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Thursday 20 February 2025
Trump's proposed 25% tariffs on automotive and chip imports have caused 'chaos' among industry leaders
US President Donald Trump announced plans to impose 25% tariffs on auto imports, semiconductors, and pharmaceuticals starting as early as April 2, with potential increases over time...
Thursday 20 February 2025
Murata prepares for future expansion with test production in India
Japanese iPhone component maker Murata Manufacturing (Murata) has begun test production in India to address growing domestic demand, with plans to gradually expand its manufacturing...
Thursday 20 February 2025
Supply chain implications of iPhone 16e reveal Apple's strategic shifts
Apple's latest iPhone 16e combines premium features with affordability, marking several strategic shifts in the company's supply chain and manufacturing approach. While consumers...
Thursday 20 February 2025
China to tighten grip on rare earth mining for non-state firms
China plans to prohibit non-state companies from mining rare earths, further tightening its control over a strategic sector that has emerged as a battleground in its trade war with...
Thursday 20 February 2025
Samsung Display poised to dominate OLED supply for Apple's MacBook amid BOE's yield woes
Samsung Display (SDC) and China's BOE are targeting Apple's next-generation OLED device market through investments in 8.6-generation IT OLED production lines. However, South Korean...
Wednesday 19 February 2025
Japanese Startup AZAPA develops semi-solid-state battery system to cut production costs by 40%
AZAPA, a Japanese automotive development and design startup, is set to launch its semi-solid-state battery system by 2025, primarily aimed at electric vehicles (EVs) technology. This...
Wednesday 19 February 2025
PCB upstream suppliers track SEA expansion, anticipating 2025 mass production orders
Major Taiwanese printed circuit board (PCB) manufacturers are actively investing in setting up facilities in Southeast Asia due to the region's geopolitical considerations, rising...
Wednesday 19 February 2025
Young Optics shifts focus to CPO amid declining micro-projection, 3D printing revenue
Young Optics' consolidated revenue declined by 14.6% year over year in 2024 to NT$2.572 billion (US$78.7 million), largely due to competition from Chinese mid-range single-panel LCD...
Wednesday 19 February 2025
Nuvoton readies Microsoft co-developed BMC chip for mass production in 2025
Nuvoton, a microcontroller (MCU) provider, is emerging stronger from inventory corrections. Driven by recent pre-shipment demand from notebook/PC clients and continued adjustments...
Wednesday 19 February 2025
ASE and PTI step up FOPLP investments to tap AI boom
ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
Wednesday 19 February 2025
As Acer takes first swing, will Trump's tariffs spark notebook price hike in North America?
US President Donald Trump's 10% tariff on Chinese imports has prompted Acer to raise US notebook prices by 10%, making it the first brand to respond. However, US-based competitors...
Wednesday 19 February 2025
Inventec to expand server production in Texas
Richard Lee, chairman of the Taiwan Electrical and Electronic Manufacturers Association (TEEMA), revealed on February 18, 2025, that a major server manufacturer will announce an expansion...
Wednesday 19 February 2025
SK Hynix expands HBM3E production, boosting Hanmi Semiconductor's growth despite DeepSeek threat
SK Hynix is reportedly expanding its production of fifth-generation, 12-layer HBM3E, with Hanmi Semiconductor and ASMPT expected to lead in equipment orders. Hanmi is set for growth...
Wednesday 19 February 2025
Samsung semiconductor chief reportedly meets with Nvidia CEO as HBM3E race heats up
Samsung Electronics' semiconductor head Young-Hyun Jun reportedly met with Nvidia CEO Jensen Huang in the US, fueling speculation that Samsung is advancing its bid to supply HBM3E...
Wednesday 19 February 2025
SK Hynix taps VP to lead US HBM packaging facility
SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched...