IC packaging and testing house Sigurd Microelectronics has broken ground on a new factory building located next to its existing production site in Hsinchu, northern Taiwan, according...
Taiwan Semiconductor Manufacturing Company (TSMC) does not recognize itself as a beneficiary of increased outsourcing by Japan-based IDMs, which have seen production at their domestic...
The total market for semiconductor packaging and testing services grew 17.7% to US$44.755 billion in 2010, according to Digitimes Research. This represents the largest growth since...
United Microelectronics Corporation (UMC) has reached an agreement with Sanken Electric, under which the pure-play foundry will manufacture power semiconductor products for the Japan-based...
Semiconductor industry capital spending is becoming more concentrated, with a greater percentage of spending coming from a shrinking number of companies, according to IC Insights...
Total chip inventory throughout the supply chain has slid to a safety stock level, after one quarter of inventory corrections at companies, according to sources at IC distributors,...
Advanced Semiconductor Engineering (ASE) has internally raised its capex budget to US$900 million for 2011 from the US$700 million estimated originally, according to a Chinese-language...
The now well known trend of IC manufacturers abandoning the IDM fab business model to become fabless or fab-lite has resulted in, or is the result of, depending on the point of view,...
Foundry chipmaker Semiconductor Manufacturing International Corporation (SMIC) has grabbed more chip orders targeted mainly at China from international IDM companies, according to...
Powerchip Technology has already delivered samples of NAND flash chips built using a 40nm process to clients, according to the company, adding that its flash business will target...
Chip packager Siliconware Precision Industries (SPIL) saw consolidated revenues total NT$15.48 billion (US$530 million) in the fourth quarter of 2010, down 5.1% sequentially and meeting...
Fifteen wafer fabs were shut down in 2010 and eight more will see a similar fate in 2011, according to SEMI. As more IDM companies aim to cut costs and become fab-lite and fabless,...
Wafer probing service companies King Yuan Electronics Company (KYEC) and Ardentec will see better than expected revenues in the first quarter of 2011 despite the period being the...
IC packaging and testing houses will see demand for the first quarter of 2011 stronger than the same period in previous years, when revenues were usually dragged down by 10-15% sequentially,...
IC backend testing and assembly firm King Yuan Electronics Company (KYEC) expects more than 30% of its revenues to come from international IDM clients in 2011, up from 25% in 2010,...
