CONNECT WITH US
NEWS TAGGED WIRE-BOND CSP
Thursday 21 August 2008
Kinsus trims gross margin guidance slightly amid product mix adjustment
Kinsus Interconnect Technology, which previously guided that its gross margins may hit 30% in the third quarter, revised its guidance to 27-28% as bookings for bismaleimide triazine...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research