SiC chip prices in China are expected to fall by as much as 30% in the next two years, according to industry sources.

Unimicron, Taiwan's leading ABF carrier board manufacturer, is experiencing a gradual recovery in the semiconductor industry as consumer electronics and PC/NB products return to their...

Taiwan's top-3 pure-play foundries -- TSMC, United Microelectronics (UMC), and Vanguard Semiconductor International (VIS) – are outperforming their global competitors, achieving...

FuriosaAI Inc. is pleased to announce its collaboration with GUC (Global Unichip Corporation) as a key partner on the secondgen AI accelerator, RNGD (pronounced "Renegade"), the most...

Recognizing the persisting headwinds in the current MCU market conditions, Holtek Semiconductor expects flat sequential revenue and gross margin growth in the third quarter of 2024...

ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to...

Gus Technology, a Taiwanese battery OEM and custom battery service provider, has announced plans to build an electric vehicle battery manufacturing plant in Indonesia. This move is...

Yageo believes AI will fuel passive component demand, with operations improving further in the third quarter of 2024.

Chipmaker Macronix International expects its NOR flash sales to return to a growth track in the second half of 2024, with a recovery in prices.

Samsung Electronics announced its financial results for the second quarter of 2024, reporting revenue of KRW74.07 trillion (approximately US$53.3 billion) and an operating profit...

Taiwan Fertilizer Company (TFC) is accelerating its industrial transformation by forging new partnerships with major international firms from Japan and South Korea, focusing on ammonia...

Backend house Powertech Technology (PTI), with its fan-out panel-level packaging (FOPLP) technology, is targeting AI SoC market potential, and expects AI-related revenue to account...

Teco Electric and Machinery (Teco) and China Steel Corporation (CSC) have partnered to supply EV components to India's growing electric bus market.

Samsung Electronics is preparing to launch its slimmest high-end foldable smartphone yet, the Galaxy Z Fold6 Slim. According to recent reports, this new model will boast a thickness...

Automotive component supply-chain stakeholders say they are seeing the disruptions brought by the Russo-Ukraine war on the international industry gradually fading.