Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
Suppliers of antenna-in-package (AiP) substrates for Apple's new iPhones are gearing up for a ramp-up in demand for mmWave models, according to industry sources.
Taiwan-based IC substrate maker Nan Ya PCB is poised to generate sequential revenue increases through the fourth quarter of 2021, as robust ABF-based as well as BT substrate demand...
TSMC and other Taiwan partners in the chips supply chain for iPhones are gearing up to start fulfilling initial orders for new iPhones slated for launch later this year including...
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Testing house Sigurd Microelectronics is optimistic about its business outlook for 2021, as testing demand for related chips for 5G phone, networking, automotive and AI applications...
Taiwan's top test interface specialist Chunghwa Precision Test Tech (CHPT) and TSMC's re-invested backend house Xintec are both optimistic about their revenue prospects for fourth-quarter...
Taiwan's backend houses ASE and affiliated Siliconware Precision Industries (SPIL) reportedly have landed orders for Qualcomm's Snapdragon X60 modem chips while GaAs foundry Win Semiconductors...
First-tier chip designers and PC brand vendors have begun cooperation to develop notebooks with integrated antenna-in-package (AiP) modules to support both sub-6GHz and mmWave 5G...
Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven...
Taiwan-based IC backend houses plan to implement their capacity expansion projects in 2020 to satisfy growing demand for more complex chip designs and high-end testing, according...
Taiwan-based IC substrates suppliers are poised to benefit from Apple's move to adopt both TSMC's InFO_AiP (antenna in package) technology and ASE's FC_AiP process to package its...
Taiwan's backend leader Advanced Semiconductor Engineering (ASE) has reportedly broken into the supply chain for Apple's mmWave 5G iPhones and 5G iPads with its substrate-based FC_AiP...
TSMC's backend antenna-in-package technology, dubbed InFO-AiP, has attracted orders from US-based clients for packaging 5G mmWave devices, with volume production set to kick off next...
