CONNECT WITH US
NEWS TAGGED WAFER
Thursday 18 June 2026
Elon Musk aims for record maximum usable compute per wafer for AI6 chip
Following the announcement in April 2026 that the AI5 chip design had been finalized, Tesla CEO Elon Musk introduced a new benchmark, stating that under yield considerations, the AI6...
Thursday 18 June 2026
Imec, Sony unveil backside interconnect method for 3D chip stacking

Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and...

Thursday 18 June 2026
Samsung to offer 2nm prototype runs as South Korea pushes chip design

Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South...

Wednesday 17 June 2026
Nexchip reportedly broadens semiconductor ambitions with new design and materials subsidiary

Chinese foundry Nexchip is expanding beyond wafer manufacturing with the establishment of a new wholly owned subsidiary, marking its...

Wednesday 17 June 2026
PSMC buys NT$1.04 billion in Lam Research equipment to support capacity growth
Powerchip Semiconductor Manufacturing (PSMC) announced on June 16 that, effective from May 22, 2026, it purchased semiconductor production facilities and machinery from Lam Research...
Tuesday 16 June 2026
ASML, TSMC, and imec move 2D transistors closer to manufacturing reality
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor...
Monday 15 June 2026
Google's TPU diversification challenges MediaTek and other ASIC partners
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports...
Monday 15 June 2026
SK Hynix readies HBM4 packaging push as Nvidia demand grows

SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for...

Tuesday 9 June 2026
TSMC capacity crunch pushes Google, Nvidia closer to Intel
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup...
Monday 8 June 2026
India roundup: India state targets chip packaging hub as India courts Taiwanese electronics investment

Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry...

Friday 5 June 2026
Hiwin and Qualcomm bring edge AI to PLP equipment with Load Port tie-up at Computex
Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge...
Friday 5 June 2026
Nexchip carves out BGBM assets to back Wuhu wafer project, refocuses on 12-inch foundry business
Nexchip Semiconductor plans to carve out its BGBM business by contributing specialised equipment assets to Anhui Ruijing Semiconductor, a newly established power device wafer-processing...
Thursday 4 June 2026
Formosa Chemicals moves into AI data center materials and DUV photoresist precursors
Formosa Chemicals & Fibre Corp. announced plans to expand into high-value semiconductor and AI data center materials and will debut these businesses at COMPUTEX TAIPEI 2026. The...
Thursday 4 June 2026
Exclusive: China tightens its grip on Silicon Carbide as the industry shifts to 8-inch wafers
At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a...
Wednesday 3 June 2026
MediaTek denies rumored EMIB adoption timeline
MediaTek denied a foreign report about a timeline for adopting Intel Corp.'s embedded multi-die interconnect bridge packaging at a recent investor event and said its supply-chain strategy...