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    Thursday 3 September 2026
    BYD Semiconductor scales 4D radar chip for L2-L4 driving, deepening its in-house automotive sensing stack
    BYD Semiconductor has begun mass production of a new automotive-grade 4D millimetre-wave radar chip built around its Xuanji A3 intelligent-driving architecture, expanding its in-house...
    Thursday 3 September 2026
    Lutnick confirms chip tariffs are coming, with relief tied to manufacturing in America
    US Commerce Secretary Howard Lutnick has confirmed that the Trump administration is preparing a new round of semiconductor tariffs built around an exemption for companies that manufacture...
    Thursday 3 September 2026
    Auras sees ASIC revenue reaching 50% in 2027, eyes microchannel cooling production in 2028
    Cooling specialist Auras Technology is expanding from GPU platforms to ASIC-related products as its next growth driver, amid the ongoing shift toward liquid cooling in AI servers,...
    Thursday 3 September 2026
    JPC Connectivity sees AI demand driving orders into 2027 as margins benefit from longer lead times
    JPC Connectivity said demand tied to artificial intelligence infrastructure continued to strengthen in the second quarter of 2026, lifting orders for optical communications, high-speed...
    Thursday 3 September 2026
    Samsung to add 1,612 new equipment units at Vietnam chip plant
    Samsung Electronics is set to install 1,612 brand-new critical semiconductor back-end processing tools manufactured in South Korea at its factory under construction in Vietnam's Thai...
    Thursday 3 September 2026
    SEMICON Taiwan 2026: Physical AI drives new demand for multimodal robot sensing
    The rise of physical AI is creating a new wave of demand for advanced sensors as robots move from controlled demonstrations toward practical deployment. Industry experts at SEMICON...
    Wednesday 2 September 2026
    EU EV battery recycling still lacks a profitable model
    The European Union is pushing to strengthen domestic second-life battery production and recycling loops, but EV battery recycling still faces a contradiction: the technology is maturing,...
    Wednesday 2 September 2026
    Samsung, SK Hynix inventories surge as valuation reserves fall
    Samsung Electronics and SK Hynix ended the first half of 2026 holding sharply more inventory than six months earlier, an unusual development in a memory market where demand continues...
    Wednesday 2 September 2026
    Semicon Taiwan 2026 to test cloud AI investment boom
    Cloud AI capital expenditure continues to shatter market expectations, sparking growing concerns over whether the spending surge is overheating and heading toward a bubble. Semicon...
    Wednesday 2 September 2026
    Meta reportedly taps SeeYA for Phoenix OLEDoS panels as BOE fails to qualify

    Meta has reportedly tapped Chinese microdisplay maker SeeYA Technology to supply OLED-on-silicon (OLEDoS) panels for its next-generation...

    Wednesday 2 September 2026
    SDC to expand foldable iPhone OLED mass production in September
    Samsung Display (SDC) is expected to formally expand mass production of OLED panels for Apple's foldable iPhone starting in September 2026. Although the ramp-up for the foldable iPhone...
    Wednesday 2 September 2026
    UMC targets 12-inch TFLN to break 400G SiPh bottleneck
    As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest...
    Wednesday 2 September 2026
    Innolux targets advanced packaging with debut of Chip Last tech
    Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...
    Wednesday 2 September 2026
    Panasonic reportedly raises CCL and PP prices again as IC substrate costs jump 30%
    Japan's Panasonic has raised PCB material prices for the second time in 2026, broadening the increases to copper-clad laminate (CCL), pre-preg (PP) and other products, including IC...
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers

    As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly....

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    BIZ FOCUS
    Oct 23, 08:00
    AI Wealth Management: MaiCoin Leverages Startup Energy for Next-Gen Fintech
    Thursday 22 October 2026
    HOYA BIT Explores AI Data Analysis Solutions for Smarter Trading
    Wednesday 21 October 2026
    Starting with Data Challenges: TS Holdings Explores AI Through Hackathon
    Tuesday 20 October 2026
    Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency