Backend house Powertech Technology (PTI) expects to post a double-digit on-year revenue surge in the first quarter of 2022 after posting record business results for 2021, and is optimistic...
ASE Technology expects market conditions in 2022 to remain favorable to it and other OSATs, and is upbeat about its ASP growth next year as automotive chips wirebonding business and...
OSATs and IC test solutions providers are all gearing up for a boom in flip-chip (FC) packaging and high-end testing demand for 5G smartphone application processors (APs) featured...
Major OSATs, including ASE Technology and Powertech Technology (PTI), are already engaged in talks with their substrate suppliers about orders for 2023, according to industry sourc...
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top management shakeup after...
Taiwan's backend houses ASE and affiliated Siliconware Precision Industries (SPIL) reportedly have landed orders for Qualcomm's Snapdragon X60 modem chips while GaAs foundry Win Semiconductors...
A sound ecosystem for high-end IC substrates has to be built in Taiwan as such substrates will still have a big role to play in backend services despite the growing demand for substrate-free...
Memory backend specialist Powertech Technology (PTI) is aggressively foraying into new logic IC segments such as TV SoCs and handset APs in a bid to offset loss of orders expected...
Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...
With the crypto mining fever subsiding, many Taiwan backend houses have seen their FC-CSP machines dedicated to packaging mining ASICs stay idle since late 2018, forcing them into...
Huawei has set ambitious goals for its smartphone operations in 2019, aiming to unseat Samsung as the world's largest smartphone vendor, according to industry sources.
PCB supplier Unimicron Technology has announced third-quarter consolidated revenues of NT$17.45 billion (US$568 million), up 5% sequentially. But gross margin for the quarter slid...
Kinsus Interconnect Technology expects first-quarter revenues to have only a slight drop sequentially despite fewer working days, as demand from handset chip customers has picked...
Korea-based flip-chip chip-scale packaging (FC-CSP) substrate maker Semco has gained market share from Japan-based Ibiden to become one of the top-two players in the market, according...
