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    China’s 15th five-year plan elevates PCB role in AI supply chains
    1h 54min ago
    Huawei’s Kirin 9050 Pro reveals new logic folding chip design
    1h 54min ago
    Huawei says 381 tau chips are already in mass production
    1h 54min ago
    Samsung accelerates HBM thermal management push as AI packaging scales up
    1h 54min ago
    South Korean PCB exports ride AI demand, set to surpass 2022 peak in 2026
    1h 54min ago
    NEWS TAGGED OPINION
    Monday 5 October 2026
    Commentary: China's US$37.3B subsidy meets a weak smartphone market as new flagships test replacement demand
    China's National Day holidays have opened one of the fourth quarter's most important promotional windows for consumer electronics. For smartphones, the timing is especially significant:...
    Monday 5 October 2026
    TSMC, Intel named as Musk's Terafab ambitions face reality check
    As Elon Musk's Terafab ambitions advance, the realities of modern silicon manufacturing become increasingly apparent, prompting Musk to enter talks with industry mainstays like Intel...
    Monday 5 October 2026
    Exclusive: A*STAR IME's Yu-chieh Chien targets next-gen SiC through 8-inch R&D, reliability gains

    Singapore is building a semiconductor R&D hub by attracting both multinational investment and overseas research talent. Dr Yu-chieh Chien,...

    Monday 5 October 2026
    DIGITIMES Insight: AI data demand surges as power and cooling become new bottlenecks
    As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast...
    Monday 5 October 2026
    Podcast highlights: TSMC Texas plant talk is premature, Intel 18A hits backfiring criticism
    This excerpt from DIGITIMES analyst Luke Lin's podcast looks at TSMC's rumored Texas expansion, Intel's 14A and 18A process debate, and Qualcomm's high bandwidth compute (HBC) push...
    Saturday 3 October 2026
    Interview: AI PCs reach 65% of Europe's notebook channel, but what brings buyers to the market?
    The rapid iteration of AI-capable hardware, following an industry-wide push toward integrating AI-processing capabilities into PCs, is bringing renewed attention to what AI could offer...
    Friday 2 October 2026
    DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide
    Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply...
    Friday 2 October 2026
    Commentary: Broadcom's US$42 billion Anthropic loan exposes AI's emerging chip-financing loop
    When the underlying economics of infrastructure commitments meet the financing muscle of the companies supplying foundational compute, the traditional boundary between supplier and...
    Friday 2 October 2026
    Column: AI benchmarks remain lucrative business
    New AI models arrive every few weeks, and the question of which is better often comes down to the leaderboard. Behind those rankings, evaluation can look like an academic exercise...
    Friday 2 October 2026
    Commentary: AMD challenges Nvidia in embodied AI as Lisa Su acquires Fei-Fei Li's World Labs
    Advanced Micro Devices (AMD) has agreed to acquire World Labs in an all-stock transaction valued at approximately US$8.2 billion. Following the closing, World Labs will operate as...
    Thursday 1 October 2026
    Analysis: China's AI data center buildout vaults to No. 2 as Big Tech capex races toward US$100 billion

    China's rapid expansion of AI applications is driving a fresh wave of data center construction. SemiAnalysis estimates that the country has already...

    Thursday 1 October 2026
    5 issues to watch as Nvidia bets on hardware for AI agent security
    Nvidia's new AI agent security platform puts hardware at the centre of agent control, but it also forces enterprises to weigh stronger protection against higher infrastructure costs...
    Thursday 1 October 2026
    DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
    TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
    Thursday 1 October 2026
    DIGITIMES Insight: Agentic AI shifts inference bottleneck to token control and task quality
    DIGITIMES Intelligence observes that AI applications are moving through a clear progression: from early classification AI focused on feature recognition, to generative AI capable of...
    Wednesday 30 September 2026
    DIGITIMES Insight: AI is emerging as the new growth anchor in the mobile communications industry
    South Korea's leading telecommunications operator, SK Telecom (SKT), recently established SK Hyper and SK Horizon in quick succession. The moves mark a pivotal shift for telecommunications...
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    BIZ FOCUS
    Oct 5, 08:00
    AI Family Digital Twins Bridge Elder Care Gaps
    Friday 2 October 2026
    Digital Divide: Hackathon Team Debuts Senior-Friendly 'AI Butler'
    Thursday 1 October 2026
    Speed 3D Showcases On-Device AI Generation with Snapdragon X2 Elite
    Thursday 1 October 2026
    From Excel to Editable Presentations: AI Streamlines Financial Reporting
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