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Monday 23 February 2026
Samsung regains DRAM lead with 40% revenue jump in 4Q25, eyes HBM4 to strengthen edge
Samsung Electronics reclaimed the global DRAM market crown in 4Q25, just one year after losing it to SK Hynix. Industry watchers are closely monitoring whether Samsung can further...
Monday 23 February 2026
Samsung Foundry rebounds with utilization above 80% in 1Q26
Samsung Electronics' foundry utilization exceeded 80% in the first quarter of 2026, its highest level in over a year, increasing the probability of a quarterly profit turnaround this...
Monday 23 February 2026
Samsung brings forward P5 cleanroom timeline under 'Shell First' strategy
Samsung Electronics has accelerated cleanroom construction at its Pyeongtaek Fab 5 (P5), pushing forward capacity expansion for high-bandwidth memory and advanced-node semiconductor...
Saturday 21 February 2026
Commentary: Samsung to reclaim the world's no.1 semiconductor position in 2026

Samsung Electronics and Intel have alternated for years as the world's largest semiconductor company. From 2011 to 2023, Samsung and Intel...

Thursday 19 February 2026
DIGITIMES Insight: US tariff-credit design could pressure Korean memory makers to localize production
A proposed US tariff and duty-exemption framework could force Korean memory suppliers to accelerate US fab investments or risk losing AI server market share, according to DIGITIMES...
Wednesday 18 February 2026
Samsung advances LPDDR5X-PIM, signaling memory's new role in AI computing

Artificial intelligence is shifting the center of gravity in semiconductors. For decades, processors defined performance. Now memory bandwidth,...

Tuesday 17 February 2026
Samsung accelerates HBM hybrid bonding line to meet Nvidia demand
Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus...
Monday 16 February 2026
Weekly news roundup: Intel resets AI PC race, backs ZAM memory play, HBM3–HBM4 battle intensifies
Below are the most-read DIGITIMES Asia stories in the week of February 9 to February 16, 2026. This week's coverage spans HBM3 and HBM4 capacity shifts, AI PC market share changes,...
Sunday 15 February 2026
Power semiconductor cost pressures rise as 8-inch wafer foundries plan price hikes
Demand for AI servers' power management chips is surging, tightening supply and demand in the 8-inch wafer foundry market. Powerchip Semiconductor Manufacturing Corporation (PSMC)...
Saturday 14 February 2026
HBM steals the show at SEMICON Korea despite Samsung, SK Hynix skipping the floor
Artificial intelligence-driven growth in the semiconductor industry has drawn increasing public attention. SEMICON Korea, organized by SEMI, continues to expand in scale. The 2026...
Friday 13 February 2026
Samsung's non-memory unit to turn profitable in 4Q26 as Exynos 2700 targets 50% share in Galaxy S27
Industry analysts indicate that Samsung Electronics' non-memory division is expected to return to profitability in the fourth quarter of 2026, with a full-year turnaround projected...
Friday 13 February 2026
SEMICON Korea: Samsung pushes hybrid bonding HBM, SK Hynix bets on platform AI
SEMICON Korea 2026, held in Seoul from February 11–13, brought senior executives from Samsung Electronics and SK Hynix to outline their AI-era memory R&D strategies. Samsung...
Friday 13 February 2026
Samsung said to gain 8nm orders in Europe as 2nm plan advances

Samsung Electronics is said to be expanding its 8nm foundry customer base into Europe following earlier contract wins in the US and Ja...

Friday 13 February 2026
Apple and Samsung solidify their lead as only brands with over 1 billion active users

Chinese smartphone vendors continue to expand global shipments, supported by competitive pricing, sustained research investment, and overseas...

Thursday 12 February 2026
HBM4 first-mover fog: Samsung and Micron duel for supremacy amid Nvidia supply tension
Samsung Electronics has officially commenced the mass production and commercial shipment of its HBM4 memory, marking a pivotal moment in the global semiconductor landscape.