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NEWS TAGGED TAISOL
Monday 1 July 2024
Taisol sees increasing trend in use of liquid cooling
Liquid cooling is widely used in newly built data centers, and L2L (liquid to liquid) architecture has been widely adopted, according to Taiwan-based cooling module maker Taisol El...
Friday 7 June 2024
Uneec teams up with TaiSol for liquid cooled AI server solutions
As AI servers continue to drive momentum, some companies have been teaming up in pursuit of potential opportunities. As an example, server chassis maker Chenming Electronic Tech (aka...
Monday 17 January 2022
Taiwanese cooling module makers to see growing sales in 2022
Taiwan-based cooling module makers are expected to see growing sales from the server sector in 2022 as demand for liquid cooling solutions has continued rising, according to sources...
Tuesday 23 June 2020
Cooling module makers expect vapor chamber demand from 5G phones to emerge in 2021
Taiwan-based cooling module providers remain optimistic about sales prospects of vapor chamber (VC) products for applications in 5G phones in 2021 although their expectations for...
Wednesday 10 June 2020
Cooling solution makers expect shipments for GPUs, smartphones to pick up in 2H20
Taiwan-based suppliers of cooling solutions for IT products expect demand from the graphics card and smartphone sectors to drive their sales momentum in the second half of 2020, having...
Tuesday 28 April 2020
Taiwan makers gearing up for 0.3mm-thick vapor chamber shipments
Taiwan-based smartphone cooling module specialists are capable of producing vapor chambers with thickness of only 0.3mm and will begin shipping the cooling solutions for smartphones...
Tuesday 29 October 2019
Samsung, Huawei embracing VC cooling solutions for smartphones
Use of vapor chamber cooling modules for smartphones is set to expand significantly in 2020 as Samsung Electronics and Huawei are likely to have all of their 5G phones slated for...
Monday 15 July 2019
Taiwan cooling solution providers poised for robust growth
Taiwan's cooling module suppliers are set for robust growth in 2020 and beyond driven by demand for heatpipe- or vapor chamber (VC)-based heat dissipation solutions from the smartphone...
Thursday 11 July 2019
Vapor chamber to account for 50% of smartphone cooling module shipments in 2H19
With rising heat dissipation demand from major vendors including Samsung Electronics, LG Electronics, Huawei, Oppo and Xiaomi for their 5G smartphones, half of cooling module shipments...
Friday 30 January 2015
Thermal module maker Taisol looks to 10-15% revenue growth in 2015
Connector and notebook thermal module supplier Taisol Electronics is expected to see its revenues grow 10-15% in 2014 from NT$2.63 billion (US$83.37 million) recorded a year earlier,...