In the rapidly evolving semiconductor industry, the emergence of CXL (Compute Express Link) as an interconnect specification has captured the spotlight. Samsung Electronics and SK...
South Korean semiconductor intellectual property (IP) firm Chips&Media is gearing up for the AI era with its latest semiconductor IP core, designed to capitalize on the burgeoning...
After completing the largest IPO of the US stock market in 2023, Arm, the IP giant under SoftBank, has entered a new phase of operations. How this will affect Arm's operations and...
After Huawei's Mate 60 Pro, featuring the 7nm Kirin 9000S processor produced by SMIC, caused a stir, Dr. Burn-Jeng Lin, dean of the College of Semiconductor Research under Taiwan's...
For the SoftBank-backed Arm that just completed a blockbuster IPO in the US in mid-September, China is a critical market contributing a quarter of its annual revenues for fiscal 2023,...
With SoftBank-backed IP giant Arm launching a blockbuster IPO (initial public offering) on the US Nasdaq market on September 14 at a unit share price of US$51, its CEO Rene Haas bears...
Andes Technology has no grounds for pessimism, according to Frankwell Lin, chairman and CEO of the embedded processor IP provider. With the start of the traditional peak season and...
Intel and Synopsys have reached an agreement to expand their IP and electronic design automation (EDA) strategic partnership by developing a portfolio of IP on Intel 3 and Intel 18A...
Renesas Electronics and Sequans Communications, a provider of 5G/4G cellular IoT chips and modules, have signed a memorandum of understanding whereby Renesas will acquire Sequans...
Inventec has successfully developed its AI accelerator IP in-house and already has interest from two IC design house customers, according to industry sources. Tapeout is expected...
Cadence Design Systems and Rambus, a premier chip and silicon IP provider making data faster and safer, today announced that they have entered into a definitive agreement for Cadence...
IC analysis and inspection labs have seen demand visibility from system device vendors and IP design service providers extended to 2024, attributed to increased R&D investment...
According to Intel, Boeing and Northrop Grumman have joined phase two of the Department of Defense's RAMP-C program, which aims to facilitate a leading-edge US foundry ecosystem on...
System vendors are seeking capacity support from IC analysis laboratories for 2024 through their contracted IP service providers, as they foresee high demand for advanced packaging,...
