The expansion of advanced semiconductor processes and packaging is driving demand for facility engineering, with Chi Yi Hsin Technology securing NT$4.5 billion (US$138.9 million) in...
As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via...
Micron Technology's labor dispute in Taiwan appears set for resolution after its Taichung union signed a labor-management agreement with the company and withdrew from the mediation...
Infineon Technologies and US-based silicon carbide (SiC) leader Wolfspeed announced on October 15 a new multi-year supply agreement for 8-inch SiC wafers. This deal transitions their...
Sony Group will not spin off its semiconductor business, which focuses on image sensors, president and CEO Hiroki Totoki said recently. The group is retaining the unit because its...
AMEC is seeking an entry into South Korea's power semiconductor market through MOCVD equipment trials with SK Keyfoundry and Magnachip. The Chinese equipment supplier holds a large...
Growing demand for AI servers, advanced packaging, and data centers is reviving interest in idle LCD plants, with companies acquiring and converting existing sites into semiconductor...
Axcelis Technologies plans to break ground on a US$35 million ion implantation equipment manufacturing facility in Pyeongtaek, South Korea, expanding its semiconductor infrastructure...
SpaceX has spent two decades proving that hardware once considered too complex, too capital-intensive, or too dependent on entrenched suppliers could sometimes be pulled in-house....
The AI infrastructure race is increasingly becoming a contest over who can turn electrical capacity, cooling systems, and hardware into usable compute the fastest.
Growing AI computing demand is bringing the semiconductor industry to a technological turning point. Transistor scaling has long driven gains in chip density, performance, and energy...
Samsung Electronics is increasingly relying on its 4nm and 5nm foundry processes to improve near-term profitability as negotiations with major customers for its next-generation 2nm...
AI processor performance continues to improve, but memory bandwidth is growing more slowly, making data supply a major constraint on AI chip performance and energy efficiency. Efforts...
Taiwan's export orders totaled US$114.21 billion in September 2026, up US$11.25 billion, or 10.9%, from the previous month, according to data released by Taiwan's Ministry of Economic...
Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...
