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Tuesday 26 May 2026
Samsung's P4 HBM push could worsen DRAM crunch in 2027

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth...

Tuesday 26 May 2026
Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
Monday 25 May 2026
Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...
Monday 25 May 2026
Nvidia's Vera CPU push lifts LPDDR outlook for Samsung, SK Hynix
Nvidia's decision to sell its Vera CPU as a standalone chip could create a new source of demand for low-power DRAM, adding another pressure point to the already tight memory supply...
Sunday 24 May 2026
Micron starts producing most advanced US-made DRAM at Virginia fab, expands domestic memory supply
Micron Technology has begun manufacturing its 1-alpha (1α) DRAM process technology at its factory in Manassas, Virginia, marking what the company described as the most advanced...
Saturday 23 May 2026
CXMT IPO puts China's DRAM supply-chain push in focus

CXMT's planned Shanghai listing is becoming more than a test of investor appetite for China's top DRAM maker. It is also putting a spotlight...

Friday 22 May 2026
AI memory crunch pushes Nanya Technology toward 2027 fab ramp

Nanya Technology plans to raise 2026 capital expenditure above NT$52 billion (US$1.64 billion), with chairman Tzou Ming-jen saying the...

Thursday 21 May 2026
GigaDevice sees niche DRAM and NAND prices rising through 2026
GigaDevice said tight supply and rising prices across DRAM, NOR Flash, and SLC NAND Flash continued to fuel strong first-quarter 2026 earnings growth, supported by recovering demand...
Thursday 21 May 2026
SK Hynix reportedly shifts Cheongju mask fab toward HBM yield push
SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the...
Thursday 21 May 2026
Commentary: China builds its memory twin engines; IPO push for YMTC, CXMT intensifies

China's memory chip industry is entering a critical capital markets phase, with YMTC formally launching IPO counselling and CXMT resuming...

Thursday 21 May 2026
Samsung labor dispute adds pressure to memory chip market
Surging demand for AI data center infrastructure has already pushed the memory market into a structural shortage. Now, Samsung Electronics' labor dispute is adding another layer of...
Wednesday 20 May 2026
China's top NAND flash chipmaker YMTC begins IPO tutoring with Chinese banks
China's leading memory chipmakers are accelerating their push into public capital markets, with YMTC Group formally entering IPO guidance on May 19, shortly after domestic DRAM leader...
Wednesday 20 May 2026
Apple's memory bargaining power weakens amid AI-driven supply squeeze, Korean media says
South Korean media commentary has highlighted a structural shift in Apple's influence over memory chip pricing, arguing that its long-standing bargaining power over suppliers is weakening...
Wednesday 20 May 2026
CXMT profit surge shows limits of China's DRAM push
ChangXin Memory Technologies (CXMT) is approaching its planned STAR Market IPO with sharply stronger earnings, as a global memory upcycle helps China's leading DRAM maker move closer...
Tuesday 19 May 2026
Analysis: CXMT's profit surge highlights tighter memory-logic ties in China
ChangXin Memory Technologies' latest IPO financial disclosures have sent a strong signal across China's semiconductor industry, revealing how quickly the country's top DRAM maker has...