News tagged DRAM at DIGITIMES

NEWS TAGGED DRAM

Friday 14 November 2025

DDR5 becomes 2026 standard, and power-control overhaul lifts passive component market

The memory market's ongoing shortage-and-price surge continues to accelerate, lifting the broader sector and boosting earnings for DRAM manufacturers, module suppliers, memory packaging...

Friday 14 November 2025

HBM's breakneck rise is draining DRAM supply, repricing the smartphone sector

The global AI boom is driving up smartphone and tablet production costs, as memory suppliers divert more capacity toward high-bandwidth memory (HBM) for AI accelerators. Samsung Electronics...

Friday 14 November 2025

Samsung expected to dominate HBM4 market as prices snap back

Samsung Electronics is poised for a commanding performance in the advanced memory sector, with analysts forecasting the tech giant could seize 40 percent of the lucrative HBM4 market...

Friday 14 November 2025

ADATA sets new quarterly profit records amid strong memory market demand

ADATA Technology Co. (ADATA) has reported record-breaking financial results for the third quarter of 2025, marking a clean sweep of quarterly highs in operating gross profit, operating...

Wednesday 12 November 2025

Samsung Pyeongtaek P4 shifts to 1c DRAM production

Samsung will continue investment in the Phase 4 production line at its Pyeongtaek campus, converting the facility from foundry to 1c DRAM production. The latest monthly capacity is...

Wednesday 12 November 2025

SK Hynix targets 70% DRAM profit margin amid supply crunch

The AI boom has caused memory giants to concentrate production on HBM, resulting in a shortage of general-purpose DRAM and high prices. According to Chosun Biz, DRAM prices...

Wednesday 12 November 2025

WT Microelectronics and WPG post record October revenue on soaring AI chip demand

Taiwan's top IC distributors WT Microelectronics (WTMEC), WPG Holdings, Edom Technology, and Supreme Electronics reported their October 2025 results, highlighting robust AI-driven...

Wednesday 12 November 2025

Micron reallocates CHIPS Act funds to Idaho, delaying New York fabs

US memory giant Micron will postpone the commissioning of its first two fabs in Clay, New York, by 2–3 years and will reallocate part of the funding from the CHIPS and Science...

Wednesday 12 November 2025

SK Hynix reportedly developing high-bandwidth storage to boost smartphone AI performance

SK Hynix is reportedly developing a new hybrid memory platform that combines mobile DRAM and NAND flash to accelerate on-device artificial intelligence in smartphones and tablets,...

Tuesday 11 November 2025

YMTC expands Wuhan production with third fab, targets global top-four memory ranking by 2027

YMTC has begun constructing its third semiconductor plant in Wuhan, with mass production slated for 2027, while ramping up output at...

Monday 10 November 2025

China's memory squeeze deepens: NOR flash prices jump, Puya expands into 2D NAND

Following back-to-back price increases for DRAM and NAND, NOR flash has become the next segment to spike. Prices are up by at least 10%...

Monday 10 November 2025

Memory module makers expect supply shortage and price surge to extend into 2026

Rising memory prices and volumes are driving a strong finish for memory module manufacturers in 2025, with Taiwanese module leaders optimistic that the boom will continue through...

Sunday 9 November 2025

SK Hynix pushes 1C DRAM for HBM4E as AI memory demand surges

South Korea's two largest memory chipmakers, SK Hynix and Samsung Electronics, are reportedly finalizing supply agreements with Nvidia for next-generation high-bandwidth memory (HBM4),...

Friday 7 November 2025

Memory price surge amid supply tightness pressures Chinese smartphone makers

The surge in AI computing has led to a significant price increase in DRAM and NAND Flash, with major manufacturers raising prices by up to 30% in late 2025, putting cost pressure...

Friday 7 November 2025

CXMT adopts SK Hynix's MR-MUF tech to close China's HBM gap by 2026

China's DRAM maker CXMT plans to start mass production of fourth-generation high-bandwidth memory (HBM3) in 2026 using mass reflow molded underfill (MR-MUF) packaging, the same technology...

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