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Tuesday 25 August 2026
Insight: One Nexperia, two supply chains? China-Europe split tests automotive chip model
Nexperia China is accelerating its separation from the Dutch chipmaker's traditional European manufacturing network, raising the prospect that one of the world's largest suppliers...
Tuesday 25 August 2026
Nexperia China rebuilds 12-inch local supply chain after 330 days
Nexperia China said it has rebuilt a domestic 12-inch wafer supply chain after 330 days of overseas wafer supply disruptions, unveiling the new platform at a press conference outlining...
Tuesday 25 August 2026
Samsung Foundry sees higher 4nm volumes as Nvidia ramps Groq 3
Nvidia's Groq 3 ramp is adding meaningful 4nm volume to Samsung Electronics' foundry business, with monthly wafer input estimated at about 10,000 and expected to rise above 15,000...
Tuesday 25 August 2026
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow

Samsung Electronics and SK Hynix are stepping up equipment spending at their NAND flash plants in China through 2027, upgrading existing...

Tuesday 25 August 2026
Inergy server share hits 47% on cooling, BBU demand

Inergy Technology said strong demand for AI server cooling and power management pushed the share of server-related applications to 47%...

Monday 24 August 2026
Samsung's DRAM capacity lead shrinks as SK Hynix expands faster

Samsung Electronics' DRAM wafer capacity will grow only marginally through 2027, with investment directed at node migration and line...

Monday 24 August 2026
Podcast highlights: TSMC Arizona's profit turnaround, US manufacturing viability pressures South Korean memory makers
DIGITIMES analyst Luke Lin noted on a recent podcast that when reviewing TSMC's semiannual and first-quarter 2026 financial reports, the operational health and profitability of its...
Friday 21 August 2026
CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth
Bosch Rexroth, the industrial technology subsidiary of Bosch, showcased advanced semiconductor and smart manufacturing solutions at the 2026 Taipei International Industrial Automation...
Friday 21 August 2026
FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

Thursday 20 August 2026
Chinese SiC substrate maker SICC hits record Q2; 8-inch wafers top 50% of core revenue

SICC reported stronger first-half 2026 revenue and margins as its 8-inch silicon carbide substrate business gained scale, highlighting...

Thursday 20 August 2026
India's chipmaking push faces its real test after initial wafers: yield
India's semiconductor manufacturing drive will face one of its toughest tests after equipment is installed and production begins: whether new fabs can consistently produce enough working...
Wednesday 19 August 2026
Cerebras' CS-4 rack combines three wafer-scale processors, claims 2x gain over CS-3
Cerebras Systems on Tuesday announced the CS-4, a rack-scale AI accelerator the company says is up to twice as fast as its current CS-3 system and up to 30 times faster than GPU-based...
Wednesday 19 August 2026
PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...
Wednesday 19 August 2026
Charts: Taiwan's materials suppliers split: wafer giants stall, substrate and lead-frame names run

The two largest silicon wafer companies are the sector's slowest growers on a cumulative basis. Everything running fast sits downstream...