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Thursday 19 December 2024
Fraunhofer presents upHear Flexible Rendering: delivering immersive audio to all speakers at CES 2025
Fraunhofer Institute for Integrated Circuits (Fraunhofer IIS), a leading developer of advanced audio technologies, including mp3 and AAC, will present at CES 2025.
Tuesday 7 February 2023
Nodar innovates stereo vision calibration for autonomous vehicles
Stereo vision, first utilized as far back as in the late 1800s, is now entering the autonomous driving space. Nodar, a Boston-based software company, is developing an algorithm to...
Wednesday 22 July 2020
TWS earbud chip prices fall below US$1
Unit prices for some SoC chips used in true wireless stereo (TWS) earbuds have fallen below US$1, and are still under downward pressure this year due to fierce competition among China-...
Friday 12 June 2020
Connector maker SpeedTech developing more customized products
Connector specialist SpeedTech is striving to venture into the customized business beyond connector products to include chassis for TWS ear buds, other acoustic products and system...
Tuesday 24 December 2019
Rigid-flex PCB makers to sustain robust shipments for AirPods 2 in 1H20
Taiwan PCB makers are expected to maintain strong shipments of rigid-flex boards at least throughout the first half of 2020 to meet robust demand for AirPods 2 and other TWS (true...
Wednesday 27 November 2019
NOR flash supply likely to fall short of demand in 2020
The supply of NOR flash memory is likely to fall short of demand in 2020, with the gap estimated at up to 10%, according to industry sources.
Tuesday 12 November 2019
TWS earbud chip prices fall below US$1.50
Unit prices for SoC chips used in true wireless stereo (TWS) earbuds have fallen below US$1.50 recently, down from US$2.50-3 in the first quarter of 2019, amid growing presence of...
Thursday 3 October 2019
ASE provides SiP for TWS device SoC
Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS)...
Tuesday 17 September 2019
Unitech enjoys brisk rigid-flex PCB shipments for TWS earphones
PCB manufacturer Unitech Printed Circuit Board has seen revenue contribution for rigid-flex board shipments rise from 30% in 2018 to 50% currently, thanks to strong orders for TWS...
Wednesday 28 August 2019
TWS earbud chip prices falling
Unit prices for SoC chips used in true wireless stereo (TWS) earbuds have been falling, due mainly to stiff competition among chip suppliers, according to industry sources.
Tuesday 9 July 2019
Taiwan chipmakers gearing up for 3D sensor market boom
Foundries including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), epitaxial wafer supplier Visual Photonics Epitaxy (VPEC), fabless chipmaker Himax Technologies,...
Thursday 30 May 2019
Unisoc rolls out new solution for TWS headsets
Unisoc has rolled out its new Bluetooth 5.0-certified solution, dubbed RDA5882, to support dual-mode BLE module designs for true wireless stereo (TWS) headsets.
Wednesday 29 May 2019
ZillTek enjoys robust shipments of MEMS microphone chips
Robust shipments of MEMS microphone chips to China have boosted revenues at ZillTek Technology in May, inspiring the Taiwan-based IC designer to expect its monthly and quarterly revenue...
Friday 12 January 2018
Spreadtrum and OmniVision introduce turnkey active stereo 3D camera reference design for smartphones
OmniVision Technologies and Spreadtrum Communications have jointly announced what they call the industry's first turnkey active stereo 3D camera reference design for smartphones....
Tuesday 1 March 2011
National Semiconductor introduces first stereo analog subsystem for mobile handsets with Class G headphone amp and loudspeaker protection
National Semiconductor announced the industry's first stereo analog subsystem with integrated Class G headphone amplifier and automatic level control (ALC) for smartphones and feature...