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NEWS TAGGED WAFER
Tuesday 28 July 2026
CXMT's record IPO and Apple talks collide with US curbs as DRAM tightens

AI-driven demand is tightening the global memory market just as China's leading DRAM producer, ChangXin Memory Technologies, or CXMT,...

Tuesday 28 July 2026
EYEQ Lab completes 200mm SiC line validation with yield above 90%

South Korean power semiconductor maker EYEQ Lab has completed mass-production validation of its dedicated 8-inch, or 200mm, silicon carbide...

Tuesday 28 July 2026
China's Yunnan Germanium wins long-term InP wafer order as AI optical demand rises
Yunnan Germanium has secured a major supply deal for indium phosphide (InP) wafers, underscoring how AI data center buildouts are reshaping global demand for high-speed optical parts...
Monday 27 July 2026
Disco lifts first-half profit forecast on steady AI equipment demand
Japanese semiconductor equipment maker Disco expects net profit for the six months ending September 30, 2026, to rise 32% year over year to JPY73.8 billion (approx. US$461 million),...
Friday 24 July 2026
China's Xi'an Eswin tops 1 million monthly 12-inch wafer sales and output, targets 1.8 million capacity

China's 12-inch silicon wafer maker Xi'an Eswin Material Technology said monthly output and sales of its 12-inch electronic-grade silicon...

Wednesday 22 July 2026
SK Hynix denies report it is pursuing deal for Intel's Ohio fab

SK Hynix said in a July 22 disclosure that it had neither pursued nor decided on an acquisition of Intel's under-construction semiconductor...

Wednesday 22 July 2026
TSMC raises 2027 chip prices, giving Intel fresh pricing room

TSMC's planned 2027 wafer price increases are reinforcing confidence that AI chip demand remains strong while prompting fresh discussion...

Tuesday 21 July 2026
CMTX develops 590mm single-crystal silicon ground ring for chip etching

South Korean semiconductor materials and parts supplier CMTX has developed a roughly 590mm single-crystal silicon ground ring for chip-etching...

Tuesday 21 July 2026
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels

Samsung Electronics and SK Hynix are reportedly allocating additional or flexible DRAM production capacity to server DDR5 and other...

Tuesday 21 July 2026
VSMC warns AI-ready MES is becoming essential for wafer fabs, with China accelerating adoption

TSMC's sustained capital spending highlights the two foundations of its competitive strength: technology leadership and manufacturing excellence...

Monday 20 July 2026
HBM4 battle shifts to cooling as hybrid bonding slips
Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major...
Monday 20 July 2026
Rapidus taps Cadence AI agents to speed 2nm chip design
Japanese foundry Rapidus is integrating Cadence's AI-agent technology into its chip design platform as it seeks to shorten development cycles and attract customers for its planned...
Monday 20 July 2026
Exclusive Interview: Inside VSMC's Singapore fab, where silicon interposers and power chips underpin AI growth

TSMC raised its 2026 capital expenditure forecast to US$60–64 billion during its second-quarter earnings conference, with a substantial...

Monday 20 July 2026
CXMT's US$4B IPO fuels DRAM capacity race toward 350,000 wafers a month

Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing...