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Tuesday 25 August 2026
Insight: One Nexperia, two supply chains? China-Europe split tests automotive chip model
Nexperia China is accelerating its separation from the Dutch chipmaker's traditional European manufacturing network, raising the prospect that one of the world's largest suppliers...
Tuesday 25 August 2026
Commentary: Nvidia's 15% hike piles pressure on the AI supply chain, lifts ASIC prospects
Nvidia has reportedly notified major customers that server systems using its AI chips will rise by more than 15%, with the new pricing set to apply to models shipping from early 2027,...
Monday 24 August 2026
Etron chair sees memory boom extending to 2028-2030
The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely...
Monday 24 August 2026
Analysis: SK Hynix pushes beyond HBM with HBF and CPO
SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
Monday 24 August 2026
Commentary: Robots go to work— highlight of the five robotic trends at WRC 2026

The 2026 World Robot Conference (WRC) opened in Beijing on August 19, and the biggest change on this year's show floor was not the larger...

Monday 24 August 2026
AI chip roadmaps force faster changes in data-center design, Cadence says
Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according...
Monday 24 August 2026
Interview: Inside Foxconn's playbook for the sovereign AI data center race
Foxconn is repositioning its AI data center business around system integration, modular deployment, and sovereign computing, as the rapid growth of GPU infrastructure changes how customers...
Monday 24 August 2026
Podcast highlights: TSMC Arizona's profit turnaround, US manufacturing viability pressures South Korean memory makers
DIGITIMES analyst Luke Lin noted on a recent podcast that when reviewing TSMC's semiannual and first-quarter 2026 financial reports, the operational health and profitability of its...
Monday 24 August 2026
Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst...
Saturday 22 August 2026
Interview: Arbe Robotics on why radar is needed for autonomous driving and beyond
Autonomous driving technology is maturing, and a future in which cars entirely drive themselves is quickly approaching in the rearview mirror. Yet safety and trust remain crucial barriers...
Saturday 22 August 2026
Column: Lessons in supply chain resilience from China Huadian's power-compute coordination model
As AI develops rapidly, data centers are driving equally rapid growth in electricity demand. The stability of future energy supplies will directly determine whether AI computing capacity...
Saturday 22 August 2026
Manz Asia says yield is key to glass core mass production
As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
Friday 21 August 2026
Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
Friday 21 August 2026
Research Insight: 2028 key year for optical interconnects in AI racks
Optical communications will likely enter AI server racks in 2028, DIGITIMES analyst Joyce Chen said on August 20 at a semiconductor industry forum in Taipei, as rising AI cluster scale...
Friday 21 August 2026
Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...