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NEWS TAGGED SEMICONDUCTOR EQUIPMENT
Friday 23 April 2010
Equipment maker Usun looks to NT$2.5 billion revenues in 2010
Taiwan-based Usun Technology, which supplies equipment for FPD and CCL production as well as automation systems, expects its revenues to top NT$2.5 billion (US$79.62 million) in 2010,...
Tuesday 20 April 2010
Equipment makers Mirle, Csun report profits for 1Q10
Taiwan-based equipment makers Mirle Automation and Csun Manufacturing have reported pre-tax profits of NT$98 million (US$3 million) and NT$88.16 million, respectively, for the first...
Tuesday 20 April 2010
Japan chip gear book-to-bill ratio at 1.17 in March 2010, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.17 in March 2010, down from 1.34 in February but up significantly from the record level of 0.30...
Wednesday 14 April 2010
TSMC acquires equipment from ASML
Taiwan Semiconductor Manufacturing Company (TSMC) has announced the purchase of equipment worth NT$2.06 billion (US$66 million) from ASML, which supplies lithography systems.
Monday 12 April 2010
Chip equipment spending down 46% in 2009, says Gartner
Worldwide semiconductor capital equipment spending totaled US$16.6 billion in 2009, a 45.8% decline from 2008, according to Gartner. In major segments, wafer fab equipment dropped...
Wednesday 31 March 2010
Applied says 2010 revenues to grow over 60%
Applied Materials has said it now expects fiscal 2010 net sales to be more than 60% higher than in fiscal 2009, compared to its previous forecast of up more than 50%. The fab-tool...
Sunday 21 March 2010
Chip-gear book-to-bill almost flat in February 2010
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.22 in February 2010 compared to 1.23 in January, according to SEMI.
Friday 19 March 2010
Litho market drops 47% in 2009, says The Information Network
Lithography tools for semiconductor manufacturing dropped 47% in 2009 on top of a 25% drop in 2008, according to The Information Network.
Wednesday 17 March 2010
Chip market scale in China to double in 2010, says SEMI CEO
The worldwide semiconductor equipment market will grow 47% in 2010, and the growth in China will be more than 100%, according to Stanley Myers, president and CEO of SEMI, speaking...
Tuesday 16 March 2010
Ampoc to step into biomedical equipment production
Ampoc Fareast, which mainly makes equipment for PCB production, has said it plans to launch its first inspection tool for biomedical applications in the third quarter of 2010. The...
Friday 12 March 2010
Applied upbeat on chip and display outlook; to work closer with Asia customers
Capital spending in the semiconductor industry is expected to reach US$21-23 billion in 2010, up from around US$13 million in 2009, according to Mike Splinter, chairman and chief...
Thursday 11 March 2010
Global semiconductor equipment sales down 46% in 2009, says SEMI
Worldwide sales of semiconductor manufacturing equipment totaled US$15.92 billion in 2009, representing a 46% decline compared to US$29.52 billion posted in 2008, according to SEMI...
Thursday 11 March 2010
Applied to beef up display, solar equipment production in Taiwan
Applied Materials has announced the opening of its newly-expanded Tainan Manufacturing Center, Taiwan. The nearly 15,000-square meter facility will enhance Applied's capability to...
Thursday 11 March 2010
Taiwan IC- and LCD-equipment makers post mixed February 2010 results
Csun Manufacturing and Gallant Precision Machining (GPM) managed sequential revenue growth in February 2010, while All Ring Tech and Mirle Automation both saw revenues drop from January...
Wednesday 10 March 2010
Kenmec board of directors approves EMS business spin-off
Kenmec Mechanical Engineering, which specializes in industrial automation equipment, has announced plans to spin off its EMS unit have been approved by its board of directors.