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NEWS TAGGED LAM RESEARCH
Thursday 4 June 2020
Will TSMC cut capex on Huawei woes?
TSMC's 2020 business performance is facing mounting uncertainties over new US trade sanctions against Huawei, fueling market speculations about whether the foundry giant will revise...
Wednesday 27 May 2020
Raising IC self-sufficiency increasingly difficult for China
US vendors remain dominant players in the global front-end semiconductor equipment market segment, which will be a critical factor blocking China's ambition of raising self-sufficiency...
Wednesday 4 March 2020
Lam Research introduces Sense.i etch platform
Lam Research has announced the launch of Sense.i with core technology evolved from Lam's Kiyo and Flex process module. The Sense.i platform enables the etch capabilities required...
Friday 6 December 2019
TSMC to kick off 3nm process manufacturing in 2022
TSMC is firmly on track to move 5nm process technology to commercial production in the first half of 2020 and will kick off production of chips built using a newer 3nm process node...
Friday 22 September 2017
Tokyo Electron optimistic about etching equipment demand for 3D NAND, FinFET
Etching equipment demand for the manufacture of 3D NAND flash memory and FinFET chips is expected to grow in 2018 and 2019, according to Tokyo Electron, which expects its share of...
Monday 4 September 2017
Lam Research completes acquisition of Coventor
Lam Research, a supplier of wafer fabrication equipment and services to the semiconductor industry, has completed the acquisition of Coventor, a provider of simulation and modeling...
Wednesday 23 August 2017
Winbond announces equipment purchases
Winbond Electronics, a memory chipmaker specializing in specialty DRAM and flash memory chips, has disclosed two purchases of machinery equipment from Lam Research and Tokyo Electron...
Tuesday 18 July 2017
TSMC expanding number of equipment suppliers for 7nm
Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according...
Tuesday 6 June 2017
TSMC orders equipment for NT$3 billion
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) on June 5 disclosed a total of about NT$3.09 billion (US$102.8 million) spent on machinery equipment from ASML,...
Wednesday 21 December 2016
TSMC buys equipment for NT$6.57 billion
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has spent a total of NT$6.57 billion (US$123.4 million) this week on equipment from eight suppliers, according...
Wednesday 7 December 2016
TSMC orders equipment for NT$16 billion
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has spent a total of NT$16.05 billion (US$504.6 million) on equipment from five suppliers, according to recent...
Wednesday 7 September 2016
SEMICON Taiwan 2016: Advanced packaging remains in the spotlight
Semicon Taiwan 2016 will kick off in Taipei from September 7-9, with advanced packaging remaining a major focus.
Thursday 30 June 2016
TSMC orders equipment for NT$3 billion
Taiwan Semiconductor Manufacturing Company (TSMC) has announced purchases of manufacturing equipment and facilities totaling NT$3.05 billion (US$94.4 million) from Tokyo Electron,...
Tuesday 28 June 2016
Winbond buys equipment for NT$2.06 billion
Winbond Electronics has disclosed three purchases of machinery equipment from Applied Materials, Lam Research and Tokyo Electron for a total of NT$2.06 billion (US$63.37 million),...
Friday 8 April 2016
Global 2015 semiconductor wafer-level manufacturing equipment market drops 1%, says Gartner
Worldwide semiconductor wafer-level manufacturing equipment revenue totaled US$33.6 billion in 2015, a 1% decrease from 2014, according to final results by Gartner. The top 10 vendors...