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Wednesday 19 February 2025
SK Hynix taps VP to lead US HBM packaging facility
SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched...
Tuesday 18 February 2025
Infineon ships first 8-inch SiC product to customers
According to Infineon's press release, the company is advancing its 8-inch silicon carbide (SiC) technology, having released its first products in the first quarter of 2025. These...
Tuesday 18 February 2025
ASE opens fifth factory in Penang, embracing AI-driven smart manufacturing
With the global semiconductor market projected to exceed US$1 trillion within the next decade, IC packaging and testing leader ASE is accelerating its overseas expansion. The company's...
Tuesday 18 February 2025
Win Semiconductors targets SiPh CPO, expecting to increase share in optical communications
Win Semiconductors, the leading gallium arsenide (GaAs) foundry, sees signs of recovery after industry downturns. As demand for mobile phones and Wi-Fi power amplifiers stabilizes,...
Tuesday 18 February 2025
Former TSMC chairman Mark Liu launches new think tank to bolster US tech competitiveness
Mark Liu, the former executive chairman of Taiwan Semiconductor Manufacturing Company (TSMC), is spearheading a bold initiative to enhance American technology leadership. According...
Tuesday 18 February 2025
Fujifilm expands CMP slurry and post-CMP cleaner production to target advanced processes
Fujifilm is rapidly expanding its production of semiconductor materials in Kyushu, Japan. In addition to increasing the production capacity of chemical mechanical polishing (CMP)...
Tuesday 18 February 2025
Commentary: Intel's 18A advantage undermines the case for a TSMC takeover
Pat Gelsinger's exit as Intel's chief executive has laid bare a fundamental clash between his vision and that of the board. Gelsinger pushed to ramp up capital spending, expand advanced...
Tuesday 18 February 2025
Taiwan dismisses Trump's TSMC claims, reaffirms win-win semiconductor partnership

After President Trump claimed that Taiwan has taken America's semiconductor chip business away, some speculate that the US government...

Tuesday 18 February 2025
ASE to increase spending in 2025 for expansion, new Malaysia plant reportedly set to open
Global packaging and testing leader ASE Technology Holdings (ASE) expects total capital expenditure (capex) for the year to grow significantly by over 60%, primarily allocated for...
Tuesday 18 February 2025
SMIC and Hua Hong expand capacity despite US curbs and domestic oversupply
Despite technological restrictions from the US and its allies, SMIC and Hua Hong Semiconductor remain dedicated to investment and continue to expand their production capacity, highlighting...
Tuesday 18 February 2025
GaAs foundry Win Semiconductors positive about RF chip demand
Win Semiconductors (WIN), a GaAs foundry, is reportedly one of the beneficiaries of Apple's in-house RF component initiative. Although the Taiwan-based company has declined to provide...
Tuesday 18 February 2025
Taiwan 4Q24 IC output value increases
Taiwan's total IC industry output value—including IC design, IC manufacturing, IC packaging, and IC testing—was NT$1.49 trillion (US$45.5 billion) in the fourth quarter...
Tuesday 18 February 2025
ASE CEO optimistic about semiconductor industry hitting US$1 trillion scale no later than 2032
Tien Wu, CEO of ASE, stated that while Taiwan-based companies excel in developing the "brain" of robots, key sensor technologies such as those related to vision, hearing, speech,...
Tuesday 18 February 2025
Why SK Hynix is scrutinizing Chinese EDA: two key drivers behind strategic shift
SK Hynix has reportedly launched a review of its use of Chinese Electronic Design Automation (EDA) software in response to potential US restrictions targeting Chinese technology in...
Tuesday 18 February 2025
NEG expands glass substrate production amid HBM and semiconductor packaging boom
Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due to the growing demand for generative AI, which has boosted...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research