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    China moves to rein in booming energy storage and lithium battery overcapacity
    5h 3min ago
    Taiwan's govt delegation visit Europe, strenthening advanced packaging and SiPh ties
    5h 3min ago
    Apple's iPhone Duo may lift foldables, but Taiwanese suppliers seek new growth
    5h 3min ago
    How Huawei, Xiaomi and Apple diverge in foldable phones
    5h 3min ago
    Global drone supply chains accelerate decoupling from China, Taiwan sees an opening
    5h 3min ago
    NEWS TAGGED DRAM
    Thursday 10 September 2026
    Apple added flat US$100 to every iPhone and rebuilt A20 Pro around memory
    Two things happened at Apple's September 9 launch that belong in the same story: the company raised the price of every iPhone it sells by exactly US$100, and it introduced a chip whose...
    Thursday 10 September 2026
    SK Hynix says 3D DRAM will borrow from logic foundry playbook
    SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...
    Thursday 10 September 2026
    CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

    China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...

    Wednesday 9 September 2026
    CXMT's 10% DRAM share intensifies debate over South Korea's 52-hour workweek

    China's rapid advance in DRAM is intensifying debate in South Korea over whether rigid working-hour rules could make it harder to preserve...

    Tuesday 8 September 2026
    CXMT sees tight DRAM supply through 2H26, accelerates server memory and China-made tool validation
    Chinese DRAM maker ChangXin Memory Technologies (CXMT) expects global memory supply to remain tight through the second half of 2026, with AI-driven demand supporting prices while the...
    Tuesday 8 September 2026
    Samsung allocates more than half of 4nm foundry capacity to HBM4
    Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI...
    Monday 7 September 2026
    HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days
    Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply as AI infrastructure spending drives simultaneous demand for HBM, server DRAM and enterprise...
    Monday 7 September 2026
    SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
    SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
    Monday 7 September 2026
    Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV
    China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density...
    Sunday 6 September 2026
    TEL sees AI-driven packaging, memory demand reshaping Taiwan strategy
    Tokyo Electron's Taiwan president said AI is pushing semiconductor demand into new areas, with advanced packaging, DRAM, high-bandwidth memory, and NAND flash all gaining momentum...
    Saturday 5 September 2026
    Micron looks to lock in Taiwanese construction capacity with long-term deals
    The global rush to build semiconductor fabs is creating a historic opportunity for Taiwan's construction and facility engineering supply chain, and Micron Technology is looking to...
    Saturday 5 September 2026
    Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC
    China's memory industry is shifting from a single-champion model towards a three-pronged structure. ChangXin Memory Technologies (CXMT) is building its position in DRAM, Yangtze Memory...
    Friday 4 September 2026
    TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
    TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
    Friday 4 September 2026
    AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

    The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

    Friday 4 September 2026
    Kioxia pitches flash as a DRAM substitute as Micron, YMTC close in
    Kioxia's plan to push NAND flash into work that DRAM currently does is less a product launch than an answer to a structural problem. Alone among the leading memory makers, it does...
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    BIZ FOCUS
    Sep 10, 08:00
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
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