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Friday 14 August 2026
Eternal Precision Mechanics accelerates advanced packaging push with wafer lamination
Eternal Precision Mechanics (EPM), a small but fast-growing subsidiary of Eternal Materials, is accelerating its shift from IC substrates into advanced packaging equipment. The company...
Friday 14 August 2026
SMIC's pricing power arrives as AI pushes mature-node work into China
China's largest contract chipmaker has spent most of the past two years increasing volume without much to show for it in terms of margins. The June quarter broke that pattern. Semiconductor...
Friday 14 August 2026
Musk hints at FEL light source for Terafab; ASML eyes FEL-EUV push
After EVs, rockets, and humanoid robots, Elon Musk appears to be turning his attention to optimizing the chip manufacturing process. When he unveiled a US$16.8 billion initial investment...
Friday 14 August 2026
SK Hynix advances Yongin fab construction for 2027 cleanroom launch
SK hynix has pushed construction of its semiconductor campus in Yongin, Gyeonggi Province, South Korea, to 87% completion as it targets February 2027 for the start of operations at...
Friday 14 August 2026
Rapidus targets 8-reticle interposers by 2030
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
Friday 14 August 2026
PixArt revenue rises on game-console demand as margin pressure grows

PixArt's latest results signal how shifting demand across consumer electronics and emerging sensor markets can reshape profitability...

Thursday 13 August 2026
LandMark Optoelectronics posts surge in profit on silicon photonics demand
LandMark Optoelectronics Corp. reported a sharp jump in revenue, margins, and profit in the second quarter of 2026, driven by strong demand for silicon photonics products and higher...
Thursday 13 August 2026
Yangtze Memory-backed capital expands into FD-SOI specialty process investment

Changcun Capital, the investment arm backed by Yangtze Memory Technologies Co., has completed a strategic investment in RuiLiPingxin...

Thursday 13 August 2026
LSE Semiconductor wins strategic investment from TIS

Lithography Semiconductor Equipment Co. (LSE) officially announced on August 11 that TECO Image Systems Co. (TIS) had completed a strategic...

Wednesday 12 August 2026
Topco and Wah Lee post record July sales on semiconductor materials demand

Topco Scientific Co. and Wah Lee Industrial Corp. both reported record July revenue as chipmakers ran at full utilization and customers...

Wednesday 12 August 2026
Samsung weighs power subsidiary to secure semiconductor electricity by 2027
Samsung Group was reported to be considering a dedicated in-house power-procurement subsidiary to secure electricity directly for its semiconductor production facilities, with operations...
Tuesday 11 August 2026
GMT says PMIC demand outstrips supply, prioritizes wafer grabs

Taiwanese power management IC (PMIC) maker Global Mixed-mode Technology (GMT) said at a recent investor conference that its revenue...

Tuesday 11 August 2026
China silicon wafer expansion accelerates: Eswin scales 12-inch capacity, Lion Micro consolidates 6- and 8-inch assets

China's silicon wafer industry is entering a new phase of simultaneous capacity expansion and consolidation, with Xi'an Eswin Material...

Tuesday 11 August 2026
UMC revenue climbs to a 45-month high as wafer prices rise
United Microelectronics Corporation (UMC) reported July 2026 consolidated revenue of NT$23.84 billion, up 1.8% from June and 18.98% from a year earlier, marking the highest level in...
Monday 10 August 2026
Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography
AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week...