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Wednesday 14 October 2026
SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
Wednesday 14 October 2026
Elon Musk says Micron is 'reasonable' on memory prices while others are 'extortionate'
Elon Musk has criticized memory chip suppliers for charging what he called "extortionate" prices while praising Micron Technology's approach to future pricing, highlighting tensions...
Wednesday 14 October 2026
HBM capacity shift sends DDR4 contract prices rising faster than DDR5
DDR4 contract prices are rising faster than those of the newer DDR5 standard, reversing the usual pricing pattern in the memory market. The artificial intelligence (AI) boom has prompted...
Wednesday 14 October 2026
CXMT targets 4F² DRAM production two years ahead of Samsung, but can China close technology gap?
China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
Wednesday 14 October 2026
Qualcomm says edge AI faces power, cost, and scale hurdles
Qualcomm is pushing to cut edge AI's energy cost as phones, cars, and other devices face tighter power and cooling limits than data centers. At the opening of Applied Materials' EPIC...
Wednesday 14 October 2026
AI memory boom pushes smartphone market into premium-first reset
While the rapid advancement of AI has driven steadily growing investment in large-scale infrastructure, one of its downstream effects is becoming increasingly visible in the memory...
Wednesday 14 October 2026
GMIF 2026 Awards: Samsung, SanDisk, BIWIN, and Others Honored

The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026, GMIF2026) recently concluded at the Renaissance Shenzhen Bay Hotel, co-hosted by the Shenzhen Memory...

Tuesday 13 October 2026
CXMT's server DRAM push raises margin concerns for Samsung, SK Hynix
China's ChangXin Memory Technologies (CXMT) is raising concerns over the future pricing power of Samsung Electronics, SK Hynix, and Micron as its plans for next-generation server DRAM...
Tuesday 13 October 2026
Column: From 3D NAND to 3D DRAM — how vertical stacking is reshaping memory chip manufacturing
After 2013, planar NAND flash memory began reaching its scaling limits at the 15–16nm process node. Capacitive coupling between the floating gates of adjacent memory cells increasingly...
Monday 12 October 2026
Nanya gross margin hits 85.7% as low-priced DRAM contracts roll off
Nanya Technology reported record quarterly earnings in the third quarter of 2026, according to unaudited results released on October 12, as DRAM average selling prices (ASPs) rose...
Monday 12 October 2026
Samsung could unseat SK Hynix as HBM leader in 2027
Samsung Electronics could overtake SK Hynix as the world's largest supplier of high-bandwidth memory (HBM) in 2027, as HBM4 prices climb and memory manufacturers compete for limited...
Monday 12 October 2026
CXMT targets 2026 debut of 4F² DDR5 RDIMM in bid to challenge server DRAM rivals

China's ChangXin Memory Technologies (CXMT) plans to introduce DDR5 registered DIMMs (RDIMMs) based on its new 4F² DRAM architecture by the...

Saturday 10 October 2026
SK Hynix sends memory chips into orbit for testing
SK Hynix's dynamic random-access memory (DRAM) and Universal Flash Storage (UFS) products have reached orbit aboard a South Korean satellite that successfully established communication...
Thursday 8 October 2026
AI PCs face memory squeeze as server demand takes priority
Microsoft's October 7 opening of pre-orders for Surface Laptop Ultra, featuring up to 128GB of unified memory, highlights a potential new source of dynamic random-access memory (DRAM)...
Thursday 8 October 2026
Samsung expands memory testing beyond Korea with US$4.08 billion Vietnam project
Samsung Electronics is expanding its memory testing footprint beyond South Korea with a US$4.08 billion project in Vietnam, adding another back-end and export base as tight DRAM and...