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NEWS TAGGED WAFER
Wednesday 19 August 2026
Cerebras' CS-4 rack combines three wafer-scale processors, claims 2x gain over CS-3
Cerebras Systems on Tuesday announced the CS-4, a rack-scale AI accelerator the company says is up to twice as fast as its current CS-3 system and up to 30 times faster than GPU-based...
Wednesday 19 August 2026
PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...
Wednesday 19 August 2026
Charts: Taiwan's materials suppliers split: wafer giants stall, substrate and lead-frame names run

The two largest silicon wafer companies are the sector's slowest growers on a cumulative basis. Everything running fast sits downstream...

Tuesday 18 August 2026
Arm faces capacity squeeze as CPU demand tops US$2 billion

Arm Holdings' expansion from asset-light IP licensing into finished data center processors is putting the company into direct competition...

Tuesday 18 August 2026
ITH OLED, T-Con ramps position 3Q26 revenue to defy market headwinds
Driven by a recovery across smartphone, notebook, industrial control, and automotive applications, ITH Corporation, the parent company of Ili Technology (Ilitek), posted solid revenue...
Monday 17 August 2026
Fallout from Wingtech's Nexperia rupture: the price of rebuilding China's chip supply chain

Wingtech is entering a sharply different phase after dismantling much of its product-integration business and losing effective control...

Monday 17 August 2026
Hermes Testing's 1H26 profit more than triples on rising AI testing demand
Hermes Testing Solutions (HTSI), a semiconductor testing solutions provider, stated that continued growth in demand for artificial intelligence (AI) and high-performance computing...
Monday 17 August 2026
OCI thins solar wafers to boost Vietnam output 39%
OCI Holdings is turning to thinner solar wafers to raise output from its Vietnam operations by nearly 40% without adding production lines, as demand from US customers outpaces existing...
Friday 14 August 2026
SK hynix scouts US memory fab sites as customers seek local supply
SK hynix has spent more than a month studying potential locations in the US and other regions for a front-end memory fab, as American customers press the company to expand wafer production...
Friday 14 August 2026
Eternal Precision Mechanics accelerates advanced packaging push with wafer lamination
Eternal Precision Mechanics (EPM), a small but fast-growing subsidiary of Eternal Materials, is accelerating its shift from IC substrates into advanced packaging equipment. The company...
Friday 14 August 2026
SMIC's pricing power arrives as AI pushes mature-node work into China
China's largest contract chipmaker has spent most of the past two years increasing volume without much to show for it in terms of margins. The June quarter broke that pattern. Semiconductor...
Friday 14 August 2026
Musk hints at FEL light source for Terafab; ASML eyes FEL-EUV push
After EVs, rockets, and humanoid robots, Elon Musk appears to be turning his attention to optimizing the chip manufacturing process. When he unveiled a US$16.8 billion initial investment...
Friday 14 August 2026
SK Hynix advances Yongin fab construction for 2027 cleanroom launch
SK hynix has pushed construction of its semiconductor campus in Yongin, Gyeonggi Province, South Korea, to 87% completion as it targets February 2027 for the start of operations at...
Friday 14 August 2026
Rapidus targets 8-reticle interposers by 2030
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...