While SiP substrates are increasingly needed to support function upgrades on wearables, TWS earbuds and other devices, rigid-flex PCBs will firmly stay as mainstream applications...
Chip demand for PCs from China will pick up substantially in 2020 due to large-scale replacement of PCs by the government and military sectors, providing huge business opportunities...
Taiwan-based HDI PCB manufacturers have put increased focus on non-handset applications to improve product portfolios, which is expected to drive up their quotes and profitability...
Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen their shipments ramp up in most of fourth-quarter 2019 with...
Chinese handset vendors are keen on utilizing anylayer HDI boards as mainboards for high-end smartphones adopting 7nm APs, and Taiwan-based PCB makers including Compeq Manufacturing...
Taiwan-based PCB and IC substrate supplier Unimicron Technology has disclosed plans to invest a total of about US$74.9 million for capacity expansions at its plants in China in 202...
Taiwan-based PCB makers are planning to maintain normal production during the Lunar New Year holidays in late January thanks to clear visibility of orders from Apple and Chinese handset...
Supply of HDI (high-density interconnect) boards has fallen short of demand in the second half of 2019, with Taiwan makers having to reschedule shipments to fulfill mounting orders...
Nan Ya PCB has disclosed plans to invest an additional US$48 million in its factory in Kunshan, China, where the Taiwan-based company will expand ABF substrate production capacity...
High-density interconnection (HDI) PCB specialists including Compeq Manufacturing and Tripod Technology are both scheduled to have their new production capacities come online in 2021...
Taiwanese PCB maker Zhen Ding Technology (ZDT) and Austrian peer AT&S are expected to together land at least 50-60% of substrate-like PCB orders for Apple's next iPhones to be...
Taiwan's Kinsus Interconnect Technology and Nan Ya PCB are both reportedly among SiP (system in package) substrate suppliers for Apple's just-unveiled AirPods Pro series, which adopt...
ABF substrate demand will stay robust throughout 2020 and beyond thanks to a diversity of applications arising with the advent of the 5G era, according to Jiang Xugao, a PCB expert...
Taiwan semiconductor backend supply chain players are poised to ramp up their shipments and revenues in line with aggressive rollout of diverse 5G chip solutions by major chipmakers,...
Taiwan-based PCB suppliers are expected to see their HDI board production lines running at full capacity through the end of 2019, bolstered by upgrades in smartphone mainboards, according...
