Huawei reportedly mimics Apple by designing a chip with shared memory to improve its chip performance amid US sanctions and develop its in-house chip infrastructure ecosystem.
Despite its long presence in the market, AI has struggled to deliver a profitable model. Advantech Chairman K.C. Liu believes that the continuous wave of AI innovation over the past...
China is keenly positioning itself as a global frontrunner in autonomous driving technology. Strong government support coupled with intense competition among major cities has cultivated...
The US government is considering imposing restrictions as early as August to restrict China's access to crucial High Bandwidth Memory (HBM) chips and related manufacturing equipment...
Intel reported a US$1.6 billion net income loss in the second quarter, a significant decline compared with the US$1.48 billion in net income it recorded during the same period in...
Compound semiconductor epitaxial wafer (epi-wafer) manufacturer IQE is swiftly adjusting its global strategy by expanding outside its UK base in response to geopolitical volatility...
IQE, a leading British manufacturer of compound semiconductor epitaxial wafers (epi-wafer), has announced that its Taiwanese operating subsidiary IQE Taiwan will launch an initial...
E Ink Holdings (E Ink) and Himax Technologies (Himax) have jointly unveiled the next-generation color e-paper timing controller, an ASIC T-Con named T2000.
On July 27, at the Stanford Memorial Auditorium, Professor Mau-Chung Chang, co-founder of Kneron, a provider of edge AI solutions, was awarded the inaugural 2024 Asian American Pioneer...
FOPLP has emerged as the primary force in Innolux's transformation and has also gained significant attention since TSMC disclosed its intention to develop it. However, FOPLP is still...
The server industry supply chain is undergoing a rapid transformation, with the most noticeable changes being in the shift toward liquid cooling from air cooling technology, driven...
FuriosaAI Inc. is pleased to announce its collaboration with GUC (Global Unichip Corporation) as a key partner on the secondgen AI accelerator, RNGD (pronounced "Renegade"), the most...
ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to...
