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NEWS TAGGED ORBOTECH
Thursday 4 March 2021
Orbotech showcases roll-to-roll direct imaging and UV laser drilling solutions that drive flex PCB process innovation and has an optimistic outlook on 2021
The COVID-19 pandemic has severely impacted the global economy. However, thanks to their unique market position and manufacturing capabilities, the Taiwan and China-based cross-strait...
Monday 21 December 2020
Orbotech introduces new flex PCB manufacturing solutions
Orbotech, a KLA company, has announced two new roll-to-roll (R2R) manufacturing solutions for flexible printed circuit (FPCs), enabling the design and mass production of new generations...
Wednesday 28 August 2019
Orbotech's yield enhancement solutions are harnessing AI technologies to provide added value to Taiwan panel makers
The 8K resolution display, or Super Hi-Vision (SHV), is expected to succeed 4K and become the next TV standard. Earlier this year at CES 2019, global TV brands and panel makers came...
Wednesday 22 November 2017
Orbotech launches new AOI solution driving workflow innovation and improving yields of mSAP PCBs
The global printed circuit board (PCB) industry went into a slightly decline in 2016. According to the research report from the Industrial Economics and Knowledge Center (IEK), the...
Wednesday 2 November 2016
Frontline PCB Solutions announces a company rebrand
Frontline PCB Solutions, an Orbotech-Mentor Graphics company and the leading global provider of CAM and engineering software solutions for the PCB industry, today announced the company's...
Thursday 27 October 2016
Orbotech presents new, innovative digital production solutions at TPCA 2016
Orbotech Ltd., is showcasing a selection of its most innovative and best-in-class digital production solutions for PCB and FPC (flexible printed circuits) manufacturers at this year's...
Tuesday 24 November 2015
Orbotech shares vision for future electronics manufacturing models; leverages rebranding efforts
Smart devices such as smartphones and wearables have changed the way we communicate and are transforming the cultural and social lives of just about everyone on the planet.
Wednesday 1 October 2014
Inkjet Applications Bring Added Value to Advanced IC Packaging Production
The race to thinner devices with high performance pushes the advanced packaging industry toward smaller form factor and thinner packages, some as small as a just a few hundred microns...
Tuesday 23 September 2014
Orbotech advances into the IC packaging industry together with SPTS in SEMICON Taiwan 2014
Orbotech Ltd. (NASDAQ: ORBK) announced that it has successfully closed the previously-announced acquisition of SPTS Technologies Group Limited ("SPTS"), in a strategic move...
Thursday 24 October 2013
Orbotech Ultra Fusion 600 delivers advanced performance with high speed for IC substrates down to 5μm
Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs) and IC substrates, announced the introduction of Ultra Fusion...
Wednesday 23 October 2013
Orbotech presents advanced technologies for HDI and IC substrate production
Orbotech Pacific Ltd., the Asia Pacific subsidiary of Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs) and IC...
Thursday 25 October 2012
Orbotech presents innovations for PCB production at TPCA show in Taipei
Orbotech Pacific Ltd., the Asia Pacific subsidiary of Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs), is presenting...
Thursday 25 October 2012
Orbotech introduces new Sprint 120 inkjet printer for volume production
Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs), recently announced the introduction of Sprint 120, the company's...
Thursday 18 October 2012
Orbotech presents new innovations for Asia Pacific PCB production
Orbotech Pacific Ltd., the Asia Pacific subsidiary of Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs), is presenting...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research