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NEWS TAGGED EDGE COMPUTING
Thursday 16 February 2023
Chinese startup Cambricon gets new funds to advance 7nm chips for ChatGPT-like applications
China-based AI chip startup Cambricon Technologies, already listed on the Sci-Tech Innovation Board of the Shanghai Stock Exchange, recently has been approved to issue CNY1.672 billion...
Thursday 16 February 2023
IDC forecasts edge computing investments to reach US$208 billion in 2023
Worldwide spending on edge computing is expected to be US$208 billion in 2023, an increase of 13.1% over 2022. Enterprise and service provider spending on hardware, software, and...
Thursday 2 February 2023
IC design houses worst hit among Chinese semiconductor firms in 2022
Up to 41 out of 80 Chinese semiconductor firms that have released financial statements for 2022 ended the year with operating losses. IC design houses were the worst hit due to multiple...
Wednesday 28 December 2022
Server industry core to stabilizing electronics supply chain in 2023
The server market maintained its strong growth momentum in 2022, as the post-pandemic demand for remote and cloud services remains high. Although the global economic situation has...
Wednesday 14 December 2022
Apacer, Adlink partner to accelerate AIoT deployment
Memory module maker Apacer Technology is teaming up with Industrial PC specialist Adlink Technology to develop rugged-level edge computing solutions for AIoT device applications,...
Monday 12 December 2022
2023 Outlook: Server demand to remain in steady growth
Compared to the PC industry's deceleration, the server industry is expected to enjoy an on-year shipment growth in 2022 and another increase in 2023 as consumers' usage of Internet...
Thursday 17 November 2022
AI may dominate mobile SoC competition between Qualcomm and MediaTek
Qualcomm highlights AI technology breakthroughs in its latest flagship mobile SoC Snapdragon 8 Gen 2 unveiled at Snapdragon Summit 22, suggesting that AI computing capability will...
Monday 7 November 2022
US foundry SkyWater announces progress in reshoring advanced packaging capability
US-based foundry SkyWater Technology has completed the first phase of its program to establish silicon interposer manufacturing, according to an announcement on November 3. The program,...
Friday 28 October 2022
Rohm unveils on-device learning AI SoC with ultra-low power consumption
Japan-based Rohm Semiconductor has newly launched a prototype SoC featuring an on-device learning AI accelerator, which can instantly predict the failure of electronic devices such...
Thursday 20 October 2022
China still capable of developing edge AI chips
Despite the US' latest restrictions on exports of advanced-node chips and related manufacturing equipment to China, China will still be capable of developing its homegrown AI chips...
Tuesday 6 September 2022
Supply chain restructuring and resilience
In "The New Critical Era of Supply Chains Restructuring and Resilience Strengthening" forum hosted recently by DIGITIMES Asia, experts from IC distributors - WPG Holdings' chief marketing...
Friday 5 August 2022
Asustek, Intel jointly unveil 5G AI Ready Platform
Asustek Computer and its affiliate Taiwan Web Service (TWS) have launched a 5G AI Ready Platform in cooperation with Intel and Taiwan Mobile, looking to integrate AI, 5G and edge...
Thursday 21 July 2022
Digital transformation in industries continues, says HPE
In spite of global supply chain constraints, demand remains strong for digital transformation across industries, including semiconductor, optical electronics and other high-tech segments...
Friday 15 July 2022
Allxon unveils SaaS-in-chip turnkey solution
Allxon, a startup engaged in development of Internet-connected edge devices management solutions, has unveiled a SaaS-in-chip turnkey solution that can help IC and industrial computer...
Thursday 14 July 2022
SaaS solutions to enhance ICT product value, says Nvidia executive
Taiwan ICT players should develop value-added software services to turn industry pain points into solutions if they want to better explore the edge computing market, according to...