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NEWS TAGGED VIA
Friday 6 October 2017
PChome Store to raise capital
PChome Store has disclosed a plan to issue up to 10 million new shares for subscription through private placement to enhance its C2C business, especially smartphone-based shopping.
Wednesday 27 September 2017
GET to raise capital
Solar wafer maker Green Energy Technology (GET) has disclosed it has decided to issue new shares in two phases to raise capital via private placement.
Thursday 21 September 2017
VIA sees rising income from embedded product lines
VIA Technologies has been pushing its embedded platform business and now sees 30-40% of its revenues coming from the segment, according to the company.
Friday 25 August 2017
VIA collaborates with Microsoft to accelerate IoT solutions
VIA Technologies has announced it has joined Microsoft Azure Certified for Internet of Things (IoT), ensuring customers get IoT solutions up and running quickly with hardware and...
Wednesday 16 August 2017
Taiwan market: Garmin launches smart bands
Garmin has partnered with pharmaceuticals distributor Chunghwa Yuming Healthcare for launching vivo series smart wrist bands, mainly vivosmart 3, vivofit jr and vivosmart HR, in the...
Friday 11 August 2017
Taiwan government to foster 30,000 startups in 3 years via direct investment
Taiwan's National Development Council (NDC) has decided to make direct investments in tech startups, instead of offering them subsidies as done in the past, aiming to build sound...
Tuesday 1 August 2017
Asustek pays US$15 million to end lawsuits with VIA
VIA Technologies has announced it has settled its lawsuits with Asustek Computer in Taiwan and the US, with Asustek agreeing to pay VIA US$15 million.
Monday 17 July 2017
VIA announces Olami AI platform
VIA Technologies announced the start to beta testing for its Olami artificial intelligence (AI) platform on July 17. The platform is developed by VIA's AI team and features many cloud...
Monday 26 June 2017
Touch panel maker GIS raises over US$200 million via GDR sale
Touch panel maker General Interface Solution (GIS) has completed selling 30 million new shares in the form of global depository receipts (GDRs) raising US$207 million to finance capital...
Friday 23 June 2017
VIA announces Mobile360 Surround View sample kit
VIA Technologies has launched its Mobile360 Surround View sample kit for real-time commercial 360-degree video vehicle monitoring, recording, and tracking applications.
Tuesday 16 May 2017
Computex 2017: VIA Labs to showcase USB solutions
VIA Technologies subsidiary VIA Labs is planning to showcase its peripheral products including USB Type-C solutions for handsets, USB 3.1 Gen2 Host chips for notebooks and products...
Monday 24 April 2017
HP Labs develops IonTouch with E Ink
HP Labs has developed IonTouch, a writable printing technology, through cooperation with EPD (electrophoretic display) e-paper maker E Ink Holdings (EIH) which provides e-paper for...
Wednesday 12 April 2017
Zhaoxin to partner with TSMC
Shanghai Zhaoxin Semiconductor is scheduled to roll out its in-house developed ZX-D series processors that will be built using a 28nm process technology by Shanghai Huali Microelectronics...
Tuesday 28 March 2017
HTC upbeat about Vive applications via Viveport in 2017
Viveport, A VR platform established by HTC, has attracted registration by more than 20,000 independent VR (virtual reality) application developers, who have together launched about...
Thursday 23 March 2017
VIA eyes panoramic photography business opportunity
VIA Technologies has been shifting its focus from the PC processor market to the embedded sector and has recently announced its new Vpai 720 degree panoramic photography solution...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research