Apple's A-series chips have evolved significantly, with transistor counts rising from 1 billion in the A7 to 20 billion in the A18 Pro. This advancement has driven a transition from...

JASM, TSMC's majority-owned subsidiary, began production at its first wafer fab in Kikuyo, Kumamoto Prefecture, in December 2024. The fab produces 12/16nm and 22/28nm mature-node...

TSMC has confirmed mass production at its Japanese wafer fab, marking a significant milestone in its overseas expansion strategy amid geopolitical uncertainties. While its Japan project...

Reports indicate that SK Hynix's wafer foundry subsidiary, SK Hynix System IC has initiated a voluntary retirement plan for its entire workforce. SK Hynix System IC specializes in...

Samsung Electronics, after previously securing orders for 2nm AI accelerators from Japanese AI startup Preferred Networks (PFN), is reportedly set to supply 2nm chips to a South Korean...

TSMC's first wafer fab in Kumamoto, Japan, operated by its subsidiary Japan Advanced Semiconductor Manufacturing (JASM), has officially begun mass production, marking a significant...

Hon Hai Technology Group (Foxconn) has formed a partnership with UK-based Porotech to develop augmented reality (AR) glasses, combining Porotech's advanced gallium nitride (GaN) technology...

The Biden-Harris Administration has imposed export controls and technology restrictions on China's advanced chip sector from 2022 to 2024. Recently, the US announced the initiation...

Tokyo Electron (TEL) aims to increase its revenue share from AI-related semiconductor equipment to approximately 40% by the fiscal year ending March 2026, up from the current 30%...

Shanghai Hua Hong Group, a major wafer foundry in China, has made a surprise change of leadership, replacing Su-xin Zhang with Jian Qin as chairman.

ChangXin Memory Technologies (CXMT), China's leading DRAM manufacturer, has reportedly begun mass production of DDR5 memory, according to market sources.

Lam Research has introduced Dextro, which the company claims is the semiconductor industry's first collaborative robot (cobot) designed to optimize critical maintenance tasks on wafer...

TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced...

While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations...