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Tuesday 28 July 2026
Samsung trims Z Fold8 display module 10% using Flex Titanium
Samsung Electronics has introduced Flex Titanium technology in its next-generation foldables, the Galaxy Z Fold8 and Z Fold8 Ultra, cutting display module thickness by 10% to make...
Tuesday 28 July 2026
CXMT's record IPO and Apple talks collide with US curbs as DRAM tightens

AI-driven demand is tightening the global memory market just as China's leading DRAM producer, ChangXin Memory Technologies, or CXMT,...

Tuesday 28 July 2026
SK Hynix enters LPDDR6 production race with Xiaomi first in line
SK Hynix reportedly plans to begin mass production and shipments of LPDDR6 in the second half of 2026, with Xiaomi expected to become its first customer for mobile devices. Industry...
Tuesday 28 July 2026
Samsung eyes Chinese DRAM sourcing to cut costs, expand budget-phone share in China
Samsung Electronics is evaluating the use of lower-cost Chinese DRAM in some smartphones as it seeks to offset rising component costs and regain momentum in China's highly competitive...
Tuesday 28 July 2026
SK Hynix's HBM paradox: DDR5 surge builds leverage for HBM4 price hikes

AI spending is broadening the memory upcycle beyond high-bandwidth memory, lifting prices for conventional DRAM, NAND flash and enterprise...

Tuesday 28 July 2026
Anthropic seeks SK Hynix supply for AI chips, SK chair says

Anthropic has asked SK Hynix to help supply chips for its own in-house AI chip production, SK Group chairman Chey Tae-won said. He...

Tuesday 28 July 2026
Samsung, SK Hynix race to secure chipmaking tools before equipment lead times hit one year
Samsung Electronics and SK Hynix are considering placing semiconductor equipment orders earlier as a global wave of fab investment stretches delivery times for key chipmaking tools...
Tuesday 28 July 2026
From models to chips: Anthropic chip ambitions pull Korea deeper into the AI silicon race
The push toward deeper sovereign control over the critical hardware stack underpinning AI models is gaining traction following news of Anthropic's outreach to SK hynix for supplies...
Monday 27 July 2026
Samsung converts AMD and OpenAI ties into HBM4 supply wins

Samsung Electronics is showing renewed momentum in the AI memory race as it deepens ties with both OpenAI and AMD, two partnerships...

Monday 27 July 2026
Samsung to use 2nm process for HBM5 base die as heat challenge grows

Samsung Electronics plans to manufacture the base die for its next-generation HBM5 memory using a 2nm gate-all-around foundry process,...

Monday 27 July 2026
Samsung’s Broadcom AI chip pact expected to top US$200 billion as Hyundai expands robotics push

Samsung Electronics and Hyundai Motor Group used the San Francisco AI Summit to outline separate artificial intelligence (AI) expansion...

Monday 27 July 2026
Weekly news roundup: Samsung and SK Hynix favor DDR5, Intel accelerates 18A, Alibaba deepens CXMT ties
AI infrastructure, memory and advanced chipmaking led this week's tech agenda, with Intel, Samsung, SK Hynix, CXMT, Alibaba and Foxconn reshaping capacity and supply chains. Below...
Monday 27 July 2026
Samsung bolsters energy team as chip projects test power supply
Samsung Group is recruiting current and former government energy officials for its in-house think tank as electricity infrastructure emerges as a key issue for its semiconductor expansion...
Monday 27 July 2026
Samsung opens preorders for new foldables as Apple entry expected to reshape market
Samsung Electronics has opened preorders for its latest Galaxy Z foldable smartphones and Galaxy smartwatches, introducing new devices as the global foldable smartphone market is expected...
Monday 27 July 2026
eSSD contracts surge as AI data centers shift spending from memory to storage
Enterprise SSDs are emerging as a bigger priority in AI infrastructure as generative AI workloads move from training to inference and data centers need faster storage. Reports from...