MediaTek has widened the reach of its 5G modem chips beyond its own smartphone SoC platforms, pushing deeper into overseas sales in...

CXMT is preparing China's largest chip-sector IPO of 2026, seeking up to US$4.3 billion to expand DRAM and HBM capacity, deepen vertical...

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

SK Hynix began mass-production shipments of 12-layer HBM4 to Nvidia at the end of June and is increasing output ahead of a broader...

Samsung Electronics has reportedly completed the tape-out of its version of Tesla's AI5 chip for self-driving systems, with the chip...

Intel is reportedly preparing a new technology roadmap for its next-generation 1.4nm process, 14A2, as it evaluates a hybrid architecture...

Huawei is reportedly partnering with Chinese DRAM maker Shenzhen Shengweixu Technology (SwaySure) and the Chinese government to build...

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from...