Indian defense company Paras Defence & Space Technologies, announced a strategic technology partnership with US-based BroadPak Corporation...
Monday 9 November 2026
Samsung, SK Hynix, Micron forge rare alliance to pave way for unmanned chip fabs
Samsung Electronics, SK Hynix and Micron are reportedly collaborating on charging standards for mobile robots used in semiconductor fabs, seeking to accelerate factory automation and...
Monday 9 November 2026
Samsung's Texas fab may begin trial runs in December
Samsung Electronics may begin trial runs across its Taylor, Texas, foundry in mid-to-late December 2026 as it installs and tests manufacturing equipment ahead of planned commercial...
Monday 9 November 2026
Musk's Terafab reportedly targets memory output on par with Samsung's DRAM capacity
Terafab, the chipmaking venture backed by Tesla and SpaceX, is reportedly planning memory output that would rival the world's largest DRAM maker. Japanese and Korean equipment and...
Monday 9 November 2026
Onsemi drops US$2 billion Czech SiC expansion amid pressure from cheaper Chinese wafers
Onsemi has abandoned a plan to invest up to US$2 billion in end-to-end silicon carbide (SiC) production in the Czech Republic, a reversal that Czech media have linked to low-cost Chinese...
Monday 9 November 2026
China's lithography ambitions gain ground as SMEE claims 90% local sourcing in chipmaking tools
Shanghai Micro Electronics Equipment (SMEE) has showcased a new generation of domestically developed lithography systems spanning front-end wafer fabrication and advanced packaging,...