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Tuesday 23 April 2024
TSMC optimizes 3/5/7nm equipment conversion amid AI surge, with 5nm emerging as primary profit driver
In the dynamic realm of AI, TSMC has secured the vast majority of customer orders, and foundry quotes now surpassing US$10,000 per wafer are primarily centered on the lucrative process...
Tuesday 23 April 2024
Rohm and STMicroelectronics extend SiC wafer supply contract
Rohm and STMicroelectronics have extended their previously signed supply contract for Silicon Carbide (SiC) wafers for several more years.
Tuesday 23 April 2024
Taiwan's HSP poised to expand after new phase preliminary review
Taiwan's Hsinchu Science Park (HSP) is set to expand after a new phase of preliminary evaluation was eventually approved by appropriate government bodies.
Tuesday 23 April 2024
US DoD selects Intel Foundry for phase-3 RAMP-C
The US Department of Defense (DoD) has selected Intel Foundry for phase three of its Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program.
Tuesday 23 April 2024
Samsung's 2.5D packaging still has last mile to cross before getting Nvidia orders
Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding...
Tuesday 23 April 2024
TSMC states that factory operations are all normal amid earthquakes in Taiwan
Noticeable earthquakes hit Taiwan in the early morning of April 23. Especially at 8:04 a.m., a Richter scale 5.8 earthquake occurred again off Hualian.
Tuesday 23 April 2024
Novatek to re-elect board directors; UMC not on candidate list
Novatek Microelectronics, a specialist in Display Driver ICs (DDI), has recently revealed a list of Board of Directors (BOD) who will be reelected. Nevertheless, United Microelectronics...
Tuesday 23 April 2024
Bickering between EV vendors underscores SiC popularity
The recent bickering between two Chinese Electric Vehicle (EV) vendors has highlighted the growing popularity of SiC power components.
Monday 22 April 2024
Raimondo says Huawei's chip breakthrough is years behind US tech
US Commerce Secretary Gina Raimondo said Huawei Technologies Co.'s latest phone shows that China remains behind on cutting-edge chip technology.
Monday 22 April 2024
Nvidia to help Japan's AIST build quantum supercomputer
Nvidia announced that Japan's new quantum supercomputer — designed to advance the nation's quantum computing initiative — will be powered by Nvidia platforms for accelerated...
Monday 22 April 2024
High-NA EUV delay might cost Samsung its edge against Intel
Intel recently completed the assembly of the industry's first High-NA Extreme Ultraviolet (EUV) lithography equipment and announced plans to start producing 1nm-level semiconductors...
Monday 22 April 2024
Will Taiwan's government approve TSMC's plan to produce 2nm chips in America?
Upon TSMC Arizona's signing of a Preliminary Memorandum of Terms (PMT) with the Biden Administration, the decision to manufacture 2nm chips in its third fab and part of the second...
Monday 22 April 2024
Advanced packaging still in short supply; production expansion spreading overseas
TSMC's advanced packaging CoWoS capacity continues to have strong demand. Even after doubling its capacity in 2024 and collaborating with OSAT companies, it can still not fully meet...
Monday 22 April 2024
China has become an insatiable market for lithography equipment
With ASML recently stating that 20% of their recent orders are held by Chinese customers and nearly half of their revenue comes from China, the future operation trend of the world's...
Monday 22 April 2024
Samsung doubles AP developers, introduces Google's Gemini Nano 2 into Galaxy S25
Samsung has announced plans to double the number of software developers for mobile Application Processors (APs) within the next 2-3 years.