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Trending topic: Smart manufacturing & Robotics
NEWS TAGGED STEREO
Wednesday 22 July 2020
TWS earbud chip prices fall below US$1
Unit prices for some SoC chips used in true wireless stereo (TWS) earbuds have fallen below US$1, and are still under downward pressure this year due to fierce competition among China-...
Friday 12 June 2020
Connector maker SpeedTech developing more customized products
Connector specialist SpeedTech is striving to venture into the customized business beyond connector products to include chassis for TWS ear buds, other acoustic products and system...
Tuesday 24 December 2019
Rigid-flex PCB makers to sustain robust shipments for AirPods 2 in 1H20
Taiwan PCB makers are expected to maintain strong shipments of rigid-flex boards at least throughout the first half of 2020 to meet robust demand for AirPods 2 and other TWS (true...
Wednesday 27 November 2019
NOR flash supply likely to fall short of demand in 2020
The supply of NOR flash memory is likely to fall short of demand in 2020, with the gap estimated at up to 10%, according to industry sources.
Tuesday 12 November 2019
TWS earbud chip prices fall below US$1.50
Unit prices for SoC chips used in true wireless stereo (TWS) earbuds have fallen below US$1.50 recently, down from US$2.50-3 in the first quarter of 2019, amid growing presence of...
Thursday 3 October 2019
ASE provides SiP for TWS device SoC
Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS)...
Tuesday 17 September 2019
Unitech enjoys brisk rigid-flex PCB shipments for TWS earphones
PCB manufacturer Unitech Printed Circuit Board has seen revenue contribution for rigid-flex board shipments rise from 30% in 2018 to 50% currently, thanks to strong orders for TWS...
Wednesday 28 August 2019
TWS earbud chip prices falling
Unit prices for SoC chips used in true wireless stereo (TWS) earbuds have been falling, due mainly to stiff competition among chip suppliers, according to industry sources.
Tuesday 9 July 2019
Taiwan chipmakers gearing up for 3D sensor market boom
Foundries including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), epitaxial wafer supplier Visual Photonics Epitaxy (VPEC), fabless chipmaker Himax Technologies,...
Thursday 30 May 2019
Unisoc rolls out new solution for TWS headsets
Unisoc has rolled out its new Bluetooth 5.0-certified solution, dubbed RDA5882, to support dual-mode BLE module designs for true wireless stereo (TWS) headsets.
Wednesday 29 May 2019
ZillTek enjoys robust shipments of MEMS microphone chips
Robust shipments of MEMS microphone chips to China have boosted revenues at ZillTek Technology in May, inspiring the Taiwan-based IC designer to expect its monthly and quarterly revenue...
Friday 12 January 2018
Spreadtrum and OmniVision introduce turnkey active stereo 3D camera reference design for smartphones
OmniVision Technologies and Spreadtrum Communications have jointly announced what they call the industry's first turnkey active stereo 3D camera reference design for smartphones....
Tuesday 1 March 2011
National Semiconductor introduces first stereo analog subsystem for mobile handsets with Class G headphone amp and loudspeaker protection
National Semiconductor announced the industry's first stereo analog subsystem with integrated Class G headphone amplifier and automatic level control (ALC) for smartphones and feature...
Friday 2 March 2018
Samsung Galaxy S9, S9+
Samsung Electronics has introduced the Samsung Galaxy S9 and S9+. They are designed with a new dual aperture lens that powers a low light camera, super slow-mo video capabilities and personalized AR emoji. The Galaxy S9 and S9+ deliver an enhanced entertainment experience with stereo speakers tuned by AKG, immersive audio with Dolby AtmosR and a refined edge-to-edge Infinity Display 1 - a key staple in Samsung's design heritage, according to the vendor. In addition, the Galaxy S9 and S9+ will come with the new SmartThings app, which unites Samsung's existing IoT services into one single, smart experience. The Galaxy S9 and S9+ will be available starting on March 16, 2018 in select markets.
Thursday 8 September 2016
Apple iPhone 7 and 7 Plus
Apple has introduced the iPhone 7 and iPhone 7 Plus. The iPhone 7 series, the first water and dust resistant iPhone, will be available in more than 25 countries beginning September 16. The iPhone 7 features a 12-megapixel camera with a f/1.8 aperture and 6-element lens. The iPhone 7 Plus features the same 12-megapixel wide angle camera as iPhone 7 and adds a 12-megapixel telephoto camera that together offer optical zoom at two times and up to 10 times digital zoom for photos. Coming later in 2016, the dual 12-megapixel cameras also enable a new depth-of-field effect, using both cameras on iPhone 7 Plus to capture images, while sophisticated technology including Machine Learning separates the background from the foreground.
Jul 23, 10:33
Chenbro launches the RM252/RM352 series server chassis to empower small base stations deployment in telecommunications
Tuesday 13 July 2021
MOBI standards guide innovation in blockchain services for growth in smart mobility industry
Wednesday 7 July 2021
ADLINK helping manufacturers upgrade businesses with private 5G network-enabled smart manufacturing solutions
Wednesday 7 July 2021
Coretronic leverages strengths to enable smart manufacturing
TSMC dossier (8): Can China establish leadership in semiconductor sector?
Mitac sees 52-week lead time for server component deliveries
Is GF a good buy for Intel?
Chip probing houses to gain from new iPhone SE series, say sources
Intel GF buyout unlikely, sources say
Google, VW, Toyota keen to develop car operating systems
Bluetooth LBS apps getting popularity for COVID tracking, says Digitimes Research
Development of on-device AI chips for smart speakers gaining momentum
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