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Tuesday 15 September 2026
The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips
"He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success...
Monday 14 September 2026
DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker
ASML's latest update suggests High NA EUV is no longer confined to laboratory validation. With 10 systems already operating across four customers worldwide, and three more in shipment...
Monday 14 September 2026
DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex...
Monday 14 September 2026
DIGITIMES Insight: China's GaN challengers are no longer playing catch-up
Chinese GaN power semiconductor maker Innoscience gained direct access to capital markets after listing in Hong Kong at the end of 2024, giving it fresh funding to expand GaN capacity...
Sunday 13 September 2026
Column: What is SLAM? The first step in Physical AI
We previously discussed how automation removes environmental uncertainty, while autonomy requires systems to operate in complex settings. The biggest difference is that autonomous...
Saturday 12 September 2026
Commentary: Apple sends off Cook with a foldable flourish, but Ternus's trial is still ahead
Apple has finally unveiled the long-anticipated foldable iPhone Duo, with former CEO Tim Cook making a brief appearance at the start of the launch video. The moment suggested the device...
Saturday 12 September 2026
ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
Saturday 12 September 2026
Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line
Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...
Saturday 12 September 2026
Charts: Taiwan's AI supply chain growth moves from cooling to rack hardware
King Slide Works posted the fastest revenue growth in August among the 50 Taiwan-listed AI supply chain companies tracked by DIGITIMES, with sales up 318% from a year earlier...
Thursday 10 September 2026
Analysis: China chases EUV as chipmakers move to High-NA
The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
Wednesday 9 September 2026
Commentary: Huawei's Kirin comeback, Xiaomi's Xring entry widen China's chipmaking race
In September 2020, Huawei's smartphone business suffered a severe blow.
Wednesday 9 September 2026
Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
A battery quality controversy involving GAC Aion has put supplier CALB, the world's fourth-largest EV battery maker, under scrutiny and highlighted a less comfortable side of China's...
Tuesday 8 September 2026
Analysis: Imec's EUV edge raises question over how far Taiwan should replicate research fab model
If Taiwan's government is determined enough, finding funding and land for the Industrial Technology Research Institute (ITRI) or the National Institutes of Applied Research (NIAR)...
Tuesday 8 September 2026
Analysis: Taiwan manufacturers put 78.9% of new investment into machines as hiring fails
Taiwan's traditional manufacturers are warning that the island's growth story is widening a long-running labor gap, as semiconductor and AI server demand lifts the economy even as...