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NEWS TAGGED SEMICON TAIWAN 2013
Friday 6 September 2013
3D NAND, FinFET to drive semiconductor equipment market growth, says Applied Materials
With chipmakers engaged in the development of 3D NAND and FinFET technologies, the global semiconductor market is set to expand another 25-35%, said an Applied Materials executive...
Thursday 5 September 2013
SEMICON Taiwan 2013: Scientech showcases in-house developed equipment
Semiconductor equipment distributor and wafer reclamation service provider Scientech is currently showcasing its in-house developed wet-process equipment for 12-inch fabs at the SEMICON...
Thursday 5 September 2013
Fabless-foundry model remains major trend, says Qualcomm executive
The fabless-foundry business model is still a major trend in the semiconductor industry, whereas the IDM model that achieves efficiency through vertical integration has proven it...
Wednesday 4 September 2013
ASE claims to have 15% market share in SiP sector
Out of every 6-7 system-in-package (SiP) devices, one is produced by Advanced Semiconductor Engineering (ASE), according to Ho-Ming Tong, company chief R&D officer. With its complete...
Wednesday 4 September 2013
Globalfoundries growing its 28nm customer base, says CEO
At least more than 12 companies have adopted 28nm chips manufactured by Globalfoundries, said company CEO Ajit Manocha on September 3.
Wednesday 4 September 2013
SEMICON Taiwan 2013: 3D-IC, 450mm and advanced packaging in the spotlight
The 18th annual SEMICON Taiwan trade show has kicked off and will run through Friday at the Taipei World Trade Center Nangang Exhibition Hall, highlighting seven theme pavilions including...
Monday 2 September 2013
SEMICON Taiwan 2013: Forums draw TSMC, Globalfoundries
A series of technology forums will be held at SEMICON Taiwan 2013, which takes palce from September 4-6, to discuss industry trends, challenges and technologies for future semiconductor...