Taiwan's government has officially committed to developing its own version of "Starlink" as part of its "Five Trusted Industry Sectors" initiative. The launch of the country's first...
Following Apple's recent event, Huawei has officially unveiled the Mate XT Ultimate Design Series, featuring a groundbreaking trifold design that has quickly become a hot topic, possibly...
Market reactions to Apple Intelligence have been lukewarm after the iPhone 16 launch event, with many noting no significant additions to what had been announced at the Worldwide Developers...
On September 10, Huawei and Apple, the former dominant entities in the global smartphone industry, simultaneously unveiled their next smartphones after a six-year hiatus.
All eyes were on Apple's AI efforts during the tech giant's latest product announcement on September 9, but consumers in China are likely to feel disappointed. Apple Intelligence...
At Apple's September keynote event, on top of the announcement of the new iPhone 16 series and new additions to the Apple Watch and AirPods product lineups, all the attention is on...
Chinese tech giant Huawei is set to unveil its latest innovation in the foldable smartphone market, potentially reshaping the landscape of mobile devices. The company's upcoming launch...
According to industry sources, TSMC plans to launch its first high-NA EUV lithography equipment at its fab site in Hsinchu, northern Taiwan, by the end of September, a quarter earlier...
China-based, often dubbed the "King of Africa" due to its dominance in that market, has recently unveiled its new Phantom Ultimate 2, a tri-fold smartphone. This launch underscores...
Qualcomm recently announced the expansion of the Snapdragon X series at the International Radio Exhibition Berlin (IFA Berlin 2024). Company CEO Cristiano Amon expressed confidence...
India-based IC design house BigEndian Semiconductors raised US$3 million and aims to partner with Taiwan-based UMC to launch security chips amid the emergence of a local semiconductor...
Acer has announced a range of new products on the eve of IFA 2024, with its Project DualPlay gaming laptop concept taking the spotlight. This innovative device features a built-in...
With major IC design houses like Intel, Apple, and Qualcomm launching new products amid rising electronics demand, TSMC's 3nm capacity utilization has consistently stayed at 100%,...
Huawei's HiSilicon Full-Connection Conference is scheduled for September 9 in Shenzhen, just one day before Apple's annual iPhone launch event. While the timing's intent remains unclear,...
Electroninks, the leader in metal-organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of the company's advanced...
