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    US FCC, White House tighten controls on power systems, raising the trust bar for Taiwanese suppliers
    12min ago
    NEWS TAGGED WAFER
    Tuesday 15 September 2026
    Ainos pushes AI Nose into semiconductor front-end manufacturing
    Ainos said its second-generation AI Nose has entered commercial deployment at semiconductor fabs, signaling growing interest in chemical sensing for industrial AI. The move highlights...
    Tuesday 15 September 2026
    Exclusive: China's 8-inch SiC suppliers turn to pricing discipline after 6-inch price war

    As the silicon carbide (SiC) industry shifts from 6-inch to 8-inch wafer manufacturing, leading China-based substrate suppliers are...

    Monday 14 September 2026
    AI demand lifts UMC, VIS, PSMC revenue

    After mature-node price competition from 2023 to 2025, AI demand has spread from GPUs and HBM to power management ICs (PMICs), power...

    Sunday 13 September 2026
    Artery secures spot in Arm ecosystem, pushing high-end MCUs into robotics, physical AI

    As Arm targets expansion in physical AI, microcontroller (MCU) maker Artery Technology has emerged as a key ecosystem partner. Focusing...

    Friday 11 September 2026
    Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says
    Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and...
    Thursday 10 September 2026
    Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens

    Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing...

    Wednesday 9 September 2026
    Jin Lian Cheng expands into semiconductor wafer fab UPS battery recycling
    Jin Lian Cheng Resources completed an upgrade to its desulfurization production line as demand increased for lead-acid battery recycling tied to high-spec uninterruptible power supply...
    Wednesday 9 September 2026
    China's up to 99.2% anti-dumping duty on Japan DCS boosts local chip material suppliers
    China has imposed provisional anti-dumping measures on Japanese dichlorosilane (DCS), a semiconductor material used in thin-film deposition, potentially accelerating Chinese wafer...
    Tuesday 8 September 2026
    Samsung speeds silicon photonics test plan with TSMC-vetted probe vendors
    Samsung Electronics has moved to accelerate its silicon photonics push by using the same test partners selected by Taiwan Semiconductor Manufacturing Co. for key validation work, according...
    Tuesday 8 September 2026
    CXMT sees tight DRAM supply through 2H26, accelerates server memory and China-made tool validation
    Chinese DRAM maker ChangXin Memory Technologies (CXMT) expects global memory supply to remain tight through the second half of 2026, with AI-driven demand supporting prices while the...
    Monday 7 September 2026
    Experts say subsidies can't buy semiconductor competitiveness
    At a forum jointly hosted by DSET and SEMI during SEMICON Taiwan this year, Glenn D. Tiffert of the Hoover Institution, Kioxia Holdings board member Emiko Higashi, and NRC...
    Sunday 6 September 2026
    BenQ Materials targets CPO in semiconductor push
    BenQ Materials Group has formally positioned semiconductor materials as a key future growth driver, using its existing coating, membrane, foaming, and adhesive technologies to move...
    Saturday 5 September 2026
    Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics
    Dutch equipment maker ITEC used Semicon Taiwan to promote a die-bonding architecture that it says triples throughput over earlier versions of the design by removing the largest source...
    Friday 4 September 2026
    SEMICON Taiwan 2026: QuantumDiamonds cracks the hybrid bonding blind spot with new inline metrology
    The global semiconductor industry is hitting a physical wall. As artificial intelligence demands push architectures toward three-dimensional packaging, high-bandwidth memory (HBM)...
    Friday 4 September 2026
    Processor, memory boom could push chip supply chain out of sync, says Yole
    Gary Huang, vice president and head of Asia-Pacific research and business development at Yole Group, said the imbalance is already showing signs of what he described as supply-chain...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Semicon_TW