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Monday 5 January 2026
TSMC's US fabs expose structural cost gap with Taiwan

The economics of advanced semiconductor manufacturing in the US differ sharply from those in Taiwan, and TSMC's experience in Arizona...

Monday 5 January 2026
Nexchip Semiconductor launches US$5.1bn Hefei fab to scale 28nm mature-node capacity

China's domestic foundry expansion gained momentum this week as Nexchip Semiconductor broke ground on its Phase IV project in Hefei, committing...

Friday 2 January 2026
US approval of TSMC equipment exports to China reflects strategy shift
Following reports that the US government had granted annual export licenses to South Korea's Samsung Electronics and SK Hynix, the US Department of Commerce (DOC) has also approved...
Friday 2 January 2026
China's CXMT moves toward IPO with global DRAM share nearing 4%
China's leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to...
Thursday 1 January 2026
China capacity expansion and weakening end-market demand prompt cost reductions for 28nm process
The 28-nanometer process has become the most popular node among mature processes. It boasts the highest utilization rates and the strongest price support. However, market conditions...
Thursday 1 January 2026
Spirox to ship self-developed TSV inspection equipment in 1H26, easing wafer fab bottlenecks
Veteran semiconductor equipment distributor Spirox has successfully entered the advanced packaging supply chain in the second half of 2025 with its self-developed advanced optical...
Wednesday 31 December 2025
China's CXMT eyes US$4.2B Shanghai IPO to fuel memory chip expansion

China's leading domestic DRAM maker, ChangXin Memory Technologies (CXMT), is seeking to raise CNY29.5 billion (approx. US$4.2 billion)...

Wednesday 31 December 2025
YMTC pushes for equipment localization despite elusive profitability
As China's leading 3D NAND maker, Yangtze Memory Technologies (YMTC) has recently been regarded as the most aggressive company in promoting the adoption of domestic equipment. Its...
Tuesday 30 December 2025
Taiwan quake damages key quartz tubes at fabs, putting chip recovery in focus

A magnitude 7.0 earthquake off Taiwan's eastern coast late on December 27 disrupted parts of the island's semiconductor supply chain, after...

Tuesday 30 December 2025
Samsung rumored to jump to 2nm at Texas fab, signaling US chip competition
Samsung Electronics is reportedly upgrading its Texas fab from 4nm to 2nm, aiming to rival TSMC in the US market. If confirmed, the move could reshape supply chains for major tech...
Tuesday 30 December 2025
SMIC acquires remaining stake in wafer unit for US$5.8 billion
Semiconductor Manufacturing International Corp. (SMIC), China's largest contract chipmaker, said on Monday it will take full control of its SMNC wafer manufacturing unit in a transaction...
Monday 29 December 2025
Nvidia reportedly sets 4Q26 target for 16-high HBM supply
Nvidia has reportedly asked memory suppliers to prepare for the delivery of 16-high high-bandwidth memory by the second half of 2026, according to industry sources cited by South...
Friday 26 December 2025
SK Hynix targets February HBM4 ramp-up with TSMC, ships final samples to Nvidia
SK Hynix is scheduled to deliver final samples of its next-generation high-bandwidth memory to Nvidia in early January 2025. This comes as the South Korean chipmaker nears a February...
Wednesday 24 December 2025
Samsung boosts Texas staff and upgrades gear to hit 2026 targets for Tesla and xAI
Samsung Electronics is reportedly advancing preparations for its 2026 wafer foundry scale-up at the Taylor, Texas, fab by increasing local headquarters staff and reorganizing production...
Wednesday 24 December 2025
CHIPX eyes Malaysia for 8-inch GaN-on-SiC wafer fab

Dublin-based semiconductor startup CHIPX plans to build an 8-inch gallium nitride on silicon carbide wafer fabrication plant in Malaysia...