CONNECT WITH US
NEWS TAGGED CAPACITY
Wednesday 11 February 2026
Rapidus aims for 2nm ramp in FY2027 with fourfold capacity boost
Rapidus is expected to begin full-scale production in fiscal 2028. Mass production of 2nm-class chips is scheduled to commence in the second half of fiscal 2027, according to Kyoto...
Wednesday 11 February 2026
GPTC management shakeup raises concerns over TSMC, ASE, Micron orders
Grand Process Technology Corporation (GPTC), a key wet process equipment supplier in the supply chains of TSMC, ASE, and Micron, posted record consolidated revenue of NT$6.514 billion...
Wednesday 11 February 2026
TSMC supplier AblePrint sees January 2026 revenue jump 142% on AI chips packaging boom
Taiwan-based AblePrint Technology, a key supplier of advanced packaging defoaming equipment for major clients including TSMC, reported record-breaking performance despite earlier regulatory...
Wednesday 11 February 2026
Topoint plans second price hike in 1Q26 as tungsten price rises
Affected by the continued rise in tungsten carbide prices, PCB drill manufacturer Topoint Technology said that it plans to implement another price increase in the first quarter of...
Wednesday 11 February 2026
South Korean IC designers face year-long packaging delays
Surging demand for artificial intelligence servers and high-performance computing (HPC) has tightened capacity across the semiconductor supply chain. For many small South Korean communications...
Wednesday 11 February 2026
Why SMIC’s full fabs don’t guarantee fatter profits
China's largest contract chipmaker Semiconductor Manufacturing International Corporation (SMIC) reported a resilient fourth quarter and record full-year results for 2025, supported...
Wednesday 11 February 2026
Coretronic warns seasonal dip but sees 10-20% annual growth potential across product lines
Coretronic said shipments of its energy-saving and imaging products will fall in the first quarter of 2026 due to seasonal factors and fewer working days, while projecting 10–20%...
Wednesday 11 February 2026
Memory squeeze from AI demand threatens industrial PC margins and delivery timelines
The expansion of computing power driven by generative AI has repositioned memory as a critical resource, with data centers and AI servers redefining its value and leaving industrial...
Wednesday 11 February 2026
DIGITIMES Insight: Intel 14A delays expose cracks in AI infrastructure expectations
Intel's 14A process node has become a focal point for the semiconductor industry, with market observers viewing it as a critical test of the company's manufacturing resurgence strategy...
Tuesday 10 February 2026
Vanguard sees modest recovery as capacity use rises in early 2026

Vanguard International Semiconductor (VIS) reported consolidated revenue of NT$4.01 billion (approx. US$127 million) in January 2026,...

Tuesday 10 February 2026
US plans chip tariff breaks for tech giants tied to TSMC's US expansion
The Trump administration is preparing to spare major US technology companies from a new round of semiconductor tariffs as they expand data center capacity to support the artificial...
Tuesday 10 February 2026
TSMC posts 36.8% sales surge in January 2026 on strong AI demand

Taiwan Semiconductor Manufacturing Co.(TSMC) reported a sharp 36.8% jump in January revenue, underscoring an acceleration in global demand...

Tuesday 10 February 2026
Amkor accelerates US expansion with Arizona investment and closer alignment with TSMC
Amkor Technology is accelerating its global expansion, projecting 2026 capex between US$2.5 billion and US$3 billion. This plan emphasizes significant facility construction, including...
Tuesday 10 February 2026
Exclusive: China's TOPCon solar in survival mode as it faces overcapacity and rising costs
Technological iteration is supposed to symbolize progress. Yet N-type (Tunnel Oxide Oxide Passivated Contact) TOPCon technology, which has been in commercial deployment for only about...
Monday 9 February 2026
Samsung boosts HBM4 DRAM investment to secure market leadership
Samsung Electronics is set to begin mass production of the world's first sixth-generation high-bandwidth memory (HBM4) chips later in February 2026, marking a major milestone in the...