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Thursday 1 October 2026
Qualcomm, Samsung redesign chip packaging as heat limits phone performance
Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling...
Thursday 1 October 2026
Honor joins Taiwan foldable phone race with Magic V6
Honor launched its first foldable smartphone in Taiwan, the Magic V6, on September 30, about six months after formally entering the local smartphone market in April 2026. The company...
Thursday 1 October 2026
Samsung Foundry gets boost from HBM4 as 2nm push continues
Samsung Electronics' HBM4 ramp is giving its foundry business a timely boost, as rising demand for the memory product translates into more work for the company's 4nm logic lines.
Thursday 1 October 2026
Jensen Huang wins Van Fleet Award as Nvidia, South Korea trio reunites
Nvidia CEO Jensen Huang attended the Korea Society's annual dinner in New York on September 28 local time and received the 2026 Van Fleet Award, with Samsung Electronics Chairman Lee...
Wednesday 30 September 2026
Samsung expects HPC to account for 66% of foundry business by 2029
Samsung Electronics expects high-performance computing (HPC) to account for 66% of its foundry business by 2029, up from 28% currently, as the company shifts its contract chipmaking...
Wednesday 30 September 2026
AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties
Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory...
Wednesday 30 September 2026
Memory shortage pushes TV semiconductors above panel costs

A global memory shortage linked to rising AI infrastructure spending has upended TV manufacturing economics, with semiconductor costs...

Wednesday 30 September 2026
Apple iPhone Duo revives UDC battle as Samsung weighs trade-offs
Apple has launched its first foldable phone, the iPhone Duo, adopting under-display camera (UDC) technology long used by Samsung Electronics. The move puts all-screen design back at...
Tuesday 29 September 2026
Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5
Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific...
Tuesday 29 September 2026
Samsung Foundry nears 60% 2nm yield, shifts focus to power efficiency to win customers
Samsung Electronics' foundry business has reportedly raised yield on its 2-nanometer (2nm) SF2 process to nearly 60% and is now shifting engineering work toward power efficiency and...
Tuesday 29 September 2026
Samsung bonus plan to lift South Korea talent race

Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance...

Tuesday 29 September 2026
HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5
High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate...
Tuesday 29 September 2026
Meta adds camera-free AI glasses as Samsung prepares 2026 launch
Meta has introduced a camera-free smart glasses model while Samsung Electronics prepares to enter the AI glasses market in 2026, as privacy concerns and product design trade-offs reshape...
Tuesday 29 September 2026
Samsung invests US$1 billion in ex-AWS chief's AI data center venture, joining Nvidia as a founding investor
Six Samsung companies will invest a combined US$1 billion in Helix Digital Infrastructure, a company set up by investment firm KKR to build data centers and the power supply they need...
Tuesday 29 September 2026
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...