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NEWS TAGGED WAFER
Thursday 15 October 2026
TSMC bars capacity resale, aims to leave no AI money on the table
TSMC will not let customers sublease or auction off their wafer capacity allocations, chairman C.C. Wei said during the company's October 15 earnings call. With AI chip demand still...
Thursday 15 October 2026
Applied Materials CEO says agentic AI drives wafer demand
Applied Materials CEO Gary Dickerson said customer demand to produce more good dies per wafer and rapidly expand wafer output has reached levels unprecedented in his career, driven...
Thursday 15 October 2026
TSMC's AI-fuelled profit streak hits sixth straight record in 3Q26, but 2nm expansion weighs on margins
On October 15, 2026, TSMC reported its sixth consecutive quarter of record net profit, with third-quarter earnings rising 68.7% year-over-year to NT$763.06 billion (approx. US$23.6...
Thursday 15 October 2026
Intel Israel fab explosion kills 1, seriously injures 2 workers
An explosion and fire at Intel's wafer fab in Kiryat Gat, southern Israel, on October 14, 2026, seriously injured three employees, one of whom later died of his injuries. Authorities...
Thursday 15 October 2026
US urges chipmakers to use domestic capacity as CHIPS Act strategy shifts from fab subsidies to securing orders
Bill Frauenhofer, executive director of semiconductor investment and innovation at the US Department of Commerce, joined Entegris CEO David Reeder for a fireside chat at SEMICON West...
Thursday 15 October 2026
Applied Materials targets US$5 billion advanced packaging revenue
Applied Materials sees advanced packaging as a key growth lever as AI chips move to multi-die designs, with the company projecting more than US$5 billion in related revenue in the...
Thursday 15 October 2026
Semiconductors to consume 30% of Taiwan's power by 2035
Rising demand for semiconductor wafer fabrication, memory, advanced packaging and high-end servers is driving a sharp increase in Taiwan's power consumption. Taipower estimates that...
Thursday 15 October 2026
Applied Materials tracks 100-plus fabs as cleanroom capacity limits equipment growth
Applied Materials tracked more than 100 wafer fabrication projects worldwide over the past two quarters as strong artificial intelligence demand continued to meet constraints in cleanroom...
Thursday 15 October 2026
UMC declines expedited Samsung order for Galaxy Z Fold8; GF eyed as backup DDI foundry
Following stronger-than-expected demand for its Galaxy Z Fold8, Samsung Electronics submitted an expedited wafer production request to United Microelectronics Corporation (UMC) that...
Wednesday 14 October 2026
Applied Materials CEO says AI race hinges on technology and capacity
The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
Wednesday 14 October 2026
Memory bottlenecks drive HBM shift to 8-layer stacks
As the gap between memory supply and demand widens due to the surge in AI applications, supply chain sources report that major GPU and custom ASIC vendors are considering lower-spec...
Tuesday 13 October 2026
Hua Hong deepens China chip equipment partnerships, targets stronger specialty foundry share by 2030
China's Hua Hong Group has signed strategic agreements with four domestic semiconductor equipment suppliers to accelerate the adoption of locally developed wafer fabrication tools,...
Tuesday 13 October 2026
Nanya Technology's LTAs cover up to 70% of capacity as Pingtung 3D IC plant targets 2H28 production
Nanya Technology reported record profits in the third quarter of 2026, with president Pei-Ing Lee saying long-term agreements (LTAs) now cover approximately 50–70% of the company's...
Monday 12 October 2026
Booked before launch, Tata's Dholera fab faces test of turning commitments into wafer volume
Tata Electronics has six customers at different stages of engagement with its Dholera semiconductor fab, including three with what a person familiar with the project described as binding...
Wednesday 7 October 2026
Chip price hikes loom as Taiwan IC designers brace to pass on costs through 2027
Taiwanese integrated circuit (IC) design firms report that passing on costs to customers will likely continue through 2027 as upstream foundry and outsourced semiconductor assembly...