Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...

The AI boom is driving chipmaking advancements, with Co-Packaged Optics (CPO) promising to stake a claim as a favored semiconductor packaging technology along with CoWoS.

InnoCare Optoelectronics (INCX), a subsidiary of panel maker Innolux that specializes in the development of flat panels for medical applications, is collaborating with Smart Chain...