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Tuesday 21 July 2026
CMTX develops 590mm single-crystal silicon ground ring for chip etching

South Korean semiconductor materials and parts supplier CMTX has developed a roughly 590mm single-crystal silicon ground ring for chip-etching...

Tuesday 21 July 2026
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels

Samsung Electronics and SK Hynix are reportedly allocating additional or flexible DRAM production capacity to server DDR5 and other...

Tuesday 21 July 2026
VSMC warns AI-ready MES is becoming essential for wafer fabs, with China accelerating adoption

TSMC's sustained capital spending highlights the two foundations of its competitive strength: technology leadership and manufacturing excellence...

Monday 20 July 2026
HBM4 battle shifts to cooling as hybrid bonding slips
Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major...
Monday 20 July 2026
Rapidus taps Cadence AI agents to speed 2nm chip design
Japanese foundry Rapidus is integrating Cadence's AI-agent technology into its chip design platform as it seeks to shorten development cycles and attract customers for its planned...
Monday 20 July 2026
Exclusive Interview: Inside VSMC's Singapore fab, where silicon interposers and power chips underpin AI growth

TSMC raised its 2026 capital expenditure forecast to US$60–64 billion during its second-quarter earnings conference, with a substantial...

Monday 20 July 2026
CXMT's US$4B IPO fuels DRAM capacity race toward 350,000 wafers a month

Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing...

Monday 20 July 2026
Micron's 10-year deal with GlobalWafers signals tighter 12-inch supply

Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon...

Saturday 18 July 2026
SK Siltron begins liquidating US SiC unit amid Doosan sale talks
SK Siltron has reportedly started liquidating its US silicon carbide wafer subsidiary, SK Siltron CSS, as part of a restructuring plan discussed during earlier sale negotiations with...
Friday 17 July 2026
Tata's India chip debut reportedly to lean on 90nm, a humbler start than its 28nm pledge
India's first large-scale wafer fab will begin production on decades-old 90nm technology rather than the 28nm node the Tata group publicly touted, a step that underscores how far the...
Friday 17 July 2026
TSMC boosts US manufacturing as Taiwan chip designers wait on moving production

TSMC Chairman C.C. Wei formally announced on July 16 that the company will invest an additional US$100 billion in the US, funding several...

Thursday 16 July 2026
C.C. Wei on EMIB, memory envy, and why TSMC won't squeeze its customers
TSMC Chairman and CEO C.C. Wei used the company's second-quarter 2026 earnings call to push back on two narratives gaining traction among analysts: that rival packaging technologies...
Thursday 16 July 2026
TSMC eyes record quarter: 2nm ramp drives 3Q26 guidance above US$44B

TSMC is projecting its strongest quarter ever, guiding third-quarter 2026 revenue to between US$44.6 billion and US$45.8 billion on...

Thursday 16 July 2026
TSMC 2Q26 profit surges 77% to a record on AI demand, first 2nm revenue

TSMC reported record second-quarter 2026 results on July 16, with revenue, profit, and earnings per share all surpassing market expectations,...

Thursday 16 July 2026
MCU lead times stretch, but industry holds the line against a pandemic-style order rush

Microcontrollers (MCUs), widely used across industrial automation, medical devices, and consumer electronics, are experiencing longer...