As new-generation CPU platforms set for launch by Intel and AMD in late March or early second quarter of 2018 all require faster data transmission and better charging performance,...
With the growing demand for high-speed data transmission interface solutions including PCIe, Type C, DP, and SerDes fueled by rampant AI, cloud service, big data and IoT applications,...
As USB Type-C has become mainstream interface standard for new notebook and desktop models in 2018 while also enjoying increasing application to high-end smartphones, Taiwan analog...
With USB Type-C interface increasingly applied to smartphones, PCs and notebooks, the global Type-C chip market is very likely to double in 2018, and chip suppliers able to offer...
USB Implementers Forum (USB-IF), the support organization for the advancement and adoption of USB technology, has announced the USB Developer Days in Taipei, Taiwan, October 24-25...
China-based Shenzhen Deren Electronics has cooperated with Intel to develop USB 3.1 front-panel internal connectors and cables for USB 3.1 Gen2, with the standard expected to become...
Faraday Technology, a Taiwan-based ASIC design service and IP provider, has announced the availability of its USB 3.1 PHY on UMC 28HPC process, as well as the silicon-verified USB...
With high speed transmissions becoming an important spec for electronics devices, Taiwan-based IC design houses including ASMedia, Parade Technologies, Weltrend, On-Bright, Etron...
Qualcomm has introduced its Snapdragon 450-series mobile chips, a new entry to the Snapdragon 400 mobile platform tier designed for mid-range smartphones and tablets. The Snapdragon...
USB Implementers Forum (USB-IF) is a standards organization promoting the advancement and adoption of Universal Serial Bus technology for the last two decades. There are currently...
With Intel planning to integrate Wi-Fi and USB 3.1 functions into its 300-series chipsets in 2018, Realtek Semiconductor, ASMedia and Broadcom are expected to see their orders for...
VIA Technologies subsidiary VIA Labs is planning to showcase its peripheral products including USB Type-C solutions for handsets, USB 3.1 Gen2 Host chips for notebooks and products...
Etron Technology has been engaged in the development of new product lines since 2014, eyeing opportunities in emerging market segments such as AR, VR and UAVs, according to Nicky...
Intel reportedly is planning to add USB 3.1 and Wi-Fi functions into its motherboard chipsets and the new design may be implemented in its upcoming 300-series scheduled to be released...
Market watchers expect Apple's decision to fully adopt USB Type-C connectors for its new MacBook Pros to accelerate other notebook vendors' adoption of USB Type-C technology in their...
