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Monday 9 September 2024
High-NA EUV adoption hampered by cost, mass-production on track for 2026
Despite ASML being the sole provider of high-NA EUV systems, customer adoption is affected by the high price, as ASML aims to begin mass production of the system by 2026.
Friday 30 August 2024
Giantplus pushing more applications for in-house developed OTFT backplane
Taiwanese panel manufacturer Giantplus Technology is actively developing applications using its organic thin-film transistor (OTFT) backplanes, such as smart wearables and medical...
Tuesday 9 July 2024
Giantplus starts production of flexible OTFTs, marking a breakthrough in the field
The world's first consumer electronic product using organic thin-film transistor (OTFT) technology, the Ledger STAX, has begun shipping.
Thursday 7 December 2023
Taiwan chip foundries' existing China investment not affected by latest core key tech ban
Advanced semiconductor manufacturing technology under 14nm was included in the list of 22 key core technologies to be banned from illegal outflows to foreign adversaries on December...
Tuesday 17 October 2023
Hybrid bonding technology crucial for realizing 3D DRAM
Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes...
Tuesday 15 August 2023
Samsung reveals current situation and challenges of BSPDN, a key technology in the 2nm race
As TSMC and Intel announced in succession that they are conducting R&D for the back-side power delivery network (BSPDN) technology, Samsung Electronics recently shared the current...
Thursday 27 July 2023
Samsung reportedly investing in R&D for 3D stacking GAA technology
After memory products like NAND Flash and DRAM, it's reported that Samsung Electronics will conduct R&D for a "3D stacking" technology that can vertically stack system semiconductor...