中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Analysis: China's AI data center buildout vaults to No. 2 as Big Tech capex races toward US$100 billion
    21min ago
    China's chip-tool localization accelerates: ACM Research backlog jumps 88%
    23min ago
    Four glass makers converge on 510x515mm substrate, hinting at TSMC’s next move
    Sep 30, 18:39
    NEWS TAGGED WAFER
    Wednesday 30 September 2026
    NSIG chair exit brings leadership succession into focus
    National Silicon Industry Group (NSIG) chairman Haitao Jiang has resigned from all positions at the company, prompting the Shanghai-listed semiconductor materials supplier to begin...
    Wednesday 30 September 2026
    VSMC bets on value over cost as Singapore fab builds next-generation R&D and IP capabilities
    VisionPower Semiconductor Manufacturing Company (VSMC), the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, opened its 12-inch wafer fab in...
    Wednesday 30 September 2026
    CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
    China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment,...
    Wednesday 30 September 2026
    Foundry 2.0 revenue hits record as growth spreads beyond TSMC
    Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center...
    Wednesday 30 September 2026
    Tesla secures US$30B credit package to fuel AI and robot capex race
    Tesla disclosed on September 29 that it has arranged US$30 billion in new loans and credit facilities as it ramps up investment in AI and robotics, according to a regulatory filing...
    Wednesday 30 September 2026
    CXMT expansion meets surging GigaDevice DRAM demand, sharpening China's memory supply-chain buildout
    CXMT's continued DRAM capacity expansion is coinciding with stronger demand from China's domestic memory sector.
    Wednesday 30 September 2026
    Inside China's 3D DRAM push: from lab to fab, and the road ahead
    China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of...
    Tuesday 29 September 2026
    CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
    China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and additional back-end DRAM testing capacity, stepping up...
    Tuesday 29 September 2026
    HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5
    High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate...
    Tuesday 29 September 2026
    VSMC Singapore fab fully booked as VIS weighs Fab 2
    Capacity at VisionPower Semiconductor Manufacturing Company's (VSMC) first 12-inch wafer fab in Singapore is fully booked as the joint venture between Vanguard International Semiconductor...
    Tuesday 29 September 2026
    TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
    VSMC, the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, officially opened its first 12-inch wafer fab in Singapore on September 28, completing...
    Tuesday 29 September 2026
    Vanguard chairman says AI slowdown won't free up chip capacity

    Vanguard International Semiconductor (VIS) and NXP Semiconductors' joint venture, VisionPower Semiconductor Manufacturing Company (VSMC),...

    Thursday 24 September 2026
    Chinese foundry CanSemi seeks US$918M ChiNext listing
    Guangzhou-based wafer foundry CanSemi Technology has set its initial public offering (IPO) price at CNY12.01 per share on Shenzhen's ChiNext board. The company aims to raise CNY6.16...
    Thursday 24 September 2026
    Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding
    Samsung Electronics has reportedly revised the roadmap for its first sub-10nm DRAM generation, making a wafer-to-wafer hybrid-bonding architecture the baseline for its D0a process...
    Thursday 24 September 2026
    TSMC locks in 3-6% wafer out price hikes for 2027

    TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends...

    1/28 pages
    Research_DB
    BIZ FOCUS
    Oct 1, 08:00
    Speed 3D Showcases On-Device AI Generation with Snapdragon X2 Elite
    Thursday 1 October 2026
    From Excel to Editable Presentations: AI Streamlines Financial Reporting
    Wednesday 30 September 2026
    Hackathon Team Optimizes Urban Evacuation Decision-Making
    Wednesday 30 September 2026
    AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
    Semicon_TW