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Tuesday 2 June 2026
Samsung signals broader AI memory deployment with HBM5 roadmap and thermal tech
Samsung Electronics has used Computex 2026 to outline a broader AI memory strategy, highlighting HBM5, thermal management, and advanced packaging as it prepares for next-generation...
Tuesday 2 June 2026
South Korea cuts EUV equipment approvals to speed Samsung and SK Hynix expansion
South Korea's Ministry of Trade, Industry, and Energy announced on June 2, 2026, that it would sharply streamline domestic approval procedures for extreme ultraviolet equipment used...
Tuesday 2 June 2026
Broadcom, Samsung launch Wi-Fi 8, 5G platform to bring fiber-grade FWA to mass market
Broadcom and Samsung Electronics have announced a broadband-optimized reference platform for the global fixed wireless access (FWA) market, integrating Broadcom's BCM6776 Wi-Fi 8 system-on-chip...
Monday 1 June 2026
Top memory maker executives gather in Taiwan in preparation for Computex 2026
After Nvidia CEO Jensen Huang wrapped up his "trillion-dollar banquet" for Taiwan AI supply-chain giants, GTC Taipei is set to become a highlight of Computex 2026. Nvidia will also...
Monday 1 June 2026
Nvidia courts Korea's industrial giants ahead of Computex
Nvidia chief executive Jensen Huang's pre-Computex meetings in Taipei are drawing close attention from South Korean companies seeking a bigger role in the global AI supply chain. With...
Monday 1 June 2026
LG denies report on sale to Hisense TV as Chinese rivals gain ground
LG Electronics has denied a Korean media report that it discussed a possible sale or restructuring of its TV business with China's Hisense, as intensifying competition from Chinese...
Saturday 30 May 2026
Samsung tops Micron in automotive memory as AI tightens supply

Samsung Electronics has overtaken Micron Technology to become the world's largest supplier of automotive memory chips for the first...

Friday 29 May 2026
Samsung begins shipment of HBM4E samples as AI memory competition intensifies
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI...
Thursday 28 May 2026
SK Hynix turns Big Tech's memory scramble into tougher supply terms
SK Hynix is using Big Tech's rush to secure artificial intelligence (AI) memory supply as leverage for tougher long-term contracts, while resisting funding structures that could give...
Thursday 28 May 2026
Samsung foundry targets robotics, auto AI chips with Cadence platform
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive...
Wednesday 27 May 2026
Samsung reportedly to expand Vietnam footprint with new memory chip testing plant

Samsung Electronics plans to invest VND39 trillion (approx. US$1.5 billion) in a new semiconductor testing facility in northern Vietnam,...

Wednesday 27 May 2026
Samsung wage deal pushed through by chip workers, widening bonus divide
Samsung Electronics' tentative 2026 wage agreement has cleared a union vote with 73.7% approval, moving a months-long labor dispute closer to settlement while exposing a deeper divide...
Wednesday 27 May 2026
Motorola launches Razr fold in Taiwan as foldable market gains momentum
Motorola launched its Razr foldable in Taiwan on April 26, after first unveiling the device at MWC 2026 in Barcelona in March 2026, and introduced new accessories, including wireless...
Wednesday 27 May 2026
TSMC and Micron's fabs expanding; how do Samsung and SK Hynix's bonus systems come into play?
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement...
Tuesday 26 May 2026
Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has...