Micron has released its first-quarter fiscal 2025 (1QFY25, ending November 28, 2024) financial results, highlighting strong performance in its HBM segment. However, a weaker-than-expected...
Nanya Technology has greenlit a strategic alliance with DRAM design firm PieceMakers Technology, committing up to NT$6.6 billion (US$1.5 million) in a cash capital increase to secure...
Samsung Electronics (Samsung) is set to construct a test line for 10nm seventh-generation DRAM (1d DRAM) at Pyeongtaek Plant 2 (P2), strengthening its competitive position and enhancing...
Micron Technology reported record fiscal first-quarter revenue driven by data center SSD sales, which now represent over half of total revenue. While HBM shipments doubled quarter...
Japanese NAND flash manufacturer Kioxia has announced plans to produce three additional types of memory, targeting next-generation products driven by artificial intelligence (AI)...
Despite continued weak demand for South Korean displays and components in 2024, an unexpected recovery has emerged near year-end. Analysts interpret this trend as a response to the...
The surging AI market has driven unprecedented demand for high-bandwidth memory (HBM), placing significant strain on supply chains. In early August, reports surfaced that the Biden...
Samsung Electronics plans to introduce samples of its next-generation LPDDR6 memory by late 2025, addressing the growing demand for on-device AI solutions. The initiative aims to...
Two pivotal areas in the semiconductor industry- standard DRAM and mature logic processes—are undergoing significant shifts. Despite their independence, both segments share...
Samsung Electronics has reportedly initiated a large-scale personnel reshuffle, reallocating engineers to its next-generation semiconductor hub in Pyeongtaek. However, the company...
Samsung Electronics is exploring the development of discrete package low-power DRAM (LPDDR) for Apple's iPhones to meet the tech giant's evolving requirements, though Samsung has...
Japan reportedly played a crucial role in keeping Chinese memory maker ChangXin Memory Technologies (CXMT) off the recently updated US Entity List, according to sources from China's...
SK Hynix has announced a major organizational restructuring and executive appointments, highlighted by the creation of a new chief development officer (CDO) position to oversee DRAM...
With the US implementing new semiconductor export controls, Samsung Electronics (Samsung) and SK Hynix have gained temporary relief as they advance their process upgrades at factories...
The latest wave of export restrictions from the US on High Bandwidth Memory (HBM), particularly targeting advanced technologies such as HBM2 and above, is set to compel China's memory...
