CONNECT WITH US
NEWS TAGGED WAFER
Wednesday 30 September 2026
Inside China's 3D DRAM push: from lab to fab, and the road ahead
China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of...
Tuesday 29 September 2026
CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and additional back-end DRAM testing capacity, stepping up...
Tuesday 29 September 2026
HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5
High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate...
Tuesday 29 September 2026
VSMC Singapore fab fully booked as VIS weighs Fab 2
Capacity at VisionPower Semiconductor Manufacturing Company's (VSMC) first 12-inch wafer fab in Singapore is fully booked as the joint venture between Vanguard International Semiconductor...
Tuesday 29 September 2026
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
VSMC, the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, officially opened its first 12-inch wafer fab in Singapore on September 28, completing...
Tuesday 29 September 2026
Vanguard chairman says AI slowdown won't free up chip capacity

Vanguard International Semiconductor (VIS) and NXP Semiconductors' joint venture, VisionPower Semiconductor Manufacturing Company (VSMC),...

Thursday 24 September 2026
Chinese foundry CanSemi seeks US$918M ChiNext listing
Guangzhou-based wafer foundry CanSemi Technology has set its initial public offering (IPO) price at CNY12.01 per share on Shenzhen's ChiNext board. The company aims to raise CNY6.16...
Thursday 24 September 2026
Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding
Samsung Electronics has reportedly revised the roadmap for its first sub-10nm DRAM generation, making a wafer-to-wafer hybrid-bonding architecture the baseline for its D0a process...
Thursday 24 September 2026
TSMC locks in 3-6% wafer out price hikes for 2027

TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends...

Wednesday 23 September 2026
Nexperia China turns 12-inch wafers into the backbone of its chip supply-chain reset

Nexperia China is accelerating production on its domestic 12-inch wafer platform as it rebuilds a locally controlled semiconductor supply...

Tuesday 22 September 2026
Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries

China's silicon carbide (SiC) end-market demand is expanding rapidly, driven by high-voltage charging infrastructure and AI servers...

Tuesday 22 September 2026
YMTC's capital arm enters FD-SOI — China's 12-inch SOI build-out gathers pace

China's FD-SOI supply chain is taking shape through a new round of investment. Changcun Capital, the investment platform backed by YMTC,...

Monday 21 September 2026
CXMT closes in on DRAM leaders with G5 process breakthrough

China's CXMT has begun mass production of its fifth-generation DRAM platform, or G5, claiming process capabilities comparable with the...

Monday 21 September 2026
IBM unit secures US$1 billion CHIPS Act award to expand quantum wafer manufacturing
Anderon LLC, an IBM company, has finalized a US$1 billion award under the US CHIPS and Science Act to expand quantum wafer manufacturing in Albany, New York. The move could help speed...
Friday 18 September 2026
Samsung deepens Euclyd ties as startup reportedly reaches test-chip stage

Samsung Electronics is deepening its relationship with Dutch chip startup Euclyd after the company reportedly reached the test-chip...