CONNECT WITH US
NEWS TAGGED SAMSUNG
Tuesday 8 September 2026
US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans
South Korea and the US are discussing semiconductor investments in the US as part of broader bilateral negotiations, bringing US chip tariff policy closer to the investment decisions...
Tuesday 8 September 2026
Xiaomi debuts 18 fold to challenge Huawei and Samsung in wide-screen foldable race
The flagship foldable market has reached a pivotal turning point as tech giants abandon tall, narrow cover screens in favor of wider aspect ratios and custom processing hardware. Xiaomi's...
Tuesday 8 September 2026
US chip investment push puts ownership at center of Korea's $200 billion deal

A US push for additional Korean semiconductor manufacturing investment has entered bilateral negotiations just as the first project under...

Tuesday 8 September 2026
Samsung speeds silicon photonics test plan with TSMC-vetted probe vendors
Samsung Electronics has moved to accelerate its silicon photonics push by using the same test partners selected by Taiwan Semiconductor Manufacturing Co. for key validation work, according...
Tuesday 8 September 2026
Samsung boosts Galaxy A series output as rivals cut lower-end phones
Samsung Electronics has moved to expand production of mid- to low-end smartphones from August to November 2026, according to South Korean media Maeil Business Newspaper. The...
Tuesday 8 September 2026
Samsung allocates more than half of 4nm foundry capacity to HBM4
Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI...
Tuesday 8 September 2026
Privacy displays become a premium smartphone battleground as Huawei brings one to a foldable

Huawei's Mate XT 2 combines an inward-folding tri-fold design with a built-in hardware privacy display, bringing two concepts already prominent...

Monday 7 September 2026
HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days
Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply as AI infrastructure spending drives simultaneous demand for HBM, server DRAM and enterprise...
Monday 7 September 2026
SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
Monday 7 September 2026
Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens
AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion,...
Monday 7 September 2026
No foundry price relief before 2027 as utilization nears 90%

AI demand is driving a broader repricing cycle across the foundry industry in 2026. Tightness that began at leading-edge nodes is spreading...

Saturday 5 September 2026
Samsung, SK chiefs to meet Nvidia's Huang in New York amid US investment pressure
Samsung Electronics Chairman Jay Y. Lee and SK Group Chairman Tae-won Chey are traveling to New York at the end of September 2026 to meet Nvidia CEO Jensen Huang again as Washington...
Friday 4 September 2026
Samsung turns to chips, OLED for next phase of Vietnam expansion
Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end chip substrates, OLED displays and R&D emerging as the next pillars of its presence...
Friday 4 September 2026
China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development

Montage Technology is accelerating its move beyond traditional DDR memory interfaces, with CXL 3.2, DDR6 and PCIe products positioning the...

Friday 4 September 2026
Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...