Micron Technology expects to kick off volume production of HBM3E memory at its factory site in Taiwan, which the memory chipmaker considers a hub for advanced packaging, in the first...
The memory market is still slow. Operating losses at SK Hynix continued in the third quarter of 2023, but the quarterly loss was reduced by 37.8%. Despite this, its DRAM division...
Samsung Electronics has recently released its new-generation memory solutions aimed at the generative AI and large language model (LLM) markets, including the fifth-generation high-band...
Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor,...
The demand for high bandwidth memory (HBM) is poised to experience explosive growth starting in 2024, fueled by its incorporation into servers hosting large language models like ChatGPT...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
As generative AI keeps driving demand for high bandwidth memory (HBM), the global DRAM market landscape is also undergoing changes, with SK Hynix's global DRAM market share exceeding...
The proliferating artificial intelligence (AI) applications are generating significant growth potential in demand for next-generation high bandwidth memory (HBM) chips, driving South...
High-end AI server shipments are forecast to reach 337,000 units in 2024, with the generative AI market reaching US$109 billion by 2030, at a compound annual growth rate (CAGR) of...
