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NEWS TAGGED QIMONDA
Monday 12 December 2022
Samsung to maintain memory output ramp-up despite demand slowdown fears
While Micron Technology and other memory chipmakers plan to scale back output and slow down capacity expansions amid growing demand fears, Samsung Electronics is sticking to its capex...
Thursday 30 April 2020
CXMT gearing up to ramp 17nm process output
China-based DRAM chipmaker ChangXin Memory Technologies (CXMT) is looking to ramp its 17nm process output in the second half of 2020, according to industry sources.
Thursday 27 February 2020
Nanya, CXMT gearing up for 10nm-class chip production
Nanya Technology and Changxin Memory Technologies (CXMT) are both gearing up to enter volume production of their 10nm-class DRAM chips in the second half of 2020.
Friday 27 December 2019
CXMT developing LPDDR4x memory for handsets
China-based DRAM startup ChangXin Memory Technologies (CXMT) is making progress in the development of LPDDR4x memory chips, which will initially attract orders from China's second-tier...
Tuesday 2 July 2019
Tsinghua Unigroup sets up DRAM group
China's Tsinghua Unigroup has announced the establishment of its DRAM business group, and appointed Diao Shijing as group chairman and Charles Kao as CEO.
Tuesday 11 June 2019
China memory maker CXMT to roll out 8Gb LPDDR4 DRAM by end-2019
China-based DRAM maker ChangXin Memory Technologies (CXMT) is stepping up DRAM production deployments as it will kick off commercial runs of its production lines by the end of 2019...
Friday 2 March 2018
Almost 100 IC wafer fabs closed or repurposed from 2009-2017, says IC Insights
Semiconductor manufacturers around the world have closed or repurposed 92 wafer fabs from 2009-2017, according to data compiled by IC Insights.
Wednesday 17 June 2015
IC manufacturers close or repurpose 83 wafer fabs from 2009-2014, says IC Insights
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity in order to produce devices more cost-effectively on larger wafers...
Tuesday 21 February 2012
IC companies shutter 49 fabs from 2009-2011, says IC Insights
Data compiled by IC Insights reveals that 49 semiconductor wafer fabs were closed between 2009 and 2011.
Monday 29 August 2011
ProMOS will survive, says chairman
DRAM maker ProMOS Technologies has received approval at a special shareholders meeting for plans to reduce its current capital, and then raise additional funds through private placement...
Wednesday 11 May 2011
Infineon purchases Qimonda assets in Dresden for EUR100.6 million
Infineon Technologies announced on May 10 that the company has purchased real estate and manufacturing facilities from Michael Jaffe, insolvency administrator managing the assets...
Thursday 14 October 2010
Winbond takes delivery of immersion scanner for 40nm-class chips, says paper
Winbond Electronics recently took delivery of its first immersion lithography scanner, which is designed for 12-inch wafers at the 40nm-class node and beyond, according to a Chinese-language...
Tuesday 11 May 2010
Inotera's reported personnel change sparks speculation
Micron Technology reportedly will transfer Michael Sadler, the executive VP of Inotera Memories, to its US headquarters in Boise, sparking concerns whether the DRAM-manufacturing...
Tuesday 13 April 2010
Winbond on track to exit commodity DRAM market, says spokesperson
Winbond Electronics is confident that it will successfully transform into a niche DRAM and NOR flash maker in 2010, and gradually withdraw from the mainstream DRAM market, according...
Friday 9 April 2010
Winbond to develop in-house 46nm Buried Wordline process
Winbond Electronics has quietly recruited part of former Qimonda's R&D team and will develop a 46nm Buried Wordline stack process, making it the first Taiwan-based DRAM maker...