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Monday 15 July 2024
Samsung leverages IDM status to differentiate HBM4 with optimal customization and performance gains
Samsung is set to launch its sixth generation of High-Bandwidth Memory (HBM), HBM4, in 2025 and will differentiate its HBM technology through customized optimization services by leveraging...
Monday 15 July 2024
ISE Labs doubles lab space and capabilities with 2nd Silicon Valley facility
ISE Labs, a subsidiary of ASE that provides one-stop semiconductor engineering services, has announced the expansion of its world-class capabilities with the launch of a second US...
Monday 15 July 2024
Motherboard, graphics card shipments to recover in 2H24
Global PC shipments are expected to stabilize by the end of 2024, spurring a recovery in motherboard and graphics card shipments in the second half of the year, according to industry...
Friday 12 July 2024
Samsung's new foldables boosted by AI, annual sales growth to exceed 20%
On July 10, Samsung Electronics unveiled its new generation of foldable smartphones. Samsung announced the Galaxy Z Fold 6 and Flip 6 series, along with new products such as the Galaxy...
Friday 12 July 2024
Samsung unveils brand-new mobile AI ecosystem; new foldable devices set to launch on July 24
Samsung Electronics held its Galaxy Unpacked 2024 event on the evening of July 10 in Paris, France. The company introduced its new generation of foldable phones, the Galaxy Z Fold...
Thursday 11 July 2024
Ariane 6 launches to restore Europe's space independence from SpaceX
Europe's next-generation heavy-lift rocket, Ariane 6, is scheduled to launch from French Guiana on July 11, carrying satellites and experimental equipment.
Tuesday 9 July 2024
Resonac forms alliance developing advanced packaging in US
A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies...
Tuesday 9 July 2024
Samsung develops FOWLP-HPB packaging solution to curb mobile AP overheating
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...
Monday 8 July 2024
India roundup: India to launch public AI platform under IndiaAI Mission
India is eager to build its AI capabilities under the IndiaAI Mission. Meanwhile, India's efforts to attract Tesla have hit another roadblock amid a slowing global EV market that...
Friday 5 July 2024
Equipment manufacturers resume discussions on FOPLP with TSMC as the lead
As Apple prepares to launch its first AI smartphone in September, the third quarter is expected to see a surge in stocking demand. This has not only pushed TSMC's market value to...
Thursday 4 July 2024
AI PCs and server demand set to drive supply chain recovery in late 2024
The depletion of supply chain inventory, originally expected by late 2023, has been delayed to the first half of 2024 due to weak end-market consumption. However, the upcoming launch...
Thursday 4 July 2024
India to launch public AI platform under IndiaAI Mission
India plans to launch a public AI platform for businesses and researchers to build products or conduct projects, including large-scale procure plans for GPUs.
Wednesday 3 July 2024
VinFast first Indian manufacturing facility may open earlier than expected
VinFast, which commenced construction of its inaugural manufacturing facility in India in February, may open the facility three months ahead of schedule.
Wednesday 3 July 2024
Huawei Mate 70 to launch in September with worthy highlights
In the competitive smartphone market of the second half of 2024, Huawei plans to release its Mate 70 series in the late third quarter.
Wednesday 26 June 2024
OpenAI delays launch of voice assistant to address safety issues
OpenAI is delaying the release of a much-anticipated voice assistant feature for ChatGPT to ensure it can safely and effectively process requests from millions of users.