Samsung Electronics is reportedly considering repurposing the second line at its next-generation semiconductor R&D complex in Giheung...

High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...

Intel is signaling a broader push into next-generation memory technologies, with CEO Lip-Bu Tan revealing that the company is exploring...

China's leading DRAM maker CXMT has reportedly raised its DDR5 production yield above 90%, narrowing the gap with Samsung Electronics...

Samsung Electronics' production yield for its sixth-generation high-bandwidth memory, HBM4, has reportedly approached 80%, marking a...

Amid a swirl of rumors that Nvidia chip upgrades were being cut, scaled back, or delayed, the company has again pushed back on similar...

Memory chips account for roughly 62% of the cost of Nvidia's next-generation AI platform, Vera Rubin, according to a new cost breakdown...

Apple's unusual interest in testing CXMT memory and redirecting part of its procurement toward China has rattled Washington, given...

Samsung Electronics is betting on new 3D memory architectures and tighter processor-memory integration as AI workloads put growing pressure...