The Federal Ministry for Economic Affairs and Climate Action of Germany (BMWK) has officially approved financing for TSMC's wafer fab project in Dresden. The German government has...
Chinese SiC substrate vendors are seeking to expand beyond their home market where prices have collapsed amid severe oversupply, according to industry sources.
Mitsubishi Electric President and CEO, Kei Uruma, revealed in a Tokyo interview that the company is pursuing a restructuring initiative within Japan's power semiconductor sector,...
Leading integrated device manufacturers (IDMs) have expressed concerns about the automotive semiconductor market outlook for 2025. Despite these challenges, Taiwan-based IC design...
Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer...
Infineon Technologies has announced the development of the world's first 300mm power gallium nitride (GaN) wafer technology. The company claims to be the first to effectively implement...
In the past six months, China's leading GaN compound semiconductor firm Innoscience has faced patent infringement lawsuits in Germany and the US, from power component manufacturers...
The power semiconductor industry is experiencing a surge in the development of compound semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC). These advancements...
TSMC's first European wafer fab is set to be located in Dresden, Germany, a region already recognized as a significant chip manufacturing hub in both Germany and Europe. This decision...
ESMC has commenced construction on a new semiconductor fabrication facility in Dresden, Germany. The joint venture between TSMC, Robert Bosch, Infineon, and NXP is investing over...
European Semiconductor Manufacturing Company (ESMC), a joint venture between TSMC, Robert Bosch, Infineon Technologies and NXP Semiconductors, has held a groundbreaking ceremony to...
The international patent war over compound semiconductors, specifically Gallium Nitride (GaN), continues to intensify. In July, Efficient Power Conversion (EPC) from the US won a...
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
Enovix, a next-generation 3D silicon-lithium battery design and manufacturing company founded in 2007, is a global leader in high-performance battery technology. On August 8, it announced...
