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NEWS TAGGED DRAM
Wednesday 12 August 2026
CXMT DDR5 yield tops 90%, narrowing gap with Samsung

China's leading DRAM maker CXMT has reportedly raised its DDR5 production yield above 90%, narrowing the gap with Samsung Electronics...

Wednesday 12 August 2026
Fudan's single-electron memory breakthrough opens new path for 2D chip scaling
China's effort to advance memory technology has gained a new research avenue, with a Fudan University team developing a room-temperature single-electron non-volatile memory device...
Wednesday 12 August 2026
Samsung HBM4 yield nears 80% in push to rival SK Hynix

Samsung Electronics' production yield for its sixth-generation high-bandwidth memory, HBM4, has reportedly approached 80%, marking a...

Wednesday 12 August 2026
Nvidia denies Rubin Ultra downgrade, cites flexible SKUs

Amid a swirl of rumors that Nvidia chip upgrades were being cut, scaled back, or delayed, the company has again pushed back on similar...

Tuesday 11 August 2026
Memory drives 62% of Nvidia Vera Rubin's cost — SOCAMM2, not HBM4, leads the bill

Memory chips account for roughly 62% of the cost of Nvidia's next-generation AI platform, Vera Rubin, according to a new cost breakdown...

Tuesday 11 August 2026
Memory crunch pushes Apple toward China—and into Washington's security dilemma

Apple's unusual interest in testing CXMT memory and redirecting part of its procurement toward China has rattled Washington, given...

Tuesday 11 August 2026
Samsung tackles AI memory wall with zHBM, V10 BV-NAND concepts

Samsung Electronics is betting on new 3D memory architectures and tighter processor-memory integration as AI workloads put growing pressure...

Monday 10 August 2026
Samsung HBM4 yield nears 80% as production race with SK Hynix heats up

Samsung Electronics has reportedly pushed the production yield of its sixth-generation high-bandwidth memory (HBM4) close to 80%, marking...

Monday 10 August 2026
Apple tests CXMT memory chips as shortage, price pressures persist

Apple has tested DRAM from China's ChangXin Memory Technologies in iPhone and MacBook products as AI-driven memory shortages and rising...

Monday 10 August 2026
SK Hynix faces US patent fight over HBM, 3D NAND

SK Hynix is facing an expanding US patent dispute with MonolithIC 3D. A second US International Trade Commission (USITC) investigation...

Monday 10 August 2026
Adata sees memory uptrend extend into 1H27
Adata posted record-high revenue and profit in the second quarter of 2026 and said memory supply remains tight. The company expects third-quarter operating performance to outperform...
Monday 10 August 2026
Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography
AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week...
Monday 10 August 2026
Winbond sees tighter memory supply and bigger expansion payoff ahead
Winbond Electronics said rising prices and stronger shipments lifted its operating margin to 48.4% in the second quarter of 2026, and it expects the third-quarter margin to top 50%,...
Saturday 8 August 2026
Elan warns CPU and DRAM shortages will strain 2H26 PC demand
Taiwanese touch controller maker Elan held an earnings call on August 5 and said overall operations in the second quarter of 2026 were still solid, but the PC market in the third quarter...
Friday 7 August 2026
SK Hynix commits US$39 billion to new Yongin and Cheongju fabs as AI memory demand builds
SK Hynix has approved roughly KRW54 trillion (approx. US$39 billion) in new fab construction across two domestic sites, allocating KRW35.2 trillion to a second Yongin fab and KRW19.1...