Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging...
The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...
As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced...
Fan-out panel level packaging (FOPLP) offers advantages in cost control, high-density integration, and high reliability. After years of research and development, the technology has...
Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia...
In 2022, the demand of semiconductor chips is facing an uncertain outlook, apart from the strong surge in orders of previous year. Especially in consumer electronics sectors, the...
With the rise of smart devices, applications for semiconductor components are quickly expanding. The requirements for chip size, information transmission speed, and power in network...
Manz AG is the wet chemistry process leader in Taiwan and China for production of displays panels, printed circle boards and advanced semiconductor packaging technology. The product...
Germany-based Manz AG and a number of Taiwan-based PCB and LCD panel equipment suppliers will showcase their latest production equipment for the PCB and flat panel industries at Touch...
Germany-based equipment maker Manz AG will invest CNY8.0 million (US$1.3 million) to establish a PCB production equipment experimental factory at its existing plant in Suzhou, eastern...
Disappointing sales of high-end smartphones and other unfavorable factors have discouraged PCB makers from spending money on capacity building since the the second half of 2013. However,...
