Supply chain resilience was once centred on raw materials, components, factories and logistics. AI, cloud services and the digital economy have expanded the risk perimeter. Companies...
Last week, from September 9 to 11, thousands of vendors gathered for an enormous trade show in the Chinese tech hub of Shenzhen. At the China International Optoelectronic Expo (CIOE),...
As humanoid robots gradually move from laboratory proofs-of-concept and enter industrial manufacturing and commercial service, their underlying motion control and environmental perception...
"He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success...
ASML's latest update suggests High NA EUV is no longer confined to laboratory validation. With 10 systems already operating across four customers worldwide, and three more in shipment...
Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex...
Chinese GaN power semiconductor maker Innoscience gained direct access to capital markets after listing in Hong Kong at the end of 2024, giving it fresh funding to expand GaN capacity...
We previously discussed how automation removes environmental uncertainty, while autonomy requires systems to operate in complex settings. The biggest difference is that autonomous...
Apple has finally unveiled the long-anticipated foldable iPhone Duo, with former CEO Tim Cook making a brief appearance at the start of the launch video. The moment suggested the device...
Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...
King Slide Works posted the fastest revenue growth in August among the 50 Taiwan-listed AI supply chain companies tracked by DIGITIMES, with sales up 318% from a year earlier...
The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
