Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

SICC reported stronger first-half 2026 revenue and margins as its 8-inch silicon carbide substrate business gained scale, highlighting...

Introduction

The two largest silicon wafer companies are the sector's slowest growers on a cumulative basis. Everything running fast sits downstream...

Arm Holdings' expansion from asset-light IP licensing into finished data center processors is putting the company into direct competition...

Wingtech is entering a sharply different phase after dismantling much of its product-integration business and losing effective control...