At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
United Microelectronics (UMC) has introduced 28eHV+, the latest advancement in its 28nm embedded high voltage (eHV) technology. The process node is designed for driver ICs used in...
US-based Avalanche Technology, a developer of next-generation MRAM technology, and Taiwan-based foundry house United Microelectronics Corporation (UMC), have jointly announced the...
TSMC at the company's annual technology symposium for North America unveiled its next-generation N2 process powered by nanosheet transistors. N2 is scheduled to begin production in...
Despite recent falls in memory chip prices, Winbond Electronics is poised to generate sequential revenue growth in the second quarter of 2022, according to market sources.
Taiwan-based Faraday Technology, a fabless ASIC service and silicon IP provider partnering mainly with United Microelectronics (UMC), saw its monthly revenue exceed NT$1 billion (US$35.9...
While global chip shortages can hardly ease in the short term and prices continue to rise further, regional semiconductor fleets are quietly taking shape as the US, EU, South Korea,...
Semiconductor revenue in the first quarter of 2021 grew from the previous quarter, marking just the third time that has happened since research firm Omdia began tracking quarterly...
Fueled by economic recovery and the transition to a digital economy, memory IC sales are forecast to top US$180 billion in 2022, exceeding the previous record high set in 2018, according...
ASIC design service and IP provider Faraday Technology has announced its memory compilers based on UMC's 28nm embedded High Voltage (eHV) process technology have been subsequently...
Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.
Imec and Globalfoundries (GF) have jointly announced a hardware demonstration of a new artificial intelligence chip. Based on Imec's analog in memory computing (AiMC) architecture...
Taiwan-based eMemory has announced the availability of NeoFuse IP qualified on United Microelectronics' (UMC) 28nm high-voltage (HV) process for OLED display applications, with key...
Unimos Microelectronics, a re-invested memory backend service affiliate of China's Tsinghua Unigroup, has recently kicked off volume production at its 3D NAND memory chips packaging...
