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Wednesday 8 April 2026
Apple's foldable iPhone reportedly still on track for September launch despite engineering hurdles

Apple's first foldable iPhone is reportedly facing a more complex-than-expected engineering testing phase, raising concerns about potential...

Wednesday 8 April 2026
Samsung Display secures exclusive Apple foldable OLED orders, partners poised to benefit
Samsung Display (SDC) has taken the lead in the industry by initiating mass production of 8.6-generation OLED panels for IT applications, as well as OLED panels for Apple's foldable...
Wednesday 8 April 2026
India reportedly bars Chinese CCTV cameras, turns to Taiwan and Western suppliers
India is moving to phase out Chinese-made internet-connected CCTV cameras and high-speed tollway cameras, citing national security risks, even as it cautiously opens other sectors...
Wednesday 8 April 2026
Rising gallium costs force price increases across GaAs chip supply chain

Prices for gallium arsenide (GaA) substrates — a key material used in power amplifiers for wireless communications — are rising,...

Wednesday 8 April 2026
China export controls spark global InP supply concerns for AI high-speed transmission
Indium phosphide (InP), a critical material for long-distance optical communication, has become essential for AI-driven high-speed data transmission. However, China's export restrictions...
Wednesday 8 April 2026
DEEPX Speeds Physical AI Commercialization: 27 Orders In Seven Months

DEEPX, a Seoul-based fabless semiconductor company developing ultra-low-power AI inference chips for physical AI applications, has secured 27 commercial purchase orders...

Tuesday 7 April 2026
Quobly moves quantum chips into volume production

French quantum chip startup Quobly has continued to report progress while expanding its partnership network. The company has set up a new...

Tuesday 7 April 2026
FOPLP and WMCM emerge as key to fan-out packaging competitive field
The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a...
Tuesday 7 April 2026
MSScorps targets CPO demand with in-house silicon photonics test platform

MSScorps has expanded its silicon photonics (SiPh) testing capabilities in recent years and will debut its in-house "MSS HG" platform...

Tuesday 7 April 2026
Innodisk revenue jumps 4x in March, first-quarter hits record
Memory module maker Innodisk extended its strong growth momentum in March 2026, reporting monthly revenue of NT$5.67 billion (approx. US$177.34 million), up 35.8% month-over-month...
Tuesday 7 April 2026
Google's chip revisions raise questions for MediaTek's growth plans

Recent reports suggest that Google has once again made engineering changes to its Tensor Processing Unit, or TPU, pushing the chip's tape-out...

Tuesday 7 April 2026
Exclusive: Apple reportedly shifts over 40% of MacBook production to Vietnam, including new budget Neo model
Industry sources reveal that in response to geopolitical risks, major brands have increasingly diversified their manufacturing outside China. Apple has already transferred more than...
Tuesday 7 April 2026
Taiwan, Japan join forces on next-gen drones with core technology alliance
The "brain" of a drone plays a critical role in flight missions. While Taiwanese manufacturers have advantages in drone hardware production, integrating the core control systems remains...
Tuesday 7 April 2026
Weekly news roundup: China's special AI chip supply ends; TSMC plans 12 fabs in Arizona
Below are the most-read DIGITIMES Asia stories from the week of March 30-April 5, 2026:
Tuesday 7 April 2026
Formosa Plastics denies cutting PE supply amid US-Iran conflict, confirms March output increase
Impacted by the conflict in the Middle East, Taiwan has recently reported a shortage of plastic bags, raising questions about whether Formosa Plastics Group deliberately reduced production...