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NEWS TAGGED SEMICONDUCTOR EQUIPMENT
Friday 21 January 2011
SEMI, SEAJ book-to-bill ratios slip in December 2010
North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.90 in December, down from 0.97 in November, according to SEMI. Meanwhile, data gathered...
Monday 17 January 2011
Equipment maker GPTC debuts on Taiwan OTC market
Grand Plastic Technology (GPTC), which makes semiconductor equipment, debuted on Taiwan's OTC (over-the-counter) stock market at an initial price of NT$62 (US$2.14) per share today...
Tuesday 4 January 2011
Laser Tek reportedly to buy SMT equipment provider
Market sources have speculated that Taiwan's Laser Tek will soon announce plans to acquire a small- to medium-sized company specializing in surface-mount-technology (SMT) equipment,...
Friday 31 December 2010
TSMC spends more than NT$30 billion on fab gear in December
Taiwan Semiconductor Manufacturing Company (TSMC) has spent more than NT$30 billion (US$1.03 billion) on equipment procurement, cleanroom facilities and factory building construction...
Friday 24 December 2010
Spirox says distribution deal with Accretech to end
Spirox has announced that the company will discontinue distributing products from Accretech Tokyo Seimitsu, a Japan-based supplier of chip-manufacturing equipment and measuring tools...
Friday 17 December 2010
North America fab tool book-to-bill slips to 0.96 in November 2010, says SEMI
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.96 in November 2010 compared to 0.98 in October and 1.06 a year ago, according to SEMI...
Thursday 16 December 2010
Chip equipment spending to slip 1% in 2011, says Gartner
Worldwide semiconductor capital equipment spending is on pace to reach US$38.4 billion in 2010, a 131.2% jump from 2009, according to Gartner. In 2011, spending is forecast to total...
Wednesday 15 December 2010
Chip gear billings and bookings rise in 3Q10, says SEMI
Chip manufacturing equipment billings and bookings worldwide enjoyed both sequential and on-year growth in the third quarter of 2010, according to SEMI.
Friday 3 December 2010
Cleanroom constructor UIS seeing orders extend to June 2011, says paper
United Information Systems (UIS) has seen its backlog of cleanroom and equipment orders reach close to NT$8 billion (US$264 million), with visibility on orders clear through June...
Wednesday 1 December 2010
Applied rolls out new etcher for advanced memory and logic production
Applied Materials has launched a silicon etch system - the Centris AdvantEdge Mesa Etch - for the high-throughput production of advanced memory and logic chips.
Tuesday 30 November 2010
Chip equipment sales to reach US$37.5 billion in 2010, says SEMI
Worldwide semiconductor equipment sales are set to reach US$37.54 billion in 2010, a 136% jump from US$15.92 billion in 2009, according to SEMI. It previously estimated a 104% rise...
Monday 22 November 2010
Japan chip gear book-to-bill continues to slide on-month
The book-to-bill ratio for Japan-based semiconductor equipment manufacturers slipped to 1.12 in October 2010 from 1.14 in the prior month, according to the Semiconductor Equipment...
Friday 19 November 2010
SEMI book-to-bill ratio drops below parity in October 2010
The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.98 in October 2010 from 1.03 in the prior month.
Friday 19 November 2010
IC capacity utilization drops to 95.2% in 3Q10, SICAS figures show
Global IC industry capacity utilization dropped to 95.2% in the third quarter of 2010 from 95.6% in the second, according to the latest data from Semiconductor Industry Capacity Statistics...
Friday 19 November 2010
Verigy, LTX-Credence to merge
Verigy and LTX-Credence on November 18 announced that they have entered into a definitive merger agreement. The combined company, to be called Verigy, will feature a portfolio of...