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Tuesday 27 October 2026
Broadcom, financial firms agree on US$63 billion funding for Anthropic chip purchases
Broadcom has reached a deal with several financial firms for them to finance the purchase of US$63 billion worth of its chips for Anthropic. The agreement highlights how the line between...
Tuesday 27 October 2026
Mitsubishi Materials scales thermistor capacity sixfold amid AI boom
Mitsubishi Materials will expand production of thermistors, temperature sensors used in optical communications equipment, as the spread of generative AI drives demand for optical transceivers...
Tuesday 27 October 2026
AI demand squeezes automotive memory, pushing automakers to take control of chip supply
Expanding investment in AI data centers is putting pressure on memory supply and demand across the automotive industry. As semiconductor companies prioritize high-bandwidth memory...
Tuesday 27 October 2026
Kazakhstan positions AI infrastructure as a potential export industry after Nvidia CEO's visit
Nvidia CEO Jensen Huang's visit to Kazakhstan highlighted plans to build an AI computing hub for Europe, with projects spanning GPU clusters, data centers, talent, and physical AI...
Tuesday 27 October 2026
AMD, Nvidia target substrate capacity amid 4x expansion constraints
AMD and Nvidia have separately invested in supply-chain capacity expansion, making substrates, packaging, and testing key priorities as AI demand diversifies. The moves show that chipmakers...
Tuesday 27 October 2026
Fujifilm expands South Korean capacity to meet AI chip demand
Fujifilm Electronic Materials is expanding its advanced semiconductor materials footprint in South Korea by increasing extreme ultraviolet (EUV) photoresist capacity in Pyeongtaek...
Tuesday 27 October 2026
Meta launches US$35 billion equity raise, funds US$60 billion at-the-market program for AI build-out
Meta Platforms has launched approximately US$35 billion of concurrent underwritten public offerings and plans an approximately US$60 billion at-the-market (ATM) program, as it funds...
Tuesday 27 October 2026
Samsung, SK Hynix eye 2Q27 shipments of 8-layer HBM4 to Nvidia
Samsung Electronics and SK Hynix are targeting the second quarter of 2027 to begin volume shipments of eight-layer HBM4 memory to Nvidia, ZDNet Korea reported on October 26,...
Tuesday 27 October 2026
DRAM price gains fall short as supply shrinks up to 50%
DRAM price growth has slowed sharply in the fourth quarter of 2026, but severe supply shortages are intensifying as manufacturers continue to restrict shipments. Industry sources expect...
Tuesday 27 October 2026
AI data center boom risks squeezing power chip supplies for auto, electronics
The rapid expansion of AI data centers is driving demand beyond GPUs, memory chips, and advanced packaging. As power consumption in GPU clusters rises, data centers need not only more...
Tuesday 27 October 2026
Weekly news roundup: iPhone Duo shipment target revised upward amid display issues
This week's coverage highlights shifting technology supply chains and rising demand across foldable smartphones, memory, energy storage, robotics, and AI infrastructure. Apple lifted...
Tuesday 27 October 2026
Anthropic's IPO filing puts TSMC, HBM, direct leasing at the center of AI compute risk
In its preliminary IPO registration statement filed with the US Securities and Exchange Commission, Anthropic describes how much of its capacity depends on a small group of chip and...
Tuesday 27 October 2026
Tata Communications plans up to US$450 million fibre network linking India's AI hubs
Tata Communications announced on October 26 that it plans to invest US$400-450 million in approximately 10,000 kilometers of long-haul fiber across India, linking data centers and...
Tuesday 27 October 2026
Amkor turns to customer prepayments as global packaging investment accelerates
Amkor Technology is using customer prepayments and longer-term commitments to support an expanding manufacturing network across the US, South Korea, and Vietnam, as demand for advanced...