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Friday 26 December 2025
Exclusive: Ex-TSMC COO discusses how mass production sparked full-scale advancement
J.K. Wang, a veteran leader in the semiconductor industry and former COO of TSMC, shared insights on TSMC's large-scale wafer fab mass production during his first media interview...
Wednesday 24 December 2025
2D materials: from memory entry to logic's future
Two-dimensional (2D) materials were once regarded as important candidates for extending semiconductor scaling. Because they are only an atom thick, they are theoretically very suitable...
Wednesday 24 December 2025
CHIPX eyes Malaysia for 8-inch GaN-on-SiC wafer fab

Dublin-based semiconductor startup CHIPX plans to build an 8-inch gallium nitride on silicon carbide wafer fabrication plant in Malaysia...

Wednesday 24 December 2025
AI chips run too hot: Engineers race to reinvent cooling
The rapid growth of generative AI and large-scale models has significantly increased power consumption in computing chips, pushing thermal management into critical focus. High-end...
Monday 22 December 2025
Research insight: SpaceX's growth story is shifting from rockets to networks in space

SpaceX is widely expected to pursue an initial public offering in mid to late 2026. In anticipation, investors have increasingly tied...

Monday 22 December 2025
Analysis: Foxtron's Luxgen deal brings the suppliers more uncertainty than clarity

The long-rumored transfer of Luxgen, the automotive brand under Yulon Motor, to Foxtron Vehicle Technologies—a joint venture between...

Monday 22 December 2025
Column: 2D materials struggle to deliver on semiconductor scaling promise
The isolation of graphene in 2004 sparked widespread expectations that two-dimensional (2D) materials could fundamentally reshape electronic devices. Graphene and transition metal...
Friday 19 December 2025
Exclusive: Former TSMC COO talks discipline and unity behind success
Former COO of TSMC and a veteran semiconductor industry leader, J.K. Wang, shared insights from his 30-plus-year career at the company in an exclusive interview with DIGITIMES'...
Friday 19 December 2025
Commentary: Why China's GPU start-ups command billion-dollar valuations despite losses
China's GPU start-ups are back at the center of a capital-market frenzy. Following Moore Threads, five-year-old MetaX has listed on Shanghai's STAR Market, with its shares surging...
Friday 19 December 2025
Analysis: US leads AI in humanoid robots while China excels in cost and hardware
As humanoid robots emerge as a key technology riding the wave of AI, the US and China are rapidly forming two competing camps. Industry insiders analyzing their strengths say the...
Wednesday 17 December 2025
Commentary: Intel's SambaNova move signals AI chip consolidation era
Intel is reportedly seeking to acquire SambaNova, a prominent AI inference chip specialist. The deal has a high probability of closing, primarily due to a significant governance alignment:...
Wednesday 17 December 2025
Energy efficiency: The new battleground for AI servers
AI is inevitably driving innovation in global server architecture. AI servers differ significantly from traditional servers in design philosophy and operational mode. This reflects...
Tuesday 16 December 2025
Commentary: Broadcom and MediaTek face profit challenges amid growing ASIC orders
Broadcom reported strong AI-related order growth but noted lower gross margins for ASIC products compared to non-AI items, causing market uncertainty about 2026 revenue. Industry...
Monday 15 December 2025
Singapore boosts semiconductor sector with workforce training and new R&D hub
Singapore is expanding its domestic semiconductor capabilities through AI-focused workforce programs, SME digitalization efforts, and new research infrastructure, according to Ang...
Friday 12 December 2025
Exclusive: Ex-TSMC R&D VP on advanced packaging and Morris Chang's vision
Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's...