AMD has postponed the Ryzen 9000 series launch due to quality issues found in initial production units. The company is replacing affected chips and has confirmed a packaging, not...
Samsung Electronics, fresh off its July 2024 launch of new foldable phones, is gearing up to introduce a sleeker, more lightweight model: the Galaxy...
Recent rumors suggest that Apple is conducting research and development for its first "foldable iPhone," with a potential release targeted for 2026. Industry sources believe that...
Apple is set to unveil iOS 18, its latest mobile operating system, which promises a slew of significant updates. Among these, the most notable is the expansion of satellite communication...
Intel is set to launch a new initiative at the 2024 Paris Olympics and Paralympics that will introduce innovative AI applications built on Intel's hardware and software into the two...
Four years into Taiwan's 5G era, which began on June 30, 2020, with Chunghwa Telecom's launch, the industry faces a sobering reality. Despite high expectations for 5G to revolutionize...
Samsung is set to launch its sixth generation of High-Bandwidth Memory (HBM), HBM4, in 2025 and will differentiate its HBM technology through customized optimization services by leveraging...
ISE Labs, a subsidiary of ASE that provides one-stop semiconductor engineering services, has announced the expansion of its world-class capabilities with the launch of a second US...
Global PC shipments are expected to stabilize by the end of 2024, spurring a recovery in motherboard and graphics card shipments in the second half of the year, according to industry...
On July 10, Samsung Electronics unveiled its new generation of foldable smartphones. Samsung announced the Galaxy Z Fold 6 and Flip 6 series, along with new products such as the Galaxy...
Samsung Electronics held its Galaxy Unpacked 2024 event on the evening of July 10 in Paris, France. The company introduced its new generation of foldable phones, the Galaxy Z Fold...
Europe's next-generation heavy-lift rocket, Ariane 6, is scheduled to launch from French Guiana on July 11, carrying satellites and experimental equipment.
A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies...
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...
