The industry's gradual migration toward 3D ICs with through-silicon vias (TSV) is unlikely to happen until 2015 or 2016, according to sources at semiconductor companies. Volume production...
STATS ChipPAC has announced that its through-silicon-via (TSV) capabilities have achieved a new milestone with the qualification of its 300mm mid-end manufacturing operation and transition...
Nanya Technology debuted prototype 8Gb QDP (quad-die package) DDR3 based on in-house-developed via-middle TSV (through silicon via) 3D IC technology at a July 18 investors conferen...
Singapore's Institute of Microelectronics (IME) and United Microelectronics (UMC), the world's second largest foundry company, have announced plans to jointly develop through-silicon...
STATS ChipPAC on January 5 hold a groundbreaking ceremony for its new factory in Singapore, according to the chip test and packaging service provider. The new 197,000-square foot...
While major IC packagers have already devoted resources on TSV (via-last) development, Taiwan Semiconductor Manufacturing Company (TSMC) is also eyeing the market with its front-end...
STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...
Japan-based DRAM maker Elpida Memory has approved plans to raise up to JPY79.67 billion (US$994 million), including a rights issue and convertible bonds (CBs). The funds raised will...
Elpida Memory on June 27 announced that it has begun sample shipments of its DDR3 SDRAM (x32-bit I/O configuration) made using TSV stacking technology. The sample is a low-power 8Gb...
STATS ChipPAC has expanded its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities, according to the company.
United Microelectronics Corporation (UMC) has acquired NT$561 million (US$19 million) worth of production equipment from subsidiary Hong Bao Technology (transliterated from Chinese),...
Taiwan-based Nanya Technology has teamed up with government-backed Industrial Technology Research Institute (ITRI) to develop a through silicon via (TSV) technology for high-capacity...
Samsung Electronics has announced a lineup of 8GB DDR3 modules developed using 3D chip stacking technology, which is also referred to as through silicon via (TSV). The company claimed...
The Taiwan government-backed Industrial Technology Research Institute (ITRI) has announced the establishment of an experimental lab, which deploys 12-inch wafer through silicon via...
United Microelectronics Corporation (UMC) expects to start sampling integrated 3D IC solutions using 28nm process technology in mid-2011, with volume production slated for 2012, according...
