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Wednesday 5 December 2018
Qualcomm intros 7nm, 5G-ready chip
Qualcomm has unveiled its Snapdragon 855 mobile platform to enable commercial 5G networks and mobile devices in early 2019.
Friday 30 November 2018
Worldwide semiconductor revenue hits record US$129.8 billion in 3Q18, says IHS
The global semiconductor industry revenue grew 7.4% sequentially in the third quarter of 2018, reaching a record US$129.8 billion, according to IHS Markit. Semiconductor growth occurred...
Friday 23 November 2018
Qualcomm expands R&D team in Taiwan
Qualcomm has been expanding its local R&D team in Taiwan to bring the company closer to its Taiwan-based partners such as TSMC for the development of 5G mobile chips, according...
Wednesday 1 August 2018
Apple, Qualcomm may make peace over 5G, supply chain speculates
Leading mobile chipmaker Qualcomm has revealed that new iPhone models for 2018 may not adopt its modem chip solutions amid a patent royalty row between them. But supply chain sources...
Tuesday 24 July 2018
Qualcomm delivers 5G NR mmWave and sub-6 GHz RF modules for mobile devices
Qualcomm has unveiled what the company claims is the world's first fully-integrated 5G NR millimeter wave (mmWave) and sub-6 GHz RF modules for smartphones and other mobile devices...
Monday 2 July 2018
Apple decision on MediaTek modem chips unlikely soon, say sources
It remains to be seen whether Apple will commit to buying modem chips from MediaTek for its next-generation iPhone devices despite mounting speculations that the US vendor is considering...
Friday 22 June 2018
TSMC likely to make Qualcomm 7nm Snapdragon chips
Speculation has been circulating that Qualcomm will return to TSMC for 7nm. Industry sources believe that the foundry with its 7nm FinFET process node will win back its major contract...
Wednesday 6 June 2018
MediaTek releases 5G modem chips set for shipment in 2019
MediaTek has newly released its 5G modem chipset solution, the Helio M70, to be fabricated using TSMC's 7nm process incorporating EUV technology, and will kick off official shipments...
Friday 23 March 2018
Galaxy S9+ materials cost US$43 more than previous versions, says IHS Markit
The new Samsung Galaxy S9+ equipped with 64GB of NAND flash memory (model number SM-G965U1) carries a bill of materials (BOM) cost of US$375.80, much higher than for previous versions...
Friday 23 March 2018
Samsung intros 10nm AP for high-end smartphones
Samsung Electronics has announced the availability of its latest application processor (AP), the Exynos 7 Series 9610, built using the company's 10nm FinFET process.
Tuesday 6 March 2018
Taiwan IC designers to embrace explosive orders for IoT chipsets
With the global IoT (Internet of Things) chipset markets, particularly in China, expected to grow sharply in 2018 along with the rapid development of diverse terminal devices and...
Friday 2 March 2018
High cost may dim initial prospects for 5G
With the imminent commercialization of 5G mobile technologies and services, mobile chipset suppliers, telecom operators and related supply chains will all face the initial incorporation...
Friday 2 February 2018
Mobile SoC designs, embedded processing lift microprocessor market
The fastest growing types of microprocessors in 2012-2017 were mobile system-on-chip (SoC) designs for smartphones and tablets, and microprocessors used in embedded-processing applications,...
Tuesday 26 December 2017
MediaTek may land modem chip orders from Apple in 2018
Taiwan IC designer MediaTek has a chance of winning orders for baseband modem chipsets from Apple, which is seeking additional modem chip capacity support after transferring half...
Tuesday 24 October 2017
Qualcomm gains further share of smartphone AP market in 1H17, says Strategy Analytics
The global smartphone applications processor (AP) market declined 5% on year to reach US$9.4 billion in the first half of 2017, according to Strategy Analytics. Qualcomm maintained...