CONNECT WITH US
NEWS TAGGED CAPACITY
Friday 31 July 2026
German joint ventures in China fall below 50% utilization as imports weaken
German auto joint ventures in China slipped below 50% capacity utilization in 2025 as weaker imported-car demand and the rapid rise of local brands reshaped the market. Mobility Global...
Friday 31 July 2026
Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
Friday 31 July 2026
Montage Announces Industry-First Trial Production of CXL 3.2 MXC

Montage Technology today announced the industry's first trial production of its CXL 3.2 Memory eXpander Controller (MXC) chip, designed to address escalating demands...

Friday 31 July 2026
US manufacturing push draws Taiwan suppliers; electronics investment up nearly 500%

TSMC chairman C.C. Wei has announced an additional US$100 billion investment for building capacity in the US, on top of the company's...

Friday 31 July 2026
AI server BBU demand triples battery-module capacity ahead of 800V HVDC rollout

Backup battery units are set to become standard equipment in AI servers using 800V high-voltage direct current architectures, according...

Friday 31 July 2026
Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines
Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site...
Thursday 30 July 2026
ASE sees full-year LEAP revenue topping US$3.5 billion amid tight packaging capacity
ASE Technology Holding said growing demand for advanced packaging and testing, combined with stronger momentum in its electronics manufacturing services (EMS) business, has tightened...
Thursday 30 July 2026
Samsung signs five-year memory deals as chip shortage stretches to 2028
Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing...
Thursday 30 July 2026
Microsoft's AI buildout: 88 new data centers, broader model catalog, silicon gains

Microsoft CEO Satya Nadella laid out how the company is scaling its AI infrastructure and platform to keep pace with demand. He outlined...

Thursday 30 July 2026
Samsung foundry to double 2nm design wins in 2026 on Broadcom talks; claims profit turnaround 'possible in near term'

Samsung Electronics' foundry business expects its 2nm project wins to more than double year-on-year in 2026, and the company is in...

Thursday 30 July 2026
Advantest lifts fiscal 2026 forecast as AI chip test demand surges

Advantest raised its outlook for the fiscal year ending March 2027 after demand for chip-test equipment tied to AI data centers strengthened,...

Thursday 30 July 2026
Samsung: memory shortage to worsen in 2027, persist through 2028; locks top customers into multi-year deals

Samsung Electronics expects the global memory shortage to become more severe in 2027 than in 2026 and to persist through 2028, memory...

Thursday 30 July 2026
Meta earnings series 2/2: Zuckerberg defends higher AI expenditure, outlines the path to returns

Meta Platforms' second-quarter results showed a widening gap between its fast-growing advertising business and the cost of building...

Thursday 30 July 2026
Arm readies AGI CPU shipments, eyes 3Q stream in fiscal 2028

Arm Holdings is preparing its first self-designed data center CPU, the Arm AGI CPU, for shipments by the end of calendar 2026, and...

Thursday 30 July 2026
UMC posts NT$42.26B profit on non-operating investment gains in 2Q26
United Microelectronics (UMC) reported consolidated second-quarter 2026 revenue of NT$68.73 billion (approx. US$2.12 billion) during its earnings call on July 29. The figure is up...