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Wednesday 2 September 2026
Chinese foundry Hua Hong Grace adds 55,000-wpm Wuxi capacity in US$4.17 billion Phase III buildout
Chinese foundry Hua Hong Grace Semiconductor (HHGrace) is preparing another major expansion of its 12-inch wafer capacity, reinforcing its specialty-process footprint after a sharp...
Wednesday 2 September 2026
MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments
Sonix Technology expects consumer IC and MCU sales to keep growing in the second half of 2026, but memory shortages could slow imaging-product shipments. AI-driven demand is also squeezing...
Wednesday 2 September 2026
AI demand push expands wafer industry's growth outlook
AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain...
Wednesday 2 September 2026
US solar module capacity to lead by 2027, but cell and wafer shortages pose major hurdles
The US is rapidly reshaping the cost structure of its solar supply chain under Section 232 of the Trade Expansion Act of 1962. According to a recent webinar hosted by Intertek CEA,...
Tuesday 1 September 2026
Taiwan chip equipment maker Skytech opens advanced process lab with TSMC backing
Skytech and TSMC have opened an Advanced Process Laboratory focused on next-generation semiconductor manufacturing, highlighting TSMC's continued efforts to support Taiwan's domestic...
Tuesday 1 September 2026
ASML says High NA EUV has reached its first high-volume logic product
ASML told a SEMICON Taiwan audience that its High NA EUV platform has been used for a high-volume logic product for the first time, a threshold the company frames as the point at which...
Tuesday 1 September 2026
Trymax lands multi-year AOI order as InP laser capacity race tightens
Applied Optoelectronics (AOI) has placed a multi-year purchase order with Dutch equipment maker Trymax Semiconductor Equipment for plasma ashers and UV curing systems destined for...
Tuesday 1 September 2026
SEMI lifts 2028 wafer fab equipment forecast to US$220 billion
SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced...
Monday 31 August 2026
China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands

Hangzhou Lion Microelectronics plans to invest about CNY3 billion (approx. US$446 million) in a new 12-inch silicon wafer project in Jiaxing,...

Monday 31 August 2026
China's silicon wafer makers report profit gains of varying quality
Seven Chinese silicon wafer producers reported first-half 2026 results in the second half of August, indicating an uneven sector recovery. Several semiconductor-grade wafer makers...
Friday 28 August 2026
AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

Friday 28 August 2026
YMTC builds China chip supply chain around Wuhan fabs with 'Wutong Tree' Plan
Competition in China's memory sector is extending beyond wafer capacity and process technology into semiconductor equipment, materials and components. YMTC is expanding its domestic...
Thursday 27 August 2026
HTSI targets AI chip demand with SiPh, CPO, packaging push
Hermes Testing Solutions (HTSI) said revenue for the first seven months of 2026 reached NT$2.7 billion (US$83.8 million), up 128.2% year-over-year and already exceeding its full-year...
Wednesday 26 August 2026
TSMC packaging shift could boost AMD CoWoS share and trim Nvidia's allocation
Morgan Stanley said TSMC's advanced packaging allocation is expected to shift in 2027, as processor demand tied to agentic AI lifts AMD's CoWoS usage and reduces Nvidia's share. The...
Wednesday 26 August 2026
China has plenty of indium but not enough InP wafers for AI data centers
China accounts for more than 70% of the world's primary indium output but only about 10% of finished indium phosphide substrates, leaving a gap between its strength in raw materials...