There has been a large gap between imagination and realization when it comes to the metaverse, according to Ting Wei Li, chairman of NXP Greater China. However, nowadays, Li says...
NXP Semiconductors has announced a strategic partnership with Foxconn Industrial Internet (FII) to work on transforming a car into an edge device. NXP will provide FII with its comprehensive...
With GaN-on-SiC RF components set to gain ground in 5G, satellite communications and national defense applications, Taiwan-based III-V semiconductor players including foundries Win...
NXP Semiconductors has announced a collaboration with the Ford Motor to deliver enhanced driver experiences, convenience and services across its global fleet of vehicles, including...
Cybersecurity is becoming increasingly important in autonomous vehicles (AV), as level 2 (L2) AVs become more widespread. Regional regulations and technological limitations are also...
Automotive IDMs have notified their clients about 10-20% price hikes for their chips starting 2022 as they continue to face mounting costs for raw materials, according to industry...
First-tier automotive IC IDMs in the US, Japan and Europe have reportedly approached OSATs including ASE Technology, Powertech Technology (PTI) and Greatek Electronics to book backend...
Taiwan-based wafer probing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all seen order visibility extended well into 2022, driven by international...
Vendors of third-generation semiconductors including GaN and SiC (silicon carbide) are stepping up regional production and marketing deployments to better explore immense demand for...
NXP Semiconductors and Jio Platforms (JPL), a subsidiary of Reliance, have announced a collaboration to implement a 5G NR O-RAN small cell solution that incorporates NXP's Layerscape...
Taiwan-based OSATs and chip probing service providers are upbeat about backend demand for automotive chips over the next three to four years, as international IDMs such as Renesas...
The ongoing lockdown in Malaysia is posing new variables to capacity deployments at many international automotive IDMs, further fueling competitions between ICT and auto makers for...
NXP Semiconductors and TSMC have jointly announced volume production of NXP's S32G2 vehicle network processors and S32R294 radar processor built using TSMC's 16nm FinFET process technology...
The car industry, hit hard by chip shortages, has been scrambling for foundry capacity support. UMC's latest US$3.5 billion fab expansion project has already obtained pre-payment...