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    Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
    6min ago
    Half of GenAI projects stall at PoC as data gaps widen
    7min ago
    Jinpao Precision anticipates 2H26 growth from AI orders, aerospace progress
    9min ago
    AI packaging demand exposes supply-chain gaps for Taiwan materials makers
    18min ago
    India targets domestic mobile phone design capabilities with new US$7.5 billion manufacturing scheme
    20min ago
    MIT study finds AI image attribution weakens as training data grows
    28min ago
    NEWS TAGGED OPINION
    Monday 24 August 2026
    Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
    ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst...
    Saturday 22 August 2026
    Interview: Arbe Robotics on why radar is needed for autonomous driving and beyond
    Autonomous driving technology is maturing, and a future in which cars entirely drive themselves is quickly approaching in the rearview mirror. Yet safety and trust remain crucial barriers...
    Saturday 22 August 2026
    Column: Lessons in supply chain resilience from China Huadian's power-compute coordination model
    As AI develops rapidly, data centers are driving equally rapid growth in electricity demand. The stability of future energy supplies will directly determine whether AI computing capacity...
    Saturday 22 August 2026
    Manz Asia says yield is key to glass core mass production
    As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
    Friday 21 August 2026
    Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
    The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
    Friday 21 August 2026
    Research Insight: 2028 key year for optical interconnects in AI racks
    Optical communications will likely enter AI server racks in 2028, DIGITIMES analyst Joyce Chen said on August 20 at a semiconductor industry forum in Taipei, as rising AI cluster scale...
    Friday 21 August 2026
    Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
    The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
    Friday 21 August 2026
    Charts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up
    Foundry leader Taiwan Semiconductor Manufacturing Company (TSMC) grew 37% year to date — and still lost four percentage points of the sub-sector's revenue share, because the...
    Friday 21 August 2026
    Charts: AI test demand drives broadest growth among Taiwan's chip equipment suppliers
    Thirty-eight of 43 companies grew year to date at a median rate of 28.7% — the highest of any semiconductor sub-sector — with test handlers, sockets and probe cards recurring...
    Friday 21 August 2026
    Column: Is 800V really 'high voltage'? —AI data centers revive an old power debate
    High-voltage direct current (HVDC) is currently one of the hottest areas of technology and product development for AI data centers. It is not only the first layer of what Nvidia CEO...
    Friday 21 August 2026
    Charts: Foxconn is losing share of Taiwan's EMS revenue as Quanta and Wistron near double
    The sub-sector's dominant supplier grew 37.9% year to date and still ranks only seventh of 20, while the other 19 companies grew 56.9% between them.
    Thursday 20 August 2026
    Analysis: Google keeps Sunfish at Broadcom, Zebrafish at MediaTek — Marvell's US$12.2bn warrant buys a category nobody was defending

    One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says,...

    Thursday 20 August 2026
    Commentary: How iPad Air became a catalyst for IT OLED expansion
    Apple kicked off the tablet OLED era in 2024, introducing Tandem OLED in the iPad Pro to overcome bottlenecks in display lifespan and brightness. The iPad mini followed, set to adopt...
    Thursday 20 August 2026
    Analysis: Unitree IPO exposes the economics behind China's humanoid robot boom

    Unitree Robotics' August 19 debut on Shanghai's STAR Market did more than crown China's first mainland-listed humanoid robot maker....

    Thursday 20 August 2026
    Analysis: Marvell's US$120bn Google deal is the AI chip industry's new playbook — equity for orders, not cash
    Marvell Technology is set to deepen its role in Google's AI infrastructure through an expanded agreement to develop custom chips, in a deal that could generate roughly US$120 billion...
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    BIZ FOCUS
    Aug 20, 11:00
    Corning-IRICO Trade Secret Case Enters New Phase
    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services
    Thursday 20 August 2026
    Chroma's Proprietary ASIC Technology Reshapes the Semiconductor Test Landscape
    Thursday 20 August 2026
    Henkel Launches LOCTITE ABLESTIK CDF900 Series Conductive Die Attach Film
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