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Tuesday 27 August 2024
South Korea launches initiative to support tech firms following ASML model
The South Korean government is rolling out a "Super eul" initiative to foster companies in the materials, components, and equipment sectors. This ambitious plan includes targeted...
Tuesday 27 August 2024
Hua Hong accelerates 12-inch fab expansion, aims to boost overseas orders by 2025
Hua Hong Group, one of China's two major semiconductor foundries, trails behind Chinese industry leader SMIC in terms of both capacity and market share, holding a global market share...
Tuesday 27 August 2024
Intel slashes marketing budget as AMD presses for market shift
Intel's Sales and Marketing Group (SMG) reportedly plans to streamline its workforce and reduce marketing expenses, aiming to cut costs by over 35% by the end of 2024.
Tuesday 27 August 2024
China-South Korea Semiconductor Fund fuels Wuxi's rise as a hub for South Korean chip firms
With TSMC expanding its presence in the United States, Japan, and Europe, many suppliers have followed suit, venturing abroad to establish new operations.
Tuesday 27 August 2024
Canon, front-end equipment makers shift focus to advanced AI chip packaging solutions
AI chips required by generative AI rely on finely wired and processed equipment; thus, front-end process equipment manufacturers have shifted their focus to the advanced packaging...
Tuesday 27 August 2024
India expands partnership with Singapore to include semiconductors and advanced manufacturing
Following a semiconductor collaboration with Malaysia, India further expanded its partnership with Singapore to include advanced manufacturing, semiconductors, aviation, and other...
Tuesday 27 August 2024
Manz AG anticipates growth in advanced packaging amid CoWoS shortage
The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...
Tuesday 27 August 2024
China-based OSAT major delivers strong performance in 1H24
JCET, a leading Chinese semiconductor packaging and testing services provider, has announced impressive financial performance for the first half of 2024. The company reported a significant...
Tuesday 27 August 2024
Taiwan-based lead frame manufacturers pivot to AI and automotive sectors amid recovery
Taiwan's lead frame manufacturers are showing signs of recovery, with a strategic focus on high-margin industries such as automotive electronics and high-end servers to boost profitability...
Monday 26 August 2024
Kaynes SemiCon secures India's first paying OSAT customer for advanced semiconductor packaging
Kaynes SemiCon, a wholly owned subsidiary of Kaynes Technology, has signed a landmark memorandum of understanding (MoU) with Lightspeed Photonics, securing India's first paying customer...
Monday 26 August 2024
Former TSMC executive set to depart Samsung after two years as advanced packaging division restructures
In early 2023, Samsung Electronics welcomed former TSMC deputy director Jing-cheng "Vic" Lin to lead an advanced packaging task force to compete against TSMC. However, industry insiders...
Monday 26 August 2024
TSMC Kumamoto branch shows investment efficiency, expands general manufacturing
Three years since the Japanese government's decision in 2021 to support Taiwan's large foundry company, TSMC, in establishing a factory in Kumamoto, Kyushu has not only seen growth...
Monday 26 August 2024
Weekly news roundup: Intel's 18A under fire for yield; US Chips Act scale now bigger than China Big Fund II
These are the most-read DIGITIMES Asia stories in the week of August 19 – August 23.
Monday 26 August 2024
Nankai Trough earthquake threatens Japan's semiconductor industry
A major earthquake struck off the coast of Miyazaki Prefecture, Japan, on August 8. Although the industrial impact was relatively minor, the Japanese government warned that this event...
Monday 26 August 2024
India roundup: India sees healthy PC demand in 2Q24
As global PC vendors are grappling with high inventories, India experienced healthy growth in PC shipment. The Indian government may focus on compound semiconductors and silicon photonics...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research