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Friday 4 September 2026
China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development

Montage Technology is accelerating its move beyond traditional DDR memory interfaces, with CXL 3.2, DDR6 and PCIe products positioning the...

Friday 4 September 2026
Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...
Friday 4 September 2026
AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

Thursday 3 September 2026
KEPCO seeks US$18 billion from Samsung, SK Hynix to fund Korea's power grid
Korea Electric Power Corp. (KEPCO) has proposed that Samsung Electronics and SK Hynix prepay as much as KRW25 trillion (approx. US$18 billion) in electricity bills as South Korea looks...
Thursday 3 September 2026
Huawei, Xiaomi to launch new foldable smartphones ahead of Apple
Samsung Electronics launched its new Galaxy Z series foldable smartphones, including its first wide-folding model, kicking off this year's foldable smartphone battle. With attention...
Thursday 3 September 2026
CXMT's 'Hefei Project' exposed in Samsung DRAM theft case
South Korean prosecutors allege that Chinese memory maker ChangXin Memory Technologies (CXMT) set up an internal "Hefei Project" in 2016 to obtain Samsung Electronics' core DRAM technology...
Thursday 3 September 2026
SK Hynix wafer purchases jump 104% on AI demand
SK Hynix boosted its silicon wafer purchases in the second quarter of 2026 by more than doubling spending from the previous quarter as it moved early to secure raw materials amid rising...
Thursday 3 September 2026
Global smartphone outlook cut again as foldables shine
Global smartphone shipments are facing renewed downside pressure in 2026 as memory prices rise, handset makers pass on higher costs, and brands trim low-end models to protect margins...
Thursday 3 September 2026
Samsung to add 1,612 new equipment units at Vietnam chip plant
Samsung Electronics is set to install 1,612 brand-new critical semiconductor back-end processing tools manufactured in South Korea at its factory under construction in Vietnam's Thai...
Wednesday 2 September 2026
DRAM giants target 3D stacking to break memory wall and power bottlenecks
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
Wednesday 2 September 2026
Samsung, SK Hynix inventories surge as valuation reserves fall
Samsung Electronics and SK Hynix ended the first half of 2026 holding sharply more inventory than six months earlier, an unusual development in a memory market where demand continues...
Wednesday 2 September 2026
Nvidia pushes into HBM base dies as NVHBM battle heats up
The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
Tuesday 1 September 2026
Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain
Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...
Tuesday 1 September 2026
XCENA teams up with Samsung on rack-scale CXL memory; demos on Intel Xeon 6
South Korean chip startup XCENA is pushing CXL beyond memory expansion and toward a new layer of server computing, unveiling measured results for its MX1 computational memory device...
Tuesday 1 September 2026
Samsung locks 70% of memory output as HBM spot prices soar
Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high...