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Monday 15 December 2025
Singapore boosts semiconductor sector with workforce training and new R&D hub
Singapore is expanding its domestic semiconductor capabilities through AI-focused workforce programs, SME digitalization efforts, and new research infrastructure, according to Ang...
Friday 12 December 2025
Exclusive: Ex-TSMC R&D VP on advanced packaging and Morris Chang's vision
Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's...
Thursday 11 December 2025
Commentary: China's PCB edge survives G2 decoupling
As the US–China tech confrontation drags on, discussions consistently return to chips, semiconductors, rare earths, and tariffs. Despite accelerating supply-chain decoupling...
Thursday 11 December 2025
Commentary: China's tech M&A unravels from EDA to compute
China's tech capital markets have slipped into a drawn-out, messy stretch, with multiple high-profile mergers either collapsing or failing to advance beyond early talks.
Wednesday 10 December 2025
Micro LED's moment: Asia races to dominate the next display revolution
As display technology continues to advance, Micro LED has emerged as the next star after LCD and OLED—drawing intense interest and investment from panel makers worldwide.
Tuesday 9 December 2025
Commentary: Are East Asia tensions a threat to supply chains?
The Indo-Pacific region has become the world's most critical theater for both technology manufacturing and geopolitical competition. As military tensions escalate across East Asia,...
Tuesday 9 December 2025
Analysis: Why isn't Huawei trying to win the tech war?
Huawei founder Ren Zhengfei recently gave a public talk at the Huawei Lianqiuhu R&D Center in Shanghai. He shared insights on AI, quantum computing, computing power, and chips...
Monday 8 December 2025
Research Insight: Strong momentum expected for data center AI chip packaging in 2025-2030
According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in...
Monday 8 December 2025
Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
Monday 8 December 2025
Commentary: Moore Threads' record IPO echoes Cambricon's trajectory as investors bet on unproven profitability
Chinese GPU startup Moore Threads debuted on the STAR Market on December 5, 2025, with its opening price soaring to CNY650 (US$91.94) per share—a staggering 468.78% increase—pushing...
Monday 8 December 2025
Research Insight: 800V systems, LiDAR, and multi-screen cabins dominate China's 2025 models

The 2025 Guangzhou International Automobile Exhibition concluded on Nov. 30, offering one of the clearest snapshots yet of where China's...

Friday 5 December 2025
Commentary: Infineon-Innoscience GaN ruling delivers 'disputed victory' for both sides
The US International Trade Commission (ITC) has issued its initial determination in Infineon's Section 337 case against China-based GaN supplier Innoscience. In a telling move that...
Thursday 4 December 2025
Commentary: Micron exits consumer memory market as structural chip shortage hits
Micron has announced it will exit its Crucial consumer product business, including SSDs and memory modules, with all shipments ending by February 2026. This move amid escalating memory...
Thursday 4 December 2025
Commentary: Why Onsemi, STMicro, and Nvidia are all converging on Innoscience's GaN factory floor
Onsemi and Innoscience have signed a memorandum of understanding to expand mass production of GaN power devices using Innoscience's mature 8-inch GaN-on-silicon technology. Onsemi...
Thursday 4 December 2025
Exclusive: Qualcomm SVP says AI PC still in early stage, focuses on tech and market education
Qualcomm is hosting another summit with Taiwan's local PC ecosystem by the end of 2025, following its 2023 event. Kedar Kondap, Qualcomm's senior vice president responsible for PC...