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NEWS TAGGED SEMICONDUCTOR EQUIPMENT
Thursday 10 November 2011
Laser Tek expects November, December revenues to fall
Laser Tek, a supplier of SMD (surface-mount-device) packaging materials and semiconductor equipment, expects to report on-month drops in revenues for November and December. Passive...
Thursday 10 November 2011
Topco sees 4Q11 sales decline
Topco Scientific, which distributes semiconductor materials and equipment, as well as equipment and materials used in the production of LCD panels, LEDs and solar products, is cautious...
Monday 31 October 2011
ACM Research reportedly lands equipment order from Samsung
China's ACM Research has landed orders from Samsung Electronics to supply 12-inch, single-wafer megasonic cleaning tools, which would be installed as part of the chipmaker's advanced...
Friday 21 October 2011
SEMI book-to-bill falls again in September
North America-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September 2011, declining for the fifth month in a row.
Thursday 20 October 2011
Japan fab-tool book-to-bill slips to 0.75 in September, says SEAJ
Japan-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September, declining for the third month in a row.
Tuesday 11 October 2011
New ASML-IMEC deal demos move to EUV lithography
IMEC has announced that it has signed a new agreement with ASML for a period of five years (2011-2015). The pair's continued collaboration guarantees the global semiconductor ecosystem...
Monday 3 October 2011
IC capex to fall 19% in 2012, says Gartner
Worldwide semiconductor capital equipment spending is expected to total US$35.2 billion in 2012, down 19.2% from the US$43.5 billion estimated for 2011, according to Gartner. Excess...
Wednesday 21 September 2011
Japan fab-tool book-to-bill continues slide in August, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.76 in August 2011, compared to 0.84 in July and 0.96 in June, according to new figures from the...
Monday 19 September 2011
PCB equipment maker Chime Ball looking to strong sales in 4Q11
Taiwan-based PCB manufacturing equipment maker Chime Ball Technology has revealed that its production capacity has been fully booked for the third quarter of 2011, and demand for...
Friday 16 September 2011
SEMI book-to-bill ratio slips to 0.80 in August
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.80 for August 2011, down from 0.85 in July, according to new figures from SEMI. A book-to-bill...
Friday 9 September 2011
450mm and EUV linked with uncertainty, says SEMI
The transition to manufacturing semiconductors on larger wafers continues to be one of the hottest topics in the industry. However, uncertainty with EUV rollout has exacerbated the...
Wednesday 7 September 2011
Chip equipment billings up 31% in 2Q11, says SEMI
Worldwide semiconductor manufacturing equipment billings reached US$11.92 billion in the second quarter of 2011, according to SEMI. The billings figure is 1% lower than that in the...
Wednesday 7 September 2011
IC testing capacity utilization drops to 50-60%, says KYEC president
The semiconductor industry is working through excessive inventory coupled with unusual slowness in the third quarter of 2011, which has caused the average capacity utilization rate...
Thursday 1 September 2011
Intel investment reduction plans may affect PC and semiconductor players
Intel, facing weak PC performance, reportedly is considering to temporarily halt its plans to upgrade to a 22nm process at Fab 24, and has decided to delay the launch of its next-generation...
Wednesday 24 August 2011
Semiconductor output on 12-inch wafers to nearly double by 2015, says IHS
Semiconductor manufacturing using 12-inch wafers will see production nearly double from 2010 to 2015 as chip producers increasingly employ them for older, more mature products, according...