Lam Research has begun work on a new Oregon research lab as part of a more than US$3 billion global investment aimed at speeding development of advanced AI chips. The expansion could...
China is accelerating efforts to secure helium supplies as semiconductor manufacturing, commercial space launches, and medical imaging lift demand for a resource the country still...
China's lithium battery industry is shifting from an era of aggressive capacity expansion toward consolidation, as regulators rapidly clear deals aimed at revitalizing existing assets...
As strong AI demand continues to soak up semiconductor capacity, some ICs and passive components are seeing shortages and longer lead times. Qisda's display maker Data Image has stepped...
US President Donald Trump signed an executive order on August 26 declaring a national emergency over the security of America's electrical grid. It restricts the purchase, import, and...
Samsung Electronics is signaling a push into high bandwidth flash (HBF), extending its next-generation memory ambitions beyond HBM as rivals move to establish a new NAND-based memory...
Nvidia's GPU roadmap is pushing 800VDC into the spotlight as a key next-generation breakthrough, with battery backup modules (BBUs) set to gain in both quality and volume as high-density...
Doosan Corporation's Electro-Materials BG has developed copper-clad laminate (CCL) technology that reduces the prepreg (PPG) insulating layer used in memory semiconductor package substrates...
Kioxia Holdings is weighing construction of a new manufacturing building at its Kitakami plant in northern Japan, as rising NAND demand pushes the memory maker toward its next phase...
Hon Hai Technology Group, better known as Foxconn, is expanding its global manufacturing footprint through new land acquisitions, factory development, and capacity upgrades as demand...
Chinese panel makers' investment in next-generation OLED production is beginning to translate into reported sales at South Korean equipment suppliers, with several vendors posting...
Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most...
Taiwan's government said it will raise electricity supply capacity as it responds to rising demand from AI and industry. The comments came on August 26 at the opening of the 2026 New...
China's contract chipmakers spent the first half of 2026 proving something narrower than the headlines suggest. They demonstrated that domestic fabs can run at full capacity, raise...
