Professor Alberto Sangiovanni-Vincentelli is a legend of the electronic design automation (EDA) industry, but his stories were seldom told. DIGITIMES Asia is privileged to have this...
3D IC technology has emerged as a significant advancement in the semiconductor industry. Despite its significance, there are still a number of unresolved issues and challenges that...
Cadence Design Systems and Rambus, a premier chip and silicon IP provider making data faster and safer, today announced that they have entered into a definitive agreement for Cadence...
According to Intel, Boeing and Northrop Grumman have joined phase two of the Department of Defense's RAMP-C program, which aims to facilitate a leading-edge US foundry ecosystem on...
Samsung Electronics has disclosed its latest advanced process development roadmap at the just-ended 2023 Samsung Foundry Forum, with plans to mass produce 2nm chips by 2025 and commercialize...
The global AI market is expanding at a rapid and unprecedented pace, transforming the semiconductor industry at the same time. As the demand for high-performance chips increases with...
Cadence Design Systems, Inc. (Nasdaq: CDNS) and Saigon High-Tech Park (SHTP), the leading high-tech hub in Vietnam, today announced a collaboration to foster electronic design expertise...
Major memory suppliers Samsung Electronics and SK Hynix reportedly are gearing up to develop CXL (compute express link)-based memory solutions, and the integration of CXL technology...
United Microelectronics (UMC) and Cadence Design Systems have jointly announced that the Cadence 3D-IC reference flow has been certified for UMC's chip stacking technologies.
With the increasing diversity of end-use applications, IC design houses are facing increasing challenges in product design, and how to shorten the time to market for new products...
Former US president Donald Trump successfully prevented ASML from shipping its EUV lithography machines to China in 2019, and talks of further extending the ban to DUV machines have...
Cadence Design Systems' analog and mixed-signal (AMS) IC design flow has been certified for United Microelectronics' (UMC) 22ULP/ULL process technologies, according to the companies...
Intel Corporation has announced that Tan Lip‑Bu, the 2022 recipient of a prestigious award from the Semiconductor Industry Association (SIA), will join the company's board of...
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
The technological benefits that the 3D stacking of integrated circuits brings have the potential to ease the current chip shortage concerns, according to Cadence Design Systems. As...
